TW200800504A - Electroplated abrasive tools, methods, and molds - Google Patents

Electroplated abrasive tools, methods, and molds Download PDF

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Publication number
TW200800504A
TW200800504A TW095144571A TW95144571A TW200800504A TW 200800504 A TW200800504 A TW 200800504A TW 095144571 A TW095144571 A TW 095144571A TW 95144571 A TW95144571 A TW 95144571A TW 200800504 A TW200800504 A TW 200800504A
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TW
Taiwan
Prior art keywords
mold
abrasive particles
substrate
pattern
abrasive
Prior art date
Application number
TW095144571A
Other languages
Chinese (zh)
Inventor
Chien-Min Sung
Original Assignee
Kinik Co
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Publication date
Application filed by Kinik Co filed Critical Kinik Co
Publication of TW200800504A publication Critical patent/TW200800504A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Abstract

The present invention provides for a mold that can position and hold abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process. The mold can include an insulating material with a molding surface suitable for holding the abrasive particles in place during this process. Additionally, a method for making an abrasive tool using such a mold is provided, as well as abrasive tools made thereby. In one aspect of this invention, abrasive tools can have abrasive particle tips that are arranged in accordance with a predetermined vertical pattern and/or a predetermined horizontal pattern in a manner that requires little or no post electrodeposition processing.

Description

200800504 九、發明說明: 【發明所屬之技術領域】 本發明係屬於一種(電鍍)研磨工具,尤其指_種(電 鍵)研磨工具以及製造該(電鍍)研磨工具的方法與模具。 因此,本發明係涉及電氣化學、材料科學及物理等領域。 【先前技術】 研磨工具長久以來有著許多應用,包括材料的切割、 鑽、鋸、研磨(Grinding )、雙面研磨(Lapping )、以及200800504 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to an (electroplating) abrasive tool, and more particularly to a (electron) abrasive tool and a method and mold for manufacturing the (electroplating) abrasive tool. Accordingly, the present invention relates to the fields of electrical chemistry, materials science, and physics. [Prior Art] Abrasive tools have long been used in many applications, including material cutting, drilling, sawing, grinding, Lapping, and

