CN106944619A - A kind of method for manufacturing chemical mechanical polishing pads conditioner discs - Google Patents

A kind of method for manufacturing chemical mechanical polishing pads conditioner discs Download PDF

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Publication number
CN106944619A
CN106944619A CN201610020466.7A CN201610020466A CN106944619A CN 106944619 A CN106944619 A CN 106944619A CN 201610020466 A CN201610020466 A CN 201610020466A CN 106944619 A CN106944619 A CN 106944619A
Authority
CN
China
Prior art keywords
mechanical polishing
chemical mechanical
polishing pads
conditioner discs
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610020466.7A
Other languages
Chinese (zh)
Inventor
杨宗庆
宋健民
王伟东
钱卫
隗海宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Songyang Microelectronic Technology Co Ltd
Original Assignee
Shenzhen Songyang Microelectronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Songyang Microelectronic Technology Co Ltd filed Critical Shenzhen Songyang Microelectronic Technology Co Ltd
Priority to CN201610020466.7A priority Critical patent/CN106944619A/en
Publication of CN106944619A publication Critical patent/CN106944619A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/34Process control of powder characteristics, e.g. density, oxidation or flowability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/36Process control of energy beam parameters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60Treatment of workpieces or articles after build-up
    • B22F10/64Treatment of workpieces or articles after build-up by thermal means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60Treatment of workpieces or articles after build-up
    • B22F10/66Treatment of workpieces or articles after build-up by mechanical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60Treatment of workpieces or articles after build-up
    • B22F10/68Cleaning or washing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A kind of manufacture method of chemical mechanical polishing pads conditioner discs, using increasing material manufacturing mode, i.e. the commonly referred to as mode of 3D printing.Comprise the following steps:The threedimensional model of chemical mechanical polishing pads finishing dish structure is prepared needed for building and is inputted in 3D printing software for editing, two dimensionization processing is carried out after editor, two dimensional slice data is obtained and is conducted into 3D printer computer;The diamond dust that the nickel-containing alloys powder and particle diameter that particle diameter is 0.1~100 μm are 0.1~300 μm is sufficiently mixed and is used as raw material;Set the working process parameter of 3D printer laser fusion system;The sufficient alloy of mixing is taken to be fitted into and spread in metal powder laser melting systems with diamond dust, it is laser sintered according to 3D printer setting program progress successively pointwise under the protection of inert gas;Through past powder, it is heat-treated, cleaning, sandblasting etc. produces chemical mechanical polishing pads conditioner discs to be prepared.

