JP2004268238A - Electrodeposition tool and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further improve the cutting quality of a tool and discharge performance of chips by improving a projecting part forming condition and an electrodeposition condition in an electrodesposition tool for arranging an abrasive grain in projection parts formed on a base metal surface of the electrodeposition tool. <P>SOLUTION: A large number of projection parts 4 are formed on the base metal 2 surface being a grinding surface, and one abrasive grain 5 is fixed by electrodeposition to respective upper surfaces of a large number of these projection parts 4. The height of the projection parts 4 is 0.5 to 4 times the average particle size of the abrasive grain 5, and the area of the upper surfaces of the projection parts 4 is 1.2 to 4 times the average cross-sectional area of the abrasive grain 5. A large chip pocket 8 is formed between the projection part 4 and the projection part 4 by forming the electrodeposition tool forming no plating layer between the projection part 4 and the projection part 4. Projection quantity of the abrasive grain 5 from the base metal 2 surface is increased, and supply of a grinding liquid and discharge of the chips are improved, and grinding resistance is also reduced. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrodeposition tool in which abrasive grains are electrodeposited and fixed on a surface of a base metal in a single layer, and a method of manufacturing the same.
[0002]
[Prior art]
Electrodeposition tools having an abrasive layer formed on a base metal surface by an electrodeposition method are used for grinding and polishing of various materials such as cemented carbide, ceramic, glass, semiconductor materials, cast iron, and steel. This electrodeposition tool immerses a base metal in the form of a mold, a cup, a disk, etc., in a plating solution in which superabrasive grains such as diamond abrasive grains and cBN abrasive grains are dispersed. Is electrodeposited to form an abrasive layer.
[0003]
Such electrodeposition tools generally have abrasive grains fixed to a single layer. In the case of single layer structure, the plating metal precipitates between the abrasive grains and the plated metal holds the abrasive grains firmly and the tip of the abrasive grains is sufficiently exposed, so the sharpness is sharp. Excellent, high efficiency grinding is possible. However, on the other hand, because the density of the abrasive grains is high, if a part of the tip of the abrasive grains is worn by grinding, the grinding resistance is significantly increased and sharpness is greatly reduced. In addition, the swarf has low dischargeability, and tends to cause clogging and welding.
[0004]
In order to cope with such a problem, the abrasive grains are uniformly dispersed on the surface of the base metal in order to reduce the abrasive grain density. As means for that purpose, the present inventor has performed an insulating mask having a non-masking portion on the surface of a base metal, and, when electrodepositing the abrasive on the non-masking portion, using an abrasive for electrodepositing the thickness of a masking sheet. We have invented a method for producing an electrodeposited whetstone in which the particle size is in the range of 50 to 150% and the inner diameter of the hole in the non-masking portion is in the range of 110 to 160% of the abrasive particle size (see Patent Document 1).
In the electrodeposited whetstone manufactured by this method, by setting the thickness of the masking sheet and the inner diameter of the hole of the non-masking portion to predetermined values, the abrasive grains electrodeposited on the base metal can be used to form the formed non-masking portion pattern. Are distributed one by one.
[0005]
However, in this manufacturing method, in order to permanently fix the temporarily fixed abrasive grains, electroplating is performed again in a plating solution, and a plating layer having a thickness of about 30 to 70% of the abrasive grain diameter is formed on the base metal surface. Is precipitated. Therefore, the projection height of the abrasive grains from the upper surface of the plating layer is only about 30 to 70% of the grain size of the abrasive grains, and thus the effect of improving sharpness is small, and the effect of discharging chips is not expected to be much improved. . In order to improve this point, a plurality of small abrasive layers having a mound part protruding from the base metal and a single abrasive grain fixed on the mound part with a metal bonding layer are arranged at predetermined intervals on the base metal. A grindstone has been proposed (see Patent Document 2). According to this whetstone, only the abrasive grains in the small abrasive layer portion come into contact with the abrasive, so that the sharpness is good and the cutting powder is easily discharged.