拋光等等。研磨工具最常見的形式之一即是在一工具基材 上使用研磨粒子以便實行切割、研磨及拋光等等。 超硬研磨粒子(Superabrasive particles),如鑽石、 聚晶金剛石(P〇lyCryStalline Diainon(i,PCD )、立方氮化 硼(CubicBoronNitride’CBN)及聚晶立方氮化侧(pcBN) 等等,由其極高硬度、原子密度以及高熱傳導率等特性, 已被廣泛使用在削除材料之應用。舉例而言,加工盤、研 磨盤、鋸片、線鋸及鑽頭已皆是將超硬研磨粒子設置於基 材上。 儘官其具有顯著優點,一些問題持續地妨礙了許多已 知超硬研磨工具的效能及使用壽命。舉例而言,超硬研磨 粒子的配置及保存仍然有問題。另外一個問題則是超硬研 磨粒子自基材上所突伸的高度。在許多應用中,令所有粒 =均自基材上突伸至一大致上均等的高度是有益的。在許 夕例子中,均等的粒子高度可幫助將工作負載均勻地分配 5 200800504 在粒子上,且進而提升粒子的保留度。在其他例子中,根 據一預設的垂直高度圖形來將粒子分別突伸至不同的言x 是有益的。 、。又 許多組裝方法’例如焊接、熱壓、滲透,尤其是電錢 等等,已被使用於組裝超硬研磨工具。然而,大多數 法並不能提供-個具備如上所述之超硬研磨粒子配置特性 的工具。此外’為了獲得一個具備適當特性的工作表面, 例如適當的粒子暴露程度,由大多數已知方法所製造的工 具須要後組裝處理。 因此,該技術領域不斷地尋求可允許精確的水平與垂 直:磨粒子配置,並且可達成適當的工作表面而僅需極少 或疋不需後組裝程序的研磨工具及其製造方法。 【發明内容】 因此,本發明係提供數種(電鍍)研磨工具,其具有 :數研磨粒子’該等研磨粒子依據垂直與水平圖二配 且僅而極少或不須後生產程序,本發明並提供製造及 用該研磨工具的方法。本發明並提供作為此製造程序之 一部分的裝詈。 在-方面,係提供一種模具,其用以定位及固定複數 研磨粒子’該等研磨粒子係在—電沉積程序期Μ,以電解 =附加於-導電性基材上,該模可以包含有或為一絕緣 ’該絕緣材料具有—模造表面,該模造表面用以在一 =電沉積期間固定該等研磨粒子,其中該電沉積的材 枓係將研磨粒子固定到該導電性材料上。 200800504 在另一方面,本發明係提供複數製造方法,該製造方 法用以衣造-研磨卫具,該研磨卫係以透過—電沉積材料 將複數研磨粒子結合到一基材上,其中該製造方法包含有 下列步驟:1)暫時性地將㈣研磨粒子固言免到一個如下所 述模具的—模造表面上;2)將該模具定位到-電沉積室中, 且以模造表面面向-基材,#中該等研磨粒子即將以電解 方式附加於該基材上;3)將該等研磨粒子以電解方式,透 過-電沉積材料而附加在基材上;及4)移除該模具。 在 方面本發明係提供複數個可由該等製造方法 製造的研磨工具’此等研磨工具一般包含有一基材,該基 材透過-電沉積材料而結合有複數研磨粒子,該等研磨: 子係分別具有—尖端,該等研磨粒子尖端係依據-預設的 垂直圖形而配置。 下列的實施方式與所參照的圖式將令上述本發明 徵與優點更加清楚。 【實施方式】 在揭露與描述本發明前,閱讀者應了解到本發明並非 侷限在其所揭露的特㈣造、加卫步驟或材料,而是擴大 到相關領域具有通常知識者所能知曉的均等構造、加工步 驟或材料。閱讀者亦應了解到,這裡所使用的用語僅料 描述特定實施例之目的,而非作為限制。 單數形式“一”及“該,,包含了複數的對象,除非上下文 有清楚地作其他的指示。因此,舉例而言,“―研磨工粒子” 7 200800504 • 包含了一個或多個研磨粒子的對象。 定義 在討論及主張本發明時,以下用詞將根據下列所提出 的定義被使用於本發明之中。 文中所使用的絕緣材料(Insulating Material ),,係指 個或複數個材料,其用以透過一方法來形成一模具,該 方去係有效地避免電沉積材料累積於該絕緣材料的一模造 _ 表面上。該絕緣材料可包含非導電性及/或導電性材料。 文中所使用的模造表面(Molding Surface ),,係指該 巴緣材料上的一表面’該表面上可固設有複數研磨粒子。 文中所使用的預没圖形(predetermined pattern ),,係 ^ #研磨粒子或是孔洞的非隨機配置,該非隨機配置可在 組裝—具備該研磨粒子或孔洞的工具或裝置之前,被先行 決定。 文中所使用#水平圖形,,係指研磨粒子或孔洞遍佈於 _ 一個其所設置或所欲設置之表面上的配置。 一文中:使用的“垂直圖形,,係指研磨粒子的外露尖端自 ”或疋卫具基材之卫作表面向上突伸到達之高度的配 置。 文中所使用的“工作表面,,伤扣 ^ 4〇 ^ 衣面係扎一工具或工具基材,在 操作期間,與欲被拋光、研磨 5 或疋磨光(Sanded )的工件 相面對或是相接觸的表面。 文中所使用的“晶格 研磨粒子其他相鄰研磨粒 (Lattice),,係指一水平圖形中, 子的間距相等,或者孔洞與其他 8 200800504 相鄰孔洞的間距相等。 文中所使用的後龟 >儿積程序(p0Sl; Elechodeposition Processing ) ’’係指在傳統方法中,暴露一工具的工作表面 所需要的加工或是研磨。 文中所使用的固定(Holding ),,或“暫時固設 (Temporarily Securing) ’,係指結合(c〇upUng)或是維持 (Supporting )研磨粒子以為了避免研磨粒子自其所相結 合的表面或自維持該研磨粒子的表面脫落或移動。舉例而 言,在某些實施例中,重力足以將研磨粒子結合或維持於 在該表面上。 文中所使用的“樣板(Template ),,係指一具有複數孔 洞的裝置,該裝置用以依據一預設圖形而將研磨粒子定位 於模具上。該樣板中孔洞的配置能控制該預設圖形。使 用日守,该樣板的一侧被定位抵靠在一模具的模造表面,而 鑽石粒子則散佈在整個另一側上。孔洞能被設計讓孔洞僅 _能匹配單一個研磨粒子,且研磨粒子掉落穿過孔洞以接觸 j模造表面。孔洞亦可設計為僅能容納在一特定磨粒尺寸 範圍内的研磨粒子。孔洞内的研磨粒子係與模造表面接觸 以便能固設到該模造表面上。剩餘未固設的研磨粒子則被 移除。接著該樣板可自模具上移除。 文中所使用的“大致上,,,關於確定的性質或環境時, 係指一誤差程度,該誤差程度係充分地微小以無法清楚地 減損該確定的性質或環境。 200800504 士文中所使用的用詞“大約”,與單獨數字或數字範圍相 連時,係指一個稍微高於或低於所連結之實際數值的實際 數字或範圍。 、τ 、、文中所使用的複數物品、結構元件、組成元件及/或 材料等等,為方便起見可被列於一共同列表中。然而,這 些列表應被解釋為··列表中的每一元件皆是獨立且獨特的 =件。因此,此等列表中任何的單獨元件,不可僅僅因為 沒有指示說明該單獨元件與在同列表中的任何其他元件有 斤不同就被解釋為與其他元件大致上均等。 、口、=度、婁i:量及其他數字資料在文中可以範圍形式來表 ^呈現。閱讀者應了解’使用範圍形式僅是為了方便與 ^二故應被彈性地解釋為不僅僅包含為限制該範圍清楚 二述的數予’右位於該範圍之巾的單獨數值及子範圍被揭 :。則该乾圍亦包含了這些被揭露的單獨數值或是子範 不僅!^而言’—數字範圍“大約1到大約5”應被解釋為 該r =含了 ΐ楚敘述的大㉟1到大約5,亦應包含在於 :抑之中的單獨數值及子範圍。因此,該範圍包含了諸 如早獨數值2、3及4命工外闽 等。 及4與子範圍1到3、2到4及3到5等 =樣的法則適用於僅僅敘述單—數值。此外,此一解 應用而不論所敘述之範圍或特性的廣度。 本發明 匕3 了複數個(電鍍)研磨工具的電沉積製造 方法,該等掣抨太^ 手衣&方法係允許根據位於一工具基材上的垂直 10 200800504 與水平圖形來較佳地控制研磨粒子的固設與配置,且該等 方法係僅需極少或不需要該工具工作表面的後電沉積程 序。換言《,工作表面係由電沉積程序本㈣產生。申請 人亦發展出-模具以❹於此製造方法,並發展出複數個 由該製造方法所生產的研磨工具。 請參照第- A到第- e圖,其顯示本發明一模具ι〇。 該模具10可被使詩—電解程細將複數研練子η定 =並固㈣該模具1G的—模造表面心請參照第一 Μ 第-Η圖’其顯示在本發明一實施例中,一電沉積室⑽ 裡使用之模具10戶斤呈現的結構。同樣地,第二Α到第二 c圖顯示了在本發明一實施例中,被使用模具ι〇所呈現 結構的其他例子。Polishing and so on. One of the most common forms of abrasive tools is the use of abrasive particles on a tool substrate for cutting, grinding, polishing, and the like. Superabrasive particles such as diamond, polycrystalline diamond (P〇lyCryStalline Diainon (i, PCD), cubic boron nitride (CubicBoronNitride 'CBN) and polycrystalline cubic nitride side (pcBN), etc. Extremely high hardness, atomic density, and high thermal conductivity have been widely used in the removal of materials. For example, processing discs, grinding discs, saw blades, wire saws, and drill bits have all been used to set superhard abrasive particles. On the substrate, it has significant advantages, and some problems continue to hamper the performance and service life of many known superhard abrasive tools. For example, the configuration and preservation of superhard abrasive particles are still problematic. It is the height at which the superhard abrasive particles protrude from the substrate. In many applications, it is beneficial to have all the particles = protrude from the substrate to a substantially equal height. In the case of Xu Xi, equal Particle height helps distribute the workload evenly across the particles 200800504, and in turn enhances particle retention. In other examples, based on a preset vertical height pattern It is beneficial to project the particles separately to different words. . . . Many assembly methods such as welding, hot pressing, infiltration, especially electric money, etc., have been used to assemble superhard grinding tools. However, large Most methods do not provide a tool with the characteristics of superhard abrasive particles as described above. In addition, 'a tool made by most known methods to obtain a working surface with appropriate characteristics, such as appropriate particle exposure. Post-assembly processing is required. Therefore, the art is continually seeking abrasive tools that can allow precise horizontal and vertical: abrasive particle configurations, and that achieve a suitable working surface with little or no post-assembly procedures and methods of making the same SUMMARY OF THE INVENTION Accordingly, the present invention provides several (electroplating) abrasive tools having: a plurality of abrasive particles that are arranged according to vertical and horizontal figures and with little or no post-production procedures, the present invention A method of making and using the abrasive tool is provided. The invention also provides a mounting as part of this manufacturing process. The invention provides a mold for positioning and fixing a plurality of abrasive particles. The abrasive particles are subjected to electro-deposition, and are electrolyzed to be attached to a conductive substrate. The mold may contain or be one. Insulating 'the insulating material has a molded surface for fixing the abrasive particles during one=electrodeposition, wherein the electrodeposited material fixes the abrasive particles to the conductive material. 