Description

A kind of method for manufacturing chemical mechanical polishing pads conditioner discs
Technical field
The present invention is a kind of chemical mechanical polishing pads (Chemical Mechanical Polishing Pad, CMP Pad) the manufacture method of conditioner discs.
Background technology
Chemically-mechanicapolish polishing (CMP) is manufactured for integrated circuit (IC, Integrated Circuit) A kind of technique.With the raising of the development of semiconductor industry, particularly semiconductor wafer integrated level, to its table The requirement of face finishing is also improved therewith, and chemically mechanical polishing is exactly the technology generally used.Chemical machinery is thrown The polishing pad (Pad) of gloss is usually organic material (such as polyurethanes), and surface is in fibrous or porous Shape structure, is attached on the workbench of rotation, and the chemical grinding liquid that abrasive grains are contained during work is persistently added On polishing pad, workpiece contacts polishing pad with certain pressure and done relative motion, and abrasive grains are to semiconductor die The chemical composition that the workpiece such as piece are played in mechanical abrasive action, lapping liquid plays chemical attack effect, and workpiece exists Chemistry is with mechanical double action, reaching the purpose being polished.
The top surface of chemical mechanical polishing pads is typically that grinding is carried by threadiness or small holes structure Grain, this structure can provide frictional force and be departed from preventing abrasive grains because of the centrifugal force of polishing pad rotation Polishing pad, it is therefore desirable to have measure to keep the performance at the top of polishing pad, maintains fiber to erect or maintain to have as far as possible Sufficient amount of apertured orifice can receive new abrasive grains.And because the grinding from workpiece, lapping liquid is broken The continuous accumulation of bits, the surface of chemical mechanical polishing pads gradually produces air-hole blockage and compression, and surface is hard Change (hardening), become smooth (glazing), it is impossible to carry the abrasive grains in lapping liquid, make polishing Efficiency decline, while workpiece polishing can produce it is uneven.Chemical mechanical polishing pads conditioner discs are exactly for throwing Light pad surface is combed (combing) or cutting (cutting), reaches finishing (dressing) or tune The effect of whole (conditioning), to maintain the surface state of chemical mechanical polishing pads.
Chemical mechanical polishing pads conditioner discs, it is superhard typically using multiple superabrasive particles as finishing sword Abrasive grain, which is coupled in the card of plate-shaped base body, forms working face, the coupling between matrix and superabrasive particles Condensation material has two kinds, and the first material is metal, such as nickel, cobalt, titanium, iron, copper and its alloy, second It is organic bond such as resinae bonding agent to plant material.
At present, the manufacture method of known metallic bond chemical mechanical polishing pads conditioner discs has:Sintering process, Hard solder method, galvanoplastic, organic bond bonding method etc..Sintering process is by superabrasive particles and metal alloy Powder is mixed with certain proportion, be placed on metallic matrix heating make metal alloy powders sintering be mutually bonded and with Superabrasive particles are bonded;Hard solder method is that metal alloy powders shape or sheet solder are placed on metallic matrix, Superabrasive particles are inserted thereon, and heating makes solder fusing and superabrasive particles are welded on matrix; Galvanoplastic are to be put into metallic matrix as anode in electroplate liquid, and superabrasive particles are covered thereon, and energization makes The metal ingredients such as nickel form coating and superabrasive particles are fixed in coating in anodic deposition;Organically combine Agent bonding method is that superabrasive particles are directly bonded to the matrix table solidified in organic material with organic bond On face.
With developing rapidly for 3D printing manufacturing technology, beaten by the 3D printer of various technical embodiments Print output, it is already possible to produce the complex partses of unlike material;3D printing manufacturing technology is flexible because of it Change, customized, rapid shaping produce the plurality of advantages of structural elements, as a kind of great development prospect Increases material manufacturing technology, especially possesses in terms of integrated manufacturing system (IMS) global formation complex partses integral module Peculiar advantage.
The content of the invention
Disc manufacturing method is repaired it is an object of the invention to provide a kind of new chemical mechanical polishing pads.
The method of the present invention is to use increasing material manufacturing mode, the i.e. commonly referred to as mode of 3D printing.
The method of the present invention comprises the following steps:
1) threedimensional model of chemical mechanical polishing pads finishing dish structure is prepared needed for building and 3D is inputted Print software for editing in, after editor carry out two dimensionization handle, obtain two dimensional slice data and by its Import 3D printer computer.
2) by bortz powder that nickel-containing alloys powder that particle diameter is 0.1~100 μm and particle diameter are 0.1~300 μm End is sufficiently mixed as raw material.
3) working process parameter of 3D printer metal powder laser melting systems is set.
4) the sufficient alloy of mixing is taken to load laser sintering metallic powder system, the gold with diamond dust Inert gas is vacuumized or be passed through in category selective laser sintering system, is existed to its interior oxygen content Less than 0.1%.
5) it is laser sintered according to 3D printer setting program progress successively pointwise.
6) through past powder, it is heat-treated, cleaning, sandblasting, that is, preparing chemical mechanical polishing pads needed for obtaining repaiies Whole disk.
In order to save the time of 3D printing, the mode that mixed-powder can be taken to be sintered on metallic matrix. A pre-processed sheet matrix, 3D printing only completes the manufacture of card superstructure.The card top knot Structure, refers to that being used in chemical mechanical polishing pads conditioner discs card combs to pad interface (combing) or cutting (cutting), reach finishing (dressing) or adjust (conditioning) Effect the thrust for having Sharp edge.In the present invention, these thrusts are by metal alloy sintering curing The superhard material particle of bonding is formed.
Brief description of the drawings
Fig. 1 is a kind of Longitudinal cross section schematic of chemical mechanical polishing pads conditioner discs of the inventive method manufacture; Wherein 1 is the plate-shaped base body of stainless steel, and 2 be the superhard material particle of metal alloy sintering curing bonding.
Embodiment
Here is embodiments of the invention:
Example 1. utilizes the processing generation support of Magics software datas --- and RP Tool data slicers import 3D Printer computer;With the Ni alloy powder containing 2% chromium, conduct is sufficiently mixed with superhard material diamond dust Raw material, the size distribution of the Ni alloy powder is 10-25 μm, and the granularity of diamond dust is 20-40 μm, Weight ratio is 4: 6;Nitrogen is filled with, using printing device (EOS M280), laser emitter is Yb-fibre Type, to print power as 500w, speed 3mm3/min is printed a diameter of using laser sintered mode 108mm, thickness is 6mm discoid product, and surface is uniformly distributed at intervals of 0.6mm, and bottom surface is 0.2mm × 0.2mm squares, a height of 0.2mm pyramid shape protrusion, these pyramid projections exist Play cutting edge on conditioner discs.Handled through past powder, annealing, cleaning etc., obtain the chemistry of the present invention Mechanical polishing pad conditioner discs product.
Example 2. uses an a diameter of 108mm, and 304 stainless steel disks that thickness is 6mm are matrix, with A diameter of 0.1~40 μm of nickel chromium triangle iron powder, 5~25 μm of diamond dusts of diameter are used as raw material, weight Than for 2: 8, uniform mixing.Using printing device (EOS M280), laser emitter is Yb-fibre Type;Using the data slicer of Magics Software Create chemical mechanical polishing pads conditioner discs card superstructures, Import 3D printer computer;To print power as 500w, speed 5mm3/min, using laser sintered Mode printed on matrix be evenly distributed in card at intervals of 0.4mm, the bottom surface length of side be 0.15mm just Triangle, a height of 0.1mm triangular pyramid protrusion is handled through past powder, annealing, cleaning etc., obtained The finished product arrived is a kind of chemical mechanical polishing pads conditioner discs of the invention.