200800504 in another In one aspect, the present invention provides a plurality of manufacturing methods for a garment-grinding fixture that bonds a plurality of abrasive particles to a substrate by a permeation-electrodeposition material, wherein the manufacturing method comprises the following Steps: 1) Temporarily temporarily remove (4) abrasive particles from a mold-forming surface of a mold as described below; 2) position the mold into the -electrodeposition chamber, and mold the surface to face-substrate, #中The abrasive particles are to be electrolytically attached to the substrate; 3) the abrasive particles are electrolytically attached to the substrate by electroplating; and 4) the mold is removed. In one aspect, the invention provides a plurality of abrasive tools that can be manufactured by such manufacturing methods. [The abrasive tools generally comprise a substrate that is permeable to an electrodeposited material in combination with a plurality of abrasive particles, the: With a tip, the abrasive particle tips are configured according to a preset vertical pattern. The following embodiments and the drawings referred to will clarify the above-described inventive features and advantages. [Embodiment] Before exposing and describing the present invention, the reader should understand that the present invention is not limited to the specific (four) manufacturing, cultivating steps or materials disclosed therein, but is extended to the relevant fields and known to those having ordinary knowledge. Equal construction, processing steps or materials. The reader should also understand that the terms used herein are for the purpose of describing particular embodiments only and not as a limitation. The singular forms "a", "the", and "the" are meant to include the plural, unless the context clearly indicates otherwise. Therefore, for example, "--grain particles" 7 200800504 • Contains one or more abrasive particles Definitions In discussing and claiming the present invention, the following terms will be used in the present invention in accordance with the definitions set forth below. Insulating Material, as used herein, refers to one or more materials, The method for forming a mold by a method for effectively preventing the electrodeposited material from accumulating on a molding surface of the insulating material. The insulating material may comprise a non-conductive and/or conductive material. Molding surface, refers to a surface on the edge material. The surface can be fixed with a plurality of abrasive particles. The predetermined pattern used in the text, is # abrasive particles or Is a non-random configuration of the holes that can be determined prior to assembly—the tool or device that has the abrasive particles or holes. The term "horizontal graphic" as used herein refers to a configuration in which abrasive particles or pores are spread over a surface on which it is placed or placed. Article: The "vertical pattern, which refers to the exposed tip of the abrasive particles," Or the configuration of the surface of the sturdy surface of the substrate that protrudes upward to reach the height. The working surface used in the article, the wound button ^ 4 〇 ^ the face is tied with a tool or tool substrate, during operation, and Surfaces that are to be polished, ground, or sanded to face or contact surfaces. As used herein, "lattice-grinding particles, other adjacent abrasive grains (Lattice), mean that the spacing of the sub-atoms is equal in a horizontal pattern, or that the holes are equal to the spacing of other adjacent holes of 200800504. > Elechodeposition Processing '' refers to the processing or grinding required to expose the working surface of a tool in a conventional method. The fixation used in the text, or "temporary fixation" Temporarily Securing) ', refers to bonding (c〇upUng) or supporting the abrasive particles in order to prevent the abrasive particles from falling off or moving from the surface to which they are bonded or from the surface of the abrasive particles. For example, in some embodiments, gravity is sufficient to bond or maintain abrasive particles on the surface. As used herein, a "template" refers to a device having a plurality of holes for positioning abrasive particles on a mold according to a predetermined pattern. The configuration of the holes in the template controls the predetermined pattern. Using the Guardian, one side of the template is positioned against the molding surface of a mold, and the diamond particles are spread over the other side. The holes can be designed to allow the holes to match only a single abrasive particle and grind The particles fall through the holes to contact the j-molding surface. The holes can also be designed to accommodate only abrasive particles within a specific abrasive particle size range. The abrasive particles in the holes are in contact with the molding surface to be secured to the molding surface. The remaining unfixed abrasive particles are removed. The template can then be removed from the mold. As used herein, "substantially, with respect to a defined property or environment, refers to a degree of error that is The degree is sufficiently small to clearly detract from the nature or environment of the determination. 200800504 The term "about" as used in the context of a person, when connected to a single numerical or numerical range, refers to an actual number or range that is slightly above or below the actual value of the connection. The plural items, structural elements, constituent elements and/or materials used in the text, τ, and the like, may be listed in a common list for convenience. However, these lists should be interpreted as if each component in the list is an independent and unique component. Accordingly, any individual elements in such a list are not to be construed as being substantially equal to the other elements simply because there is no indication that the individual elements are different from the other elements in the same list. , mouth, = degree, 娄i: quantity and other digital data can be presented in the form of a range. Readers should understand that 'the scope of use is only for convenience and should be interpreted flexibly as not only including the number to clearly limit the scope, but the individual values and sub-ranges of the towel located in the range are revealed. :. The dry perimeter also contains these separate individual values or sub-paragraphs not only! ^'--the numerical range "about 1 to about 5" should be interpreted as the r = the large 351 to the narrative 5, should also include: separate values and sub-ranges. Therefore, the scope includes such values as 2, 3, and 4, and so on. And 4 and sub-ranges 1 to 3, 2 to 4, and 3 to 5, etc. The law of the same applies to the mere description of the single-value. Moreover, this solution applies regardless of the breadth of the scope or characteristics recited. The present invention is directed to an electrodeposition manufacturing method for a plurality of (electroplating) abrasive tools that allow for better control based on vertical 10 200800504 and horizontal graphics on a tool substrate. The mounting and configuration of the abrasive particles, and such methods require little or no post-electrodeposition of the tool working surface. In other words, the working surface is produced by the electrodeposition procedure (4). Applicants have also developed molds for this manufacturing process and developed a number of abrasive tools produced by the manufacturing process. Please refer to the figures -A to -e, which show a mold of the present invention. The mold 10 can be made to determine the number of the plurality of drills η = 固 固 (4) The mold surface of the mold 1G, please refer to the first Μ - Η diagram, which is shown in an embodiment of the present invention, The structure of the mold used in an electrodeposition chamber (10) is 10 kg. Similarly, the second to second c-pictures show other examples of the structure presented by the mold ι in an embodiment of the present invention.

如該等圖式所顯示,該模具1〇包含了一絕緣材料Μ。 此絕緣材料14可有效地避免電沉積材料(Eleetr〇deposited Materials累積在該模造表面18上。在第__f到第一 h 圖以及第_ A到二c圖裡所顯示的例子中,該等研磨粒 子22的尖端42形成為一工具5〇之工作表面49的一部分, 且’在電沉積期間,該等尖端42被固定在該模造表面Μ 而"亥電/儿積材料5 8可被避免累積於該研磨粒子U尖 鈿42及该工具5〇的工作表面49上。 貝知例中,該絕緣材料1 $具有至少一貫穿該絕 =材料14的孔洞26。請參照第一 a到第一 e圖,在另一 貫施例中’該絕緣材才斗14纟有複數個貫穿該絕緣材料η 的孔,同26。該等孔洞26可供一電解液30自一位於模具1〇 11 200800504 外側的區域3 4循環从#、A y g 、僱衣地牙過該杈具10到達該工具基材54 " ,以便有效地電沉積該用以將研磨粒子22固設 ^工具基材54上的材料。由於此循環對於維持在電沉積 處之電解液的離子(圖中去):貧0 、 k S中未不)/辰度疋必須的,故該循環 是有益的。在第—G、第一G、第二B及第二C圖的例子 中,電沉積處係在該工具基材54的表面%上。As shown in the figures, the mold 1〇 contains an insulating material crucible. This insulating material 14 can effectively prevent the electrodeposition material (Eleetr〇 deposited material from accumulating on the molding surface 18. In the examples shown in the __f to the first h-th and the _A to c-c drawings, The tip end 42 of the abrasive particle 22 is formed as part of the working surface 49 of a tool 5', and 'the tip 42 is fixed to the molding surface during electrodeposition, and the "Hai/Nuhe material 58 can be Avoid accumulating on the working surface 49 of the abrasive particle U-tip 42 and the tool 5〇. In the example, the insulating material 1 has at least one hole 26 extending through the material 14. Please refer to the first a to In the first embodiment, in another embodiment, the insulating material 14 has a plurality of holes penetrating the insulating material η, and the same holes 26. The holes 26 are provided for the electrolyte 30 from the mold 1〇11 200800504 The outer region 3 4 loops from #, A yg , the clothing teeth through the cookware 10 to the tool substrate 54 " to effectively electrodeposit the abrasive particles 22 to secure the tool substrate 54 The material above. Because of this cycle, the electrolyte is maintained at the electrodeposition. (FIG go): poor 0, k S does not) / e of the piece goods to be, so the cycle is advantageous. In the examples of the -G, the first G, the second B, and the second C, the electrodeposition is on the surface % of the tool substrate 54.

在-只細例中,該等複數孔洞26可依據一預設圖 形來配置。舉例而t,該預設圖形可為-晶格,如第—A 與第-d㈣示。該晶格圖形有助於均勾地分佈電解液3〇 的離子到基材54 _h。均勾的離子分佈有助於將電沉積材 料58均勻地建立遍佈在該工具基材M的表面上,如此則 有助於以均勻強度將研磨粒子固設。 在其他實施例中,該複數孔洞26可被配置以讓特定 區域發生較多的電沉積。舉例而言,第二B圖顯示了該等 孔洞26位於該模具的複數凹部。靠近在孔洞26處有較多 的電解液離子,以導致有較多的電沉積材料58形成於該 處σ 該絕緣材料14可以多種方法形成。在一實施例中, 該絕材料14可由一樹脂所形成。舉例而言,該樹脂材料 可為一人造樹脂或一聚合材料,例如聚亞醯胺 (Polyimide)。該樹脂材料亦可包含環氧化物(Epoxies )、 漆(Lacquers)、亮光漆(Vanishes)及其混合物。此外, 該樹脂材料可為一橡膠材料,並包含自然與人造橡膠,例 如苯乙烯一 丁二婦(Styrene-Butadiene )、聚氯丁烯橡膠 12 200800504 (Polychloroprene Elastomers ) 、氣 橡膠 (Fluoroelastomers )、乙烯一丙烯一二烯三元共聚物 (Ethylene Propylene Diene )、亞硝酸鹽橡膠(NitrileIn a detailed example, the plurality of holes 26 can be configured in accordance with a predetermined pattern. For example, t, the preset graphic may be a - lattice, such as -A and -d (d). The lattice pattern helps to uniformly distribute the ions of the electrolyte 3〇 to the substrate 54_h. The uniform ion distribution helps to uniformly build the electrodeposited material 58 over the surface of the tool substrate M, thus helping to fix the abrasive particles with uniform strength. In other embodiments, the plurality of holes 26 can be configured to cause more electrodeposition in a particular area. For example, Figure 2B shows the holes 26 in the plurality of recesses of the mold. There are more electrolyte ions near the hole 26 to cause more electrodeposited material 58 to be formed there. The insulating material 14 can be formed in a variety of ways. In an embodiment, the material 14 can be formed from a resin. For example, the resin material may be an artificial resin or a polymeric material such as Polyimide. The resin material may also contain epoxides (Epoxies), lacquers (Lacquers), varnishes (Vanishes), and mixtures thereof. In addition, the resin material may be a rubber material and comprises natural and synthetic rubber, such as Styrene-Butadiene, Polychloroprene Elastomers, Polyuroprene Elastomers, Fluoroelastomers, Ethylene. Ethylene Propylene Diene, nitrite rubber (Nitrile)