Claims (6)

1. a kind of manufacture method of chemical mechanical polishing pads conditioner discs, it is characterized in that:Conditioner discs are with the side of increasing material manufacturing The mode of formula, i.e. 3D printing, passes through 3D printing superabrasive particles and bonding agent on matrix material Material manufacture.
2. chemical mechanical polishing pads according to claim 1 repair disc manufacturing method, it is characterized in that:Will be superhard Abrasive grain is printed upon on matrix material in the way of 3D printing together with combining agent material.
3. chemical mechanical polishing pads according to claim 1 repair disc manufacturing method, it is characterized in that:Superhard abrasive Material particle is diamond, cubic boron nitride, polycrystalline diamond, polycrystal cubic boron nitride, the life of CVD gas phases At least one of long diamond.
4. chemical mechanical polishing pads according to claim 1 repair disc manufacturing method, it is characterized in that:The knot Mixture material include iron, nickel, copper, chromium, titanium, cobalt, one kind of silicon, its two or more mixture, Or two or more alloys, or contain by main component of one of which other elemental compositions mixture or Alloy.
5. chemical mechanical polishing pads according to claim 1 repair disc manufacturing method, it is characterized in that:The base Body material is metal material, ceramic material, one kind of organic polymer material or its mixture.
6. chemical mechanical polishing pads according to claim 1 repair disc manufacturing method, it is characterized in that:Use It is laser metal powder sintering.
CN201610020466.7A 2016-01-07 2016-01-07 A kind of method for manufacturing chemical mechanical polishing pads conditioner discs Pending CN106944619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610020466.7A CN106944619A (en) 2016-01-07 2016-01-07 A kind of method for manufacturing chemical mechanical polishing pads conditioner discs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610020466.7A CN106944619A (en) 2016-01-07 2016-01-07 A kind of method for manufacturing chemical mechanical polishing pads conditioner discs

Publications (1)

Publication Number Publication Date
CN106944619A true CN106944619A (en) 2017-07-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396528A (en) * 2017-08-14 2017-11-24 上海联影医疗科技有限公司 Preparation method in coupled standing wave accelerator tube, while coupled standing wave accelerator tube
CN114502324A (en) * 2019-08-21 2022-05-13 应用材料公司 Additive manufacturing of polishing pads
CN115026289A (en) * 2022-07-20 2022-09-09 华侨大学 Manufacturing method and application of diamond porous grinding block based on 3D printing

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
CN101158039A (en) * 2007-11-21 2008-04-09 南京航空航天大学 Method for preparing coating by laser cladding with squash method fore-put powder
CN102990529A (en) * 2011-09-09 2013-03-27 深圳嵩洋微电子技术有限公司 Two-sided repairing disc of chemical-mechanical polishing pad
CN103264361A (en) * 2013-05-17 2013-08-28 华侨大学 Manufacturing method for abrasive grain tool
US20140061838A1 (en) * 2012-02-17 2014-03-06 Teledyne Scientific & Imaging, Llc Self-aligning hybridization method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
CN101158039A (en) * 2007-11-21 2008-04-09 南京航空航天大学 Method for preparing coating by laser cladding with squash method fore-put powder
CN102990529A (en) * 2011-09-09 2013-03-27 深圳嵩洋微电子技术有限公司 Two-sided repairing disc of chemical-mechanical polishing pad
US20140061838A1 (en) * 2012-02-17 2014-03-06 Teledyne Scientific & Imaging, Llc Self-aligning hybridization method
CN103264361A (en) * 2013-05-17 2013-08-28 华侨大学 Manufacturing method for abrasive grain tool

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Title
房赞: "磨粒排布优化凸出精确可控自由型面截面砂轮制造新工艺基础研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396528A (en) * 2017-08-14 2017-11-24 上海联影医疗科技有限公司 Preparation method in coupled standing wave accelerator tube, while coupled standing wave accelerator tube
CN107396528B (en) * 2017-08-14 2019-08-23 上海联影医疗科技有限公司 While coupled standing wave accelerator tube production method, while coupled standing wave accelerator tube
CN114502324A (en) * 2019-08-21 2022-05-13 应用材料公司 Additive manufacturing of polishing pads
US11965103B2 (en) 2019-08-21 2024-04-23 Applied Materials, Inc. Additive manufacturing of polishing pads
CN114502324B (en) * 2019-08-21 2024-05-03 应用材料公司 Additive manufacturing of polishing pads
CN115026289A (en) * 2022-07-20 2022-09-09 华侨大学 Manufacturing method and application of diamond porous grinding block based on 3D printing
US20240024952A1 (en) * 2022-07-20 2024-01-25 Huaqiao University Manufacturing method of diamond porous grinding block based on 3d printing and application thereof
US12053823B2 (en) * 2022-07-20 2024-08-06 Huaqiao University Manufacturing method of diamond porous grinding block based on 3D printing and application thereof

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Application publication date: 20170714