Elastomers) ’如丁腈橡膠(Buna-N)及NBR橡膠、聚石夕 氧烧基(P〇lysil〇xanes)、聚異丁烯(p〇lyis〇butylenes) 及氨基鉀酸酯(Urethanes) 〇 在其他實施例中,只要該絕緣材料14有效地或大致 上避免該電沉積材料58形成於該模造表面18,該絕緣材 料14可包含導電元件。舉例而言,該絕緣材料丨4可為一 包覆有絕緣漆(圖中未示)的不鏽鋼基材(圖中未示)。 該絕緣材料14亦可包含一模造表面18,該模造表面 1 8,係在一電沉積材料58進行電解沉積而將研磨粒子u 固疋到一導電基材54 (例如工具基材54 )表面%上時, 用於固定該研磨粒+ 22。該模具1σ可以多種方式固定該 如鑽石粒子等等的研磨粒子22。舉例而言,在模造表㈣ ^可黏著一黏著材料38以固定該研磨粒子22。該黏著材 =38可用於獨立配置各個研磨粒子η。其他固^研磨粒 乂 22的方法可包含磁力、摩擦力及重力等等。舉例而言, 磨粒…n 可包含有複數溝槽以供該等研 “拉子摩掭固定於溝槽之中。 請參照第一 E圖,在一杳# 7丨山 ..π 在κ轭例中,該等研磨粒子22 係被固定以致於直接接觸 模造表面的形狀可控制—對二8有"地’透過配置 喑夂日一 ⑮审J賴到-工具5 0的垂直圖形6 2。 0月荟,¾弟二A到箆- r罔 血,, 一圖,舉例而言,該模造表面可被配 13 200800504 置為具有一與一垂直圖㈣倒的形狀以便對應一工具基材 54上的研磨粒子。 該模造表面18形狀本身可適用於研磨工具5〇的許多 應用。舉例而言,該模造表面可大致上呈平坦(如第一 A 到第-G圖所示)、凹狀或凸狀’或該模造表面可同時包 含複數凹部與凸部(如第二A與第二B圖)。在另一個對 化學機械拋光(Chemical Mechanical p〇lishing,CMp)特 別有用的例子中,該模造表面的凹部可具有大約i/i〇〇〇的 斜率或是大約1/1000的凹度。在此最後一個例子中,可令 一拋光工具的垂直圖形62具有一凸出形狀,該凸出形狀 具有約1/1000的斜率,此乃CMp應用所通常要求的條件。 此外,在某些以研磨粒子22直接接觸模造表面18的 K轭例中,形成一工具工作表面49之一部分的研磨粒子 尖‘ 42可依據一預設的垂直圖形而設。 抛物的均句配置及良好完工品質…卜,此可允許被抛: 物具有特殊的配置圖形。 在某些實施例之中,研磨粒子22可依據一預設的水 平圖形而固定在該模造表面18上。因此,該工具基材Μ 表面5 6上的研磨粒子間的間距得以被控制。這樣的控制 可具有一些益處。舉例而言,被控制的研磨粒子間距,可 透過減少過度的摩擦力(或拖良力)以及減少所產生的熱 月b來增加效能。在某些實施例甲,須在工具表面上規則地 分佈該等研磨粒子。為達成此等應用,該等研磨粒子可依 據一晶格圖形而固定在該模造表面上。 14 200800504 該等研磨粒子可透過各種技術,依據一預設的水平圖 形來定位於該模造表面上。舉例而言,該等研磨粒子可個 別設置在模造表面上。或者,可使用一樣板(如上述所定 義的)來更有效率地將研磨粒子設置在該模造表面上。其 他的方法可使用轉印帶或其他轉印媒介,研磨粒子依據一 預設的水平圖形而暫時地設置在該轉印帶上,而後轉印到 該模造表面上。 在本發明一實施例中,該等研磨粒子22可依據一與 孔洞26圖形互補的預設圖形來固定在該模造表面18上。 舉例而言,該等研磨粒子與孔洞可分別依據如第一 D圖所 示的各自晶格圖形而配置。有益地,&等相互補的圖形可 令電解液30以大致上相等的離子濃度電沉積在各研磨粒 子周圍。因此,分別固定各研磨粒子之電沉積材料58的 量大致上相等。此有助於透過分配大致上相等的工作負載 到各研磨粒子上來給研磨粒子最大的保留度。 在其他實施例中,該等研磨粒子22可依據一圖形來 固定在該模造表面18 ±,該圖形係令該模造表面的至少 一特定區域上的研磨粒子分佈密度較高,且高於模造表面 其餘區域的研磨粒?分佈密度。此圖形在CMP的應用中 特別有用。舉例而言’可令一盤狀研磨工具的周緣上具有 -較高的研磨粒子分佈密度。盤狀研磨工具的周緣旋轉速 度高於巾心、,且在該#狀工具的尖端處有較大的壓力。申 請人於2002 S3月27日申請的美國第1〇/1〇9,531號專利 15 200800504 申請案以及於2004年9月29 B由二主λλ、’ d 日申请的吴國第10/954,956 號專利申請案揭示了其他的研磨粒子圖形與配置,該等研 磨粒子與配置係整合在本文中而作為參考案。 在本發明的另一方面,择担讲 係&供一用以製造研磨工具50 的‘造方法’其中該研磨工罝參 /、係透過一電沉積材料58來 將複數研磨粒子22結合到—基材54上。在一初始步驟中, 複數研磨粒子可暫時地固設 又在杈具10的模造表面18 上’如文中所述。接著,讀媪 杈具與破固設的研磨粒子可被 設置於一電沉積室1〇〇令, 立以杈4表面面向基材。接下 來’將—材料電沉積於基材54的表面56上,线等研磨 粒子透過電沉積材料以電解方式附加於該基材上。該模且 可被移.除,以露出一整個或立 、 Βϊ A人 玉1刀的研磨工具,該研磨工且 則包s 了基材以及附加在基材表面的研磨粒子。 、 在一例子中,該等研磨4 研保粒子22可透過一上述的黏著 材料3 8來固設在模且i 〇 其从^ 的杈造表面18上。透過該面向 材上,直到研f心4 58能射絲形成於該基 且』研总叔子的一部分被覆蓋為止。該電沉 能夠將研磨粒子更堅固妯 、材枓 u固地附加在該黏著材料上,且因此, 可輕易地移除該模具以露出研磨粒子的災端。 在只施例中,該基材54可為—導電性材料,如不 鐵鋼。該基材本身作為一工具本體(圖中未示)。不 該基材可經由—方法而稍後才固設在1具本體上: 尸2本發明另—實施例中,該電沉積㈣58可為-金 V…例如-金屬或一金屬組成材料。舉例而言,該電 16 200800504 :積材料可為金屬,如鎳、鉻、銅、鈦、鎢、錫、鐵、銀、 金、短、鎂、鋅、鋁、鈕、其合金或是其混合物。該金屬 組成材料可為一包含有至少一種上述金屬的組成物。 在本發明另一方面,係提供一藉由上述方法所製造的 研磨工具50。該研磨工具包含有一基材54,複數研磨粒 子22透過電沉積材料58而結合到該基材上。該等研 磨,子可的尖端42可依據一預設垂直圖形而配置。此外,Elastomers) 'Buna-N and NBR rubber, P〇lysil〇xanes, p〇lyis〇butylenes and Urethanes 〇Others In an embodiment, the insulating material 14 may comprise a conductive element as long as the insulating material 14 effectively or substantially prevents the electrodeposited material 58 from being formed on the molding surface 18. For example, the insulating material crucible 4 may be a stainless steel substrate (not shown) coated with an insulating varnish (not shown). The insulating material 14 can also include a molding surface 18 that is electrolytically deposited by an electrodeposited material 58 to solidify the abrasive particles u to a surface of a conductive substrate 54 (eg, tool substrate 54). When used, it is used to fix the abrasive particles + 22. The mold 1σ can fix the abrasive particles 22 such as diamond particles or the like in various ways. For example, in the molding table (4), an adhesive material 38 may be adhered to fix the abrasive particles 22. The adhesive = 38 can be used to independently arrange the individual abrasive particles η. Other methods of solidifying the abrasive particles 22 may include magnetic force, friction, gravity, and the like. For example, the abrasive grains...n may include a plurality of grooves for the purpose of the "sandwich" fixed in the groove. Please refer to the first E map, in a 杳#7丨山..π in κ In the yoke example, the abrasive particles 22 are fixed so that the shape of the direct contact molding surface can be controlled - for the second 8 having a "ground" configuration, the next day, the vertical pattern 6 of the tool 50 2. 0月荟, 3⁄4弟二A to 箆-r罔 blood, a picture, for example, the molded surface can be assigned 13 200800504 to have a shape with a vertical figure (four) inverted to correspond to a tool base Abrasive particles on the material 54. The shape of the molding surface 18 itself may be suitable for many applications of the abrasive tool 5. For example, the molding surface may be substantially flat (as shown in Figures A through G), The concave or convex shape or the molding surface may include a plurality of concave portions and convex portions (such as the second A and second B patterns). Another example that is particularly useful for chemical mechanical polishing (CMp). The recess of the molding surface may have a slope of about i/i 或是 or about 1 Concavity of /1000. In this last example, the vertical pattern 62 of a polishing tool can have a convex shape with a slope of about 1/1000, which is a condition generally required for CMp applications. Moreover, in some K yoke examples in which the abrasive particles 22 are in direct contact with the molding surface 18, the abrasive particle tip '42 forming part of a tool working surface 49 can be provided in accordance with a predetermined vertical pattern. And good finish quality... This allows for being thrown: the object has a special configuration pattern. In some embodiments, the abrasive particles 22 can be attached to the molding surface 18 in accordance with a predetermined horizontal pattern. The spacing between the abrasive particles on the surface of the tool substrate 5 5 can be controlled. Such control can have some benefits. For example, the controlled spacing of the abrasive particles can reduce excessive friction (or drag). And reducing the heat cycle b produced to increase performance. In some embodiments, the abrasive particles must be regularly distributed on the surface of the tool. To achieve such applications, the abrasive particles Fixing on the molding surface according to a lattice pattern. 14 200800504 The abrasive particles can be positioned on the molding surface according to a predetermined horizontal pattern by various techniques. For example, the abrasive particles can be individually set. On the molding surface. Alternatively, the same plate (as defined above) can be used to more effectively place the abrasive particles on the molding surface. Other methods can use a transfer belt or other transfer medium, and the abrasive particles are based on A predetermined horizontal pattern is temporarily disposed on the transfer belt and then transferred onto the molding surface. In an embodiment of the invention, the abrasive particles 22 may be preset according to a pattern complementary to the hole 26 A graphic is attached to the molding surface 18. For example, the abrasive particles and the holes can be configured according to respective lattice patterns as shown in Fig. 1D, respectively. Advantageously, the &complementary pattern allows electrolyte 30 to be electrodeposited around each abrasive particle at substantially equal ion concentrations. Therefore, the amounts of the electrodeposition materials 58 that respectively fix the respective abrasive particles are substantially equal. This helps to maximize the retention of the abrasive particles by distributing substantially equal working loads onto each of the abrasive particles. In other embodiments, the abrasive particles 22 can be attached to the molding surface 18 ± according to a pattern that causes the abrasive particles on the at least one specific region of the molding surface to have a higher density of distribution and higher than the molding surface. Abrasive grains in the rest of the area? Distribution density. This graphic is especially useful in CMP applications. For example, it is possible to have a higher abrasive particle distribution density on the periphery of a disc-shaped abrasive tool. The disc-shaped grinding tool has a peripheral rotation speed higher than that of the core, and there is a large pressure at the tip end of the #-shaped tool. Applicant's US Patent No. 1/1〇9,531, Patent No. 15 200800504, filed on March 27, 2002, and U.S. Patent No. 10/954,956, filed on September 29, 2004 by the two main λλ, 'd days Other abrasive particle patterns and configurations are disclosed in the application, which are incorporated herein by reference. In another aspect of the invention, an alternative method is used for manufacturing a grinding tool 50, wherein the abrasive material is bonded to a plurality of abrasive particles 22 through an electrodeposited material 58. - on the substrate 54. In an initial step, the plurality of abrasive particles can be temporarily secured to the molding surface 18 of the cookware 10 as described herein. Next, the read 杈 cookware and the broken abrasive particles can be placed in an electrodeposition chamber 1 with the surface of the 杈 4 facing the substrate. Next, the material is electrodeposited on the surface 56 of the substrate 54, and abrasive particles such as wires are electrolytically attached to the substrate through the electrodeposited material. The mold can be removed to expose an entire or vertical, ΒϊA-Jade 1 knife grinding tool, which in turn encloses the substrate and the abrasive particles attached to the surface of the substrate. In one example, the abrasive 4 abrasive particles 22 are affixed to the mold and through the coated surface 18 of the mold through a bonding material 38 as described above. Through the facing material, until the grinding heart 4 58 can be formed on the base and a part of the general uncle is covered. The electrode sink is capable of reinforcing the abrasive particles more firmly, and the material is fixedly attached to the adhesive material, and therefore, the mold can be easily removed to expose the catastrophic end of the abrasive particles. In the only embodiment, the substrate 54 can be a conductive material such as a non-ferrous steel. The substrate itself acts as a tool body (not shown). The substrate may not be fixed to a body by a method later: In the other embodiment, the electrodeposition (4) 58 may be - gold V ... for example - a metal or a metal constituent material. For example, the electricity 16 200800504: the material may be a metal such as nickel, chromium, copper, titanium, tungsten, tin, iron, silver, gold, short, magnesium, zinc, aluminum, a button, an alloy thereof or a mixture thereof . The metal constituent material may be a composition comprising at least one of the above metals. In another aspect of the invention, an abrasive tool 50 made by the above method is provided. The abrasive tool includes a substrate 54 to which a plurality of abrasive particles 22 are bonded by electrodeposition material 58. The grinding, sub-tips 42 can be configured in accordance with a predetermined vertical pattern. In addition,

»亥等研磨粒子的一部分可外露於電沉積材料之1卜而不被電 沉積材料所覆蓋。 *舉例而言,該等研磨粒子22可被設定於一自該基材 上突伸的均等高度或大致上均等的高度。該垂直圖形亦可 :狀凹狀、或同時具有複數凸狀區域與凹狀區域。 、此外,^亥等研磨粒子22可根據一預設水平圖形而配 Τ於忒基材上。舉例而f,該等研磨粒子可依據一上述的 曰。曰格而配置。料研磨粒子可經由配置以令基材上一特定 品或的研磨粒子分佈密度較高,且高於該基材上其餘區域 的研磨粒子分佈密度。此等垂直與水平圖形具有許多如上 所述的優點。 小在本I明其他實施例中,一研磨工具50係可僅需極 ,不而要該工具之工作表面的後電沉積程序。在此實施 例中’電沉積材料58形成在該工具的基材54上,且不會 =該工具的卫作表Φ 49已完成之後才形成在該已完成的 表面49上。因此,該已完成的工作表面並不需如其 傳、先方法般,遇需要加工來令研磨粒子的尖端42外露。 17 200800504 此有助於避免因整修該研磨工具工作表面的衝擊而對研磨 粒子造成傷害。 範例 為了讓本發明能夠被更加了解,以下將提供數個範 例。惟該等範例並非對本發明的範疇加以限制。 範例 1 : CMP 整修器(CMP Pad Dresser )A part of the abrasive particles such as Hai may be exposed to the electrodeposited material without being covered by the electrodeposited material. * For example, the abrasive particles 22 can be set to a uniform height or substantially equal height that protrudes from the substrate. The vertical pattern may also be concave or have a plurality of convex regions and concave regions. In addition, the abrasive particles 22 such as ^hai can be attached to the base material according to a predetermined horizontal pattern. For example, f, the abrasive particles can be based on one of the above enthalpy. Configurable. The abrasive particles can be configured to have a higher density of distribution of a particular article or abrasive particles on the substrate and a higher density of abrasive particles than the rest of the substrate. These vertical and horizontal patterns have many of the advantages described above. In other embodiments of the present invention, an abrasive tool 50 can only require a pole and does not require a post-electrodeposition procedure of the working surface of the tool. In this embodiment, the electrodeposited material 58 is formed on the substrate 54 of the tool, and does not form on the finished surface 49 after the tool's table Φ 49 has been completed. Therefore, the finished work surface does not need to be processed to expose the tip 42 of the abrasive particles as it is. 17 200800504 This helps to avoid damage to the abrasive particles due to the impact of refurbishing the working surface of the abrasive tool. EXAMPLES In order to make the present invention more understandable, several examples will be provided below. However, such examples are not intended to limit the scope of the invention. Example 1 : CMP Dresser (CMP Pad Dresser)

一為聚亞醯胺層(lmm厚度)的模具係被壓印以具有 複數個依據一晶格圖形配置的孔洞。各孔洞中心與其他相 评孔洞中〜具有一 〇.7mm的間距,且每個孔洞具有〇 的直徑。該聚亞醯胺層的一表面上(例如模造表面)係塗 佈有一壓克力(聚合物)黏著劑(5〇micr〇n厚度)^在模 造表面上係附加有複數個具備1〇〇/12〇粒度(mesh)的鑽 石磨粒各鑽石磨粒係分別位於周圍四個相鄰孔洞的中心 處。該被鑽石所覆蓋的模造表面係鄰接設置在一盤狀的不 鏽鋼基材(具有108mm直徑及65麵厚度)上。該等鑽 石磨粒係位於模造表面與基材之間。該模具及基材係位於 -塑膠(PVC)環48之中以便能在電解程序之中將模具及 基材固定在-起。該基材係接觸一陰極。電解液係為硫化 錄溶液。該塑膠環、模具及基材係浸人位於-PVC芦之中 的電解液,該PVC層用於封閉該電解液。電解作用進行以 7 ’桌i儿積在4基材上。電解作用持續直到錄覆蓋了將近 =約平=2^3、的鑽石磨粒尺寸。該聚亞酿胺模具接著被移 丨示以便得到該透過雷^>接自 積鎳而附加有鑽石磨粒的基材。 18 200800504 範例2 如下所述而製造三十個模具: 母模具係为別由一具有大約120mm直徑與大約 120micron厚度的不鏽鋼盤體所形成。各盤體係以平版印 刷方式被蝕刻而形成有複數孔洞,該等孔洞係依據如下所 述的晶格圖形而配置。該等孔洞係分佈於一位在各盤體中 心處上而具有約l〇〇mm直徑的圓型區域之中,其餘在各盤 • 體上鄰接盤體周緣而具有大約20mm寬度的區域則不具有 孔洞。測量相鄰孔洞間之近似中心點的間距(即孔洞間 距),一些盤體具有如下的孔洞間距·· 1 ·十個盤體具有大約800micron的孔洞間距,每個孔 洞直控大約400mircori。 2·十個盤體具有大約6〇〇micron的孔洞間距,每個孔 洞直控大約300mircon。 ^— 3·十大約400micron的孔洞間距,每個孔 _ 洞直徑大約200mircon。 母個盤體上塗佈有亮光漆、橡膠或是塗佈有惰性材料 或是絕緣材料以便增進其電絕緣性質。然而,在某些應用 中模具本身為低導電性或是非導電性材料,故上述的塗佈 步驟則可作為非必要的選用性步驟。在某些例子中,當研 磨粒子為絕緣時(如鑽石粒子),該不鏽鋼盤體或是其他 導電性盤體與一陰極基板可被中介的研磨粒子所隔離而藉 此將該盤體絕緣。 藉由使用上述的模具,下列的程序可用以製造一鑽石 19 200800504 整修器(Diamond Pad Conditioner): 1.在各模具的兩側上塗佈有一黏著層,且每一侧皆組 裝有-研磨粒子樣板。該等研磨粒子樣板受到配置及選擇 以適當地容納具備預定尺寸的研磨粒子,並允許該等研磨 粒子黏著在該對應樣板之模具的孔洞之間(換言之,各樣 板中的各孔洞係被配置而與模具中的孔洞呈互補配置,以 確保研磨粒子將會黏著於模具表面±而不A落入穿過模具 ^ 的孔洞。) 2·該模具與樣板組件係以至少一個結合榫來穿設該组 件中各元件上所貫穿形成的相對應結合孔,以固定該組 2。然而,應注意的是,其他的機構,如夾鉗、黏著劑等 等亦可用於結合該組件中的模具與樣板。 、一 3_將具適當尺寸的鑽石粒子(Diam〇nd Inn〇vati〇n 5斤衣的MBG-660 )分別設置在樣板的孔洞中以令每 一龍具表㈣研磨粒 ▲ 子。 ~ ---------- 4.透過翻轉、振動、搖晃各模具/樣板組件等方式來 矛夕除多餘的鑽石粒子。 S’私★各杈具上的樣板以將肖等研磨粒子依據樣板圖 =而黏著在該模具表面上4某些例子中,樣板圖形可令 。磨粒子刀別位於模具上相對應四個相鄰穿孔的中心。 eg 6.將各模具置t設置於二具大約1〇〇mm直徑與大約 與義厚纟的不鏽鋼基材之間’卩令研磨粒子夾設於模具 門由於研磨粒子的尺寸變動幅度微小,可能的 20 200800504 話只有某些大尺寸的研磨粒子會接觸該基材。 7.在各模具的外周緣分別壓設有一重鋼環以確保在電 沉積程序期間模具不會發生移動、平移或是變形等等。在 某些方面,該重鋼環實際上可些微地彎曲模具的周緣以在 模具的各側上形成有凹部。該凹部的斜邊可以此機構稍作 控制’在某些方面,該斜率可為大約1/1〇⑼。如此可令該 基材工作表面上的鑽石粒子略低於(大約5〇micr〇n)工具 成品中基材的中心。 8 ·將各模具/基材組件置於一塑膠架的固定孔令。該 等基材的基部係連接到一電鍍槽的陰極上。該等模具/基 材組件係被硫化鎳電解溶液(即設置於電解液槽或缸中) 所覆蓋,且當該基材通電時,鎳離子減少而鎳金屬沉積於 «玄基材上。當在基材上形成一鎳層時,鎳層向該模具增長, 且附加於該模具的研磨粒子最終會被鎳層所包覆且以一選 —-鎳層中。研磨粒唐可由該程 • 序的操作者所控制。在一方面,該鎳層的深度可為^ 基板之間距離的大約i/2到2/3。由於該電解溶液可循環地 流過該模具的穿孔,因此可令該鎳層均勻且快速地形成完 畢。 9·該模具因中介的絕緣鑽石粒子與選用的亮光漆塗層 或其他絕緣材料而無法過電,故鎳不會沉積在該模具或是 罪近核造表面的鑽石粒子部位上。 10 · —旦鎳層形成完畢’將該研磨工具與模具自電梦 溶液移出,且相互分離以便露出該研磨工具的模造表面。 21 200800504 該模具則可重複使用。 由於該鎳層自基材向模具增長,且由於該增長程序造 成研磨粒子附加到該基材上,故最後研磨工具成品上外露 鑽石粒子尖端的縱斷面外觀會受到該模具模造表面的外形 所影響。以此方式,該等鑽石粒子尖端可根據該最後研磨 工具成品之工作表面上的一預設垂直圖形而配置。此外, 由於本程序的性質,研磨工具成品不需要透過後組裝完結 Φ 私序或工作來70成。換言之,在某些方面,一旦鎳層形成 完畢且該研磨工具自電鍍槽移出,即已同時完成了 一個可 供使用的研磨工具成品。 當然,閱讀者應了解的是上述範例僅供說明本發明原 理的應用。在不違背本發明範疇及精神的前提下,本案所 屬技術領域熟習該項技藝者可做出多種修改及不同的配 置,且依附在後的申請專利範圍則欲涵蓋這些修改與不同 -——中目前被視為^實用且較佳 _ 之實施例的細節已被如上揭露時,對於熟習該項技藝者而 a,可依據本文中所提出的概念與原則來作出多種包含了 尺寸、材料、外形、形態、功能、操作方法、组裝及使用 上的改變而不受限制。 【圖式簡單說明】 第一A〜一 c圖係本發明製造(電鍍)研磨工具的一 系列步驟示意圖。 第一 A圖係本發明一模具實施例的底視圖,其顯示乾 模具的模造表面。 22 200800504 第一 B圖係本發明一實施例沿第一 A圖A — A線段的 咅*J視圖。 第一 C圖係第一 B圖的剖視圖,其顯示本發明一實施 例中’黏著塗布層:設置於模具之模造表面。 第一 D圖係本發明一實施例模具的底視圖,其顯示在 模造表面上的研磨粒子配置。 第- E圖係第—D圖的剖視圖,其顯示本發明—實施 例中’在模造表面上的研磨粒子配置。 # —弟-F圖係-電沉積室的部分剖視圖,其顯示本發明 /實施例的模具與工具基材之方向。 a第一 G圖係第—Μ的部分剖視圖,其顯示本發明-f施例中,研磨粒子透過_電沉積材料結合到基材上。 圖係本發明—實施例之工具的剖視圖。 弟-Α〜二C圖係本發明另一實 法的一系列步驟示意圖。 〗衣仏研曆工具方 第 ———— -- +主二ί 只方也例拉具剖面圖,盆顯示Μ 造表面上的研磨粒子配置。 j w 口 、、員不杈 第二B圖係第二A圖的 施例中,研磨粒子透過—乂視圖,其顯示本發明另-實 合。 i,儿積材料而與工具基材相結A mold having a polyimide layer (lmm thickness) is embossed to have a plurality of holes arranged in accordance with a lattice pattern. The center of each hole has a pitch of 〇.7 mm in the other holes, and each hole has a diameter of 〇. A surface of the polyamidamine layer (for example, a molding surface) is coated with an acrylic (polymer) adhesive (5 〇 〇 〇 厚度 thickness) ^ is attached to the molding surface with a plurality of 〇〇 /12〇Mesh diamond abrasive grains Each diamond abrasive grain system is located at the center of four adjacent holes. The molded surface covered by the diamond was placed adjacent to a disk-shaped stainless steel substrate (having a diameter of 108 mm and a thickness of 65 faces). The diamond abrasive particles are located between the molding surface and the substrate. The mold and substrate are located in a plastic (PVC) ring 48 to hold the mold and substrate together during the electrolysis process. The substrate is in contact with a cathode. The electrolyte is a sulfide recording solution. The plastic ring, the mold and the substrate are impregnated with an electrolyte located in the -PVC reed, and the PVC layer is used to seal the electrolyte. The electrolysis was carried out on a 4 substrate in a 7 Å table. The electrolysis continued until the size of the diamond abrasive grain covering the near = about flat = 2^3 was recorded. The polyamidamine mold is then transferred to obtain the substrate through which the permeation flux is attached to the nickel and the diamond abrasive particles are attached. 18 200800504 Example 2 Thirty molds were fabricated as follows: The master mold was formed from a stainless steel disk having a diameter of about 120 mm and a thickness of about 120 micron. Each of the disk systems is etched by a lithographic pattern to form a plurality of holes which are arranged in accordance with a lattice pattern as described below. The holes are distributed in a circular area having a diameter of about 10 mm at the center of each disk, and the rest is adjacent to the circumference of the disk and having an area of about 20 mm in width. Has holes. The spacing between the approximate center points between adjacent holes (i.e., the hole spacing) is measured. Some of the disks have the following hole spacings. · Ten disks have a hole spacing of about 800 micron, and each hole is directly controlled by about 400 mircori. 2. Ten discs have a hole spacing of approximately 6 〇〇 micron, each hole being directly controlled by approximately 300 mircon. ^—3·10 The hole spacing of approximately 400 micron, each hole _ hole diameter is approximately 200 mircon. The mother disc is coated with varnish, rubber or coated with an inert material or an insulating material to enhance its electrical insulating properties. However, in some applications the mold itself is a low conductivity or non-conductive material, so the coating step described above can be used as an optional step. In some instances, when the abrasive particles are insulated (e.g., diamond particles), the stainless steel disk or other conductive disk is isolated from the cathode substrate by intervening abrasive particles to thereby insulate the disk. By using the mold described above, the following procedure can be used to make a diamond 19 200800504 Diamond Pad Conditioner: 1. Apply an adhesive layer on both sides of each mold, and assemble the abrasive particles on each side. Template. The abrasive particle templates are configured and selected to properly accommodate abrasive particles having a predetermined size and allow the abrasive particles to adhere between the holes of the mold of the corresponding template (in other words, the holes in each of the templates are configured Compensate with the holes in the mold to ensure that the abrasive particles will adhere to the mold surface ± without A falling into the hole through the mold ^). 2. The mold and the template assembly are threaded with at least one bond A corresponding bonding hole formed in each of the components in the assembly to fix the group 2. However, it should be noted that other mechanisms, such as clamps, adhesives, etc., may also be used in conjunction with the molds and templates in the assembly. , a 3_ diamond particles of appropriate size (Diam〇nd Inn〇vati〇n 5 kg clothing MBG-660) are placed in the holes of the sample to make each dragon table (four) abrasive particles ▲ sub. ~ ---------- 4. Remove excess diamond particles by flipping, vibrating, shaking each mold/template assembly. S'Private★A sample on each cookware to adhere the abrasive particles such as Xiao to the surface of the mold according to the pattern diagram. 4 In some examples, the template pattern can be used. The abrasive particle cutter is located on the center of the corresponding four adjacent perforations on the mold. Eg 6. Place each mold t between two diameters of approximately 1 mm and a stainless steel substrate approximately 义 卩 卩 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨20 200800504 Only certain large-sized abrasive particles will contact the substrate. 7. A heavy steel ring is pressed around the outer periphery of each mold to ensure that the mold does not move, translate or deform during the electrodeposition process. In some aspects, the heavy steel ring can actually bend the circumference of the mold slightly to form a recess on each side of the mold. The hypotenuse of the recess can be slightly controlled by this mechanism. In some aspects, the slope can be about 1/1 〇 (9). This allows the diamond particles on the working surface of the substrate to be slightly below (about 5 〇 〇 〇 〇 )) the center of the substrate in the finished tool. 8 • Place each mold/substrate assembly in a plastic holder. The base of the substrates is attached to the cathode of a plating bath. The mold/base components are covered by a nickel sulfide electrolytic solution (i.e., disposed in an electrolyte bath or cylinder), and when the substrate is energized, nickel ions are reduced and nickel metal is deposited on the «base substrate. When a nickel layer is formed on the substrate, the nickel layer grows toward the mold, and the abrasive particles attached to the mold are eventually covered by the nickel layer and selected in the nickel layer. The abrasive particles can be controlled by the operator of the program. In one aspect, the depth of the nickel layer can be about i/2 to 2/3 of the distance between the substrates. Since the electrolytic solution can flow through the perforations of the mold cyclically, the nickel layer can be formed uniformly and rapidly. 9. The mold cannot be over-charged due to the intervening insulating diamond particles and the selected varnish coating or other insulating material, so nickel will not deposit on the mold or the diamond particles on the near-nuclear surface. 10 - Once the nickel layer is formed, the abrasive tool and the mold are removed from the electric dream solution and separated from each other to expose the molding surface of the abrasive tool. 21 200800504 The mold is reusable. Since the nickel layer grows from the substrate to the mold, and the abrasive particles are attached to the substrate due to the growth process, the longitudinal appearance of the exposed diamond particle tip on the finished tool is finally affected by the shape of the mold molding surface. influences. In this manner, the diamond particle tips can be configured in accordance with a predetermined vertical pattern on the working surface of the finished final tool. In addition, due to the nature of the program, the finished grinding tool does not need to be assembled through the post-assembly Φ private sequence or work 70%. In other words, in some aspects, once the nickel layer is formed and the abrasive tool is removed from the plating bath, a ready-to-use abrasive tool product has been completed. Of course, the reader should be aware that the above examples are merely illustrative of the application of the principles of the present invention. Without departing from the scope and spirit of the invention, those skilled in the art can make various modifications and different configurations, and the scope of the appended patent application is intended to cover such modifications and differences. The details of the embodiments that are currently considered to be practical and preferred have been disclosed above, and for those skilled in the art, a can be made in a variety of sizes, materials, and shapes in accordance with the concepts and principles set forth herein. There are no restrictions on changes in form, function, method of operation, assembly and use. BRIEF DESCRIPTION OF THE DRAWINGS The first A to c diagrams are a series of steps of the manufacturing (electroplating) abrasive tool of the present invention. The first A is a bottom view of a mold embodiment of the present invention showing the molded surface of the dry mold. 22 200800504 The first B diagram is a 咅*J view along line A-A of the first A diagram of an embodiment of the present invention. The first C drawing is a cross-sectional view of the first B drawing showing an adhesive coating layer disposed on the molding surface of the mold in an embodiment of the present invention. The first D is a bottom view of a mold of an embodiment of the invention showing the abrasive particle configuration on the molded surface. Figure-E is a cross-sectional view of the first-D diagram showing the abrasive particle configuration on the molded surface in the present invention - an embodiment. A partial cross-sectional view of the electrodeposition chamber showing the orientation of the mold and tool substrate of the present invention/embodiment. a first partial view of the first G-pattern, which shows that the abrasive particles are bonded to the substrate through the electro-deposited material in the embodiment of the invention. The drawings are cross-sectional views of the tools of the present invention - the examples. The brother-Α~2C diagram is a series of steps of another embodiment of the present invention. 〗 〖 仏 仏 仏 第 —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— j w 口 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , i, the material is combined with the tool substrate

第二C圖係本發明另一每A 上述圖式僅作為說明之工具的剖視圖。 町以不同於圖t所示。 ,、中各特徵與各層實際尺寸 【主要元件符號說明】 23 200800504 10模具 100電沉積室 14絕緣材料 18模造表面 22研磨粒子 26孔洞 30電解液 34區域 38黏著材料 42尖端 49工作表面 50工具 54基材 56表面 5 8電沉積材料 62垂直圖形 • 24The second C is another cross-sectional view of the above-described drawings of the present invention as merely illustrative tools. The town is different from the figure t. , , and the actual dimensions of each layer [main component symbol description] 23 200800504 10 mold 100 electrodeposition chamber 14 insulation material 18 molding surface 22 abrasive particles 26 holes 30 electrolyte 34 region 38 adhesive material 42 tip 49 working surface 50 tool 54 Substrate 56 surface 5 8 electrodeposited material 62 vertical pattern • 24

Claims (1)

200800504 十、申請專利範圍: 1 .一種模具,係用以定位及固定複數研磨粒子,該 等研磨粒子係在一電沉積程序期間,以電解方式附加於一 導電性基材上,該模具包含有: 一絕緣材料,係具有一模造表面,該模造表面用以在 一材料的電沉積期間固定該等研磨粒子,其中該電沉積的 材料係將研磨粒子固定到該導電性基材上。 2 ·如申請專利範圍第1項所述之模具,進一步包含 有黏著劑,該黏著劑係黏著在模造表面上以固定該等研 磨粒子。 3 ·如申請專利範圍第i項所述之模具,其中該絕緣 材料/、有至 一孔洞貫穿形成在該絕緣材料上,該孔洞供 一電解液自一位於模具外側的區域循環地穿過該模具到達 該模造表面。 4如申睛專利範圍第;3項所述之模具,其中該絕緣 ~——-- 5 ·如申請專利範圍第4項所述之模具,其中該等孔 洞係依據一預設圖形而配置。 6 ·如申請專利範圍第5項所述之模具,其中該預設 圖形為晶格。 7 ·如申請專利範圍第1項所述之模具,其中該模造 /、 一形狀’該形狀係與一應用於研磨粒子的垂直圖 形相互顛倒。 8 如申請專利範圍第7項所述之模具,其中該模造 25 200800504 表面大致上平坦。 9 ·如申睛專利範圍第7項所述之模具,其中該模造 表面呈凹狀而具有至少一凹部。 1 0 ·如申請專利範圍第9項所述之模具,其中該四 部的斜率為大約1/1000。 1 1 ·如申睛專利範圍第7項所述之模具,其中該模 造表面為凸狀。 1 2 ·如申請專利範圍第7項所述之模具,其中該模 造表面具有複數凹部與凸部。 1 3 ·如申請專利範圍第1項所述之模具,其中該等 研磨粒子係依據一預設的水平圖形而固定在該模造表面 上。 1 4 ·如申請專利範圍第1 3項所述之模具,其中該 預設水平圖形係為一晶格圖形。 1 5 ·如申睛專利範圍第5項所述之模具,其中該等 研磨粒子係依據一預設圖形而固定在該模造表面上,該預 設圖形係與該孔洞的圖形互補。 16·如申請專利範圍第15項所述之模具,其中研 磨粒子的圖形以及孔洞的圖形係分別為一晶格圖形。 1 7 ·如申請專利範圍第1 3項所述之模具,其中該 預設的水平圖形係令該模造表面的至少一特定區域上的研 磨粒子分佈密度較高,且高於模造表面其餘區域的研磨粒 子分佈密度。 1 8 ·如申請專利範圍第1項所述之模具,其中該絕 26 200800504 緣材料包含有一樹脂材料。 1 9如申請專利範圍第1 8項所述之模且,直中$ 20如申請專利範圍第18項所述之模具,其中誃 樹脂材料為聚合材料。 〃 ’、^ ^ 2 1如申請專利範圍第1 8項所述之模具,其中該 Η月曰材料仏运自一由環氧化物、漆、亮光漆、壓克力聚合 • 物及其混合物所構成群組的其中一種。 2 2 ·如申請專利範圍第2 1項所述之模具,該絕緣 材料為一亮光漆。 …2 3 ·如申請專利範圍第1項所述之模具,該絕緣材 料為一壓克力聚合物。 2 4 ·如申請專利範圍第1項所述之模具,該絕緣材 料為一橡膠材料。 2 5 ·如申請專利範圍第1項所述之模具,該橡膠材 _ ;斗係為天然橡膠或是人造橡膠。 2 6 · —種製造方法,係用以製造一電鍍研磨工具, 名電錢研磨工具係透過一電沉積材料將複數研磨粒子結合 到一基材上,其中該製造方法包含有: 暫時性地將該等研磨粒子固設到一個如申請專利範圍 第1項所述模具的一模造表面上; 將該模具定位到一電沉積室中,且以模造表面面向一 基材’其中該等研磨粒子即將以電解方式附加於該基材 上; 27 200800504 透過一電沉積材料而附 將該等研磨粒子以電解方式 加在該基材上;及200800504 X. Patent Application Range: 1. A mold for positioning and fixing a plurality of abrasive particles, which are electrolytically attached to a conductive substrate during an electrodeposition process, the mold comprising An insulating material having a molded surface for holding the abrasive particles during electrodeposition of a material, wherein the electrodeposited material fixes the abrasive particles to the conductive substrate. 2. The mold of claim 1, further comprising an adhesive adhered to the molding surface to fix the abrasive particles. 3. The mold of claim i, wherein the insulating material has a hole formed through the insulating material, the hole for circulating an electrolyte from a region outside the mold. The mold reaches the molding surface. [4] The mold according to the scope of claim 3, wherein the insulation is the mold described in claim 4, wherein the holes are configured according to a predetermined pattern. 6. The mold of claim 5, wherein the predetermined pattern is a crystal lattice. 7. The mold of claim 1, wherein the mold shape and the shape are reversed from a vertical pattern applied to the abrasive particles. 8 The mold of claim 7, wherein the mold 25 200800504 surface is substantially flat. 9. The mold of claim 7, wherein the molded surface is concave and has at least one recess. 1 0. The mold of claim 9, wherein the slope of the four portions is about 1/1000. 1 1 The mold of claim 7, wherein the molding surface is convex. The mold of claim 7, wherein the molding surface has a plurality of concave portions and convex portions. The mold of claim 1, wherein the abrasive particles are attached to the molding surface in accordance with a predetermined horizontal pattern. 1 4 The mold of claim 13 wherein the predetermined horizontal pattern is a lattice pattern. The mold of claim 5, wherein the abrasive particles are fixed to the molding surface according to a predetermined pattern, the predetermined pattern being complementary to the pattern of the hole. The mold according to claim 15, wherein the pattern of the grinding particles and the pattern of the holes are respectively a lattice pattern. The mold according to claim 13 wherein the predetermined horizontal pattern is such that the distribution density of the abrasive particles on at least one specific region of the molding surface is higher and higher than the rest of the molding surface. Grinding particle distribution density. 1 8 The mold of claim 1, wherein the edge material comprises a resin material. 1 9 The mold of claim 18, and the mold of claim 18, wherein the resin material is a polymeric material. 〃 ', ^ ^ 2 1 such as the mold described in claim 18, wherein the Η月曰 material is transported from an epoxide, lacquer, varnish, acrylic polymer, and mixtures thereof. Form one of the groups. 2 2 . The mold according to claim 2, wherein the insulating material is a varnish. The mold described in claim 1 is an acrylic polymer. 2 4 . The mold according to claim 1, wherein the insulating material is a rubber material. 2 5 · If the mold described in the first paragraph of the patent application, the rubber material _; the bucket is natural rubber or synthetic rubber. 2 6 -- a manufacturing method for manufacturing an electroplating grinding tool, the electric money grinding tool bonding a plurality of abrasive particles to a substrate through an electrodeposited material, wherein the manufacturing method comprises: temporarily The abrasive particles are fixed to a molding surface of a mold as described in claim 1; the mold is positioned in an electrodeposition chamber, and the molding surface faces a substrate in which the abrasive particles are about to Attached to the substrate by electrolysis; 27 200800504 attaching the abrasive particles to the substrate by electroplating through an electrodeposited material; 移除該模具。 2 7 ·如申請專利範圍第2 6 中該基材包含有一導電性材料。 2 8 ·如申請專利範圍第2 7 中該導電性材料為一不鏽鋼。 2 9 ·如申請專利範圍第2 6 中該基材為一工具本體。 項所述之製造方法 項所述之製造方法 項所述之製造方法 ,其 ,其 ,其 3 0 ·如申請專利範圍笛 進 工 哥J乾固弟2 6項所述之製造方g 步包含一自该電沉積室移险兮甘 和除該基材且將基材附加至》 具本體的步驟。 / 1 .如申請專利範圍第26項所述之製造方法,其 中ό亥電丨儿積材料為一金屬材料。 32.如申請專利範圍第26項所述之製造方法,其Remove the mold. 2 7 · The substrate comprises a conductive material as in the scope of claim 2-6. 2 8 · The conductive material is a stainless steel as claimed in the second claim. 2 9 · The substrate is a tool body as in the scope of claim 2-6. The manufacturing method according to the manufacturing method item of the above-mentioned manufacturing method item, wherein, the method of manufacturing the method described in the patent application scope A step of removing the substrate from the electrodeposition chamber and attaching the substrate to the body. The manufacturing method according to claim 26, wherein the material is a metal material. 32. The method of manufacturing of claim 26, wherein 中該電沉積材料為一金屬組成材料 3 3 .如申請專利範圍第3 2項所述之製造方法,立 中該金屬組成材料係包含至少―元素,該元素係選自一: 鎳、鉻、銅、鈦、鶴、錫、鐵、銀、金、錳、鎮、鋅、銘、 钽、其合金或是其混合物所構成之群組的其卜種。 34 .如中請專㈣圍第33項所述之製造方法,其 中該金屬組成材料包含了鎳。 3 5 *申5月專利範圍第3 1項所述之製造方法,其 中δ亥金屬組成物係由一金屬組成 28 200800504 項所述之製造方法,其 一由鎳、鉻、銅、鈦、 、銘、麵、其合金或是 Ο 項所述之製造方法,該 6所述製造方法所製 3 6 .如申請專利範圍第3 5 中該金屬係為一元素,該元素選自 鎢、錫、鐵、銀、金、錳、鎂、鋅 其混合物所構成之群組的其中—種 3 7 .如申請專利範圍第3 6 金屬為錄。The electrodeposition material is a metal component material 3 3. The manufacturing method according to claim 3, wherein the metal component material comprises at least an element selected from the group consisting of nickel, chromium, A group of copper, titanium, crane, tin, iron, silver, gold, manganese, town, zinc, indium, bismuth, alloys or mixtures thereof. 34. The manufacturing method according to item 33 of the special (4), wherein the metal constituent material comprises nickel. 3 5 * The manufacturing method according to the third aspect of the invention, wherein the metal composition is composed of a metal, and the manufacturing method described in the item 200800504, one of which consists of nickel, chromium, copper, titanium, The manufacturing method according to the above, wherein the metal is an element selected from the group consisting of tungsten, tin, and the like. Among the groups consisting of a mixture of iron, silver, gold, manganese, magnesium, and zinc, the type 3 is as described in the patent. d «.—種由申請專利範圍第 造的電鍍研磨工具,其包含有· 一基材’該基材透過—電沉積材料而結合有複數研磨 粒子,該等研磨粒子係分別具有—尖端,料研磨粒子尖 端係依據-預設的垂直圖形而配置,且一部分外露於該電 沉積材料之上而不被電沉積材料所覆蓋。 3 9 .如申請專利範圍第3 8項所述之電鍍研磨工 具,其中該預設的垂直圖形係為一自基材向上的均等高度 圖形。 4 0 ·如申請專利範圍第3 8項所述之電鍍研磨工 具’其中遠預没的垂直圖形為一凸狀圖形。 4 1 ·如申請專利範圍第3 8項所述之電鍍研磨工 具’其中該預設的垂直圖形為一凹狀圖形。 4 2 ·如申請專利範圍第3 8項所述之電鍍研磨工 具,其中該預设的垂直圖形同時包含有複數凸狀區域與凹 狀區域。 4 3 ·如申請專利範圍第3 8項所述之電鍍研磨工 具’其中该專研磨粒子係進一步依據一預設的水平圖形而 29 200800504 配置ο 4 4 ·如申請專利範圍第4 3項所述之電鍍研磨工 具’其中該預設的水平圖形係為一晶格。 4 5 ·如申請專利範圍第4 3項所述之電鍍研磨工 具,其中該預設的水平圖形係令基材上一特定區域的研磨 粒子分佈密度較高,且高於該基材上其餘區域的研磨粒子 分佈密度。 4 6 ·如申請專利範圍第3 6項所述之電鍍研磨模 具,其中該電沉積材料令形成完畢的工作表面不需要任何 後電沉積程序。 47 · —種電鍍研磨工異,其包含有: 一基材,該基材透過一電沉積材料而結合有複數研磨 粒子,該等研磨粒子尖端係依據一預設的水平圖形而配 置’且依據一預設的垂直圖衫而令一部分外露於該電沉積 材料之上,該電沉積材料具有/由電沉積程序所產生的工 作表面。d «. - An electroplating abrasive tool made by the patent application scope, comprising: a substrate - the substrate is permeated - an electrodeposited material combined with a plurality of abrasive particles, each of which has a tip - The abrasive particle tip is configured in accordance with a predetermined vertical pattern, and a portion is exposed on the electrodeposition material without being covered by the electrodeposition material. The electroplating abrasive tool of claim 3, wherein the predetermined vertical pattern is an equal height pattern from the substrate. 4 0. The electroplating abrasive tool as described in claim 3, wherein the vertical pattern is far from being a convex pattern. 4 1 . The electroplating abrasive tool of claim 3, wherein the predetermined vertical pattern is a concave pattern. 4 2 The electroplating abrasive tool of claim 3, wherein the predetermined vertical pattern comprises a plurality of convex regions and concave regions. 4 3 · The electroplating abrasive tool of claim 3, wherein the specialized abrasive particles are further based on a predetermined horizontal pattern 29 200800504 configuration ο 4 4 · as described in claim 4 The electroplating abrasive tool' wherein the predetermined horizontal pattern is a lattice. 4. The electroplating abrasive tool of claim 4, wherein the predetermined horizontal pattern is such that a specific area of the substrate has a higher density of abrasive particles and is higher than the rest of the substrate. The abrasive particle distribution density. 4 6 . The electroplated abrasive mold of claim 36, wherein the electrodeposited material does not require any post-electrodeposition procedure for the formed working surface. 47. An electroplating polishing method comprising: a substrate, the substrate is bonded to a plurality of abrasive particles through an electrodeposited material, and the abrasive particle tips are configured according to a predetermined horizontal pattern and A predetermined vertical shirt exposes a portion of the electrodeposited material having a working surface created by an electrodeposition process.
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WO2007120224A3 (en) 2007-12-27

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