[0006]
[Patent Document 1]
JP-A-5-285846 (paragraph number 0008-0012)
[Patent Document 2]
JP 2001-105327 A (Paragraph No. 0008)
[0007]
[Problems to be solved by the invention]
However, in the grinding wheel described in Patent Document 2 described above, since a chip discharge path is provided between the mound portion raised from the base metal and the mound portion, when a hard material to be ground is ground, the chip is There is a problem that the mound part is worn by contact with the part, the abrasive particles fixed on the upper surface of the mound part fall off, and the tool life is shortened.
[0008]
Such a problem is not limited to a disk-shaped rotary grindstone, but can be applied to cup-shaped and all-shaped grindstones, and other general electrodeposited tools.
The problem to be solved by the present invention is to improve the conditions for forming a convex portion in an electrodeposited tool in which abrasive grains are disposed on a convex portion formed on the surface of a base metal of the electrodeposited tool, and reduce wear of the convex portion. The purpose is to extend the life of the tool.
[0009]
[Means for Solving the Problems]
In the electrodeposition tool of the present invention, a large number of columnar protrusions made of a metal binder containing fine abrasive particles are formed on the surface of a base metal serving as a grinding surface, and one of these protrusions is formed on the upper surface of each of these protrusions. The abrasive grains for grinding are fixed by electrodeposition, the height of the projections is 0.5 to 6 times the average particle diameter of the abrasive grains for grinding, and the outer diameter of the projections is The electrodeposited tool has an average particle size of 1.1 to 1.5 times the abrasive grain for use, and has no plating layer formed between the convex portions.
[0010]
The above electrodeposition tool creates a masking sheet having a large number of holes with a predetermined hole diameter, and affixes the masking sheet to a base metal surface having a ground surface to form a non-masking portion with a large number of holes on the base metal surface. A step of forming a masking pattern having an electroplating process in an electrolytic plating solution in which fine abrasive grains having an average particle diameter of 20 μm or less are suspended in a state in which the masking pattern is formed, to form holes in the non-masking portion. A step of depositing the plating metal containing the fine abrasive grains to form a large number of projections made of the plating metal containing the fine abrasive grains on the base metal surface, and performing an electroplating process with the masking pattern formed. A step of electrodepositing and fixing one abrasive grain on the upper surface of each of the plurality of projections.
[0011]
In the electrodeposition tool of the present invention, the abrasive grains for grinding are fixed one by one on the upper surface of the convex part formed on the base metal surface, and the convex parts and the abrasive grains for grinding are uniformly dispersed and arranged according to the masking pattern. Since the plating layer is not formed between the convex portion and the convex portion, a large chip pocket is formed between the convex portion and the convex portion, the projection amount of the abrasive for grinding from the base metal surface is large, and the Good supply and chip evacuation and reduced grinding resistance. Further, since the convex portion is formed of a metal binder containing abrasive grains having a small particle size, the abrasive portion has high wear resistance against chip contact with the convex portion when grinding a hard material to be ground, and the convex portion Is hard to wear, so that the abrasive grains fixed to the upper surface of the convex portion can be prevented from falling off, and the life of the tool is prolonged.
[0012]
The height of the protrusions formed on the surface of the base metal is determined by the depth of the holes (thickness of the masking sheet), which is the non-masking portion of the masking sheet, and the fine abrasive grains deposited in the holes to form the protrusions. (Deposited thickness is smaller than the depth of the hole by 50 to 150% of the grain size of the abrasive grains for grinding), but the height of the projections is the average of the abrasive grains for grinding. If the particle size is less than 0.5 times, the chip pocket becomes small, and it is not possible to expect improvement of the supply of the grinding fluid and the discharge of the chips, and it is not possible to obtain a sufficient depth of cut so that the grinding resistance is reduced. No effect can be expected. If the height of the projections exceeds six times the average particle size of the abrasive grains for grinding, the depth of cut into the workpiece during grinding is too deep, and the impact on the abrasive grains for grinding is large. Easily fall off. The required thickness of the masking sheet (the required depth of the holes) for setting the height of the projections to 0.5 to 6 times the average particle diameter of the abrasive grains for grinding is 1 to 10 times the average particle diameter of the abrasive grains for grinding. It becomes 7.5 times.
[0013]
The outer diameter of the cylindrical projection is determined by the inner diameter of the hole in the masking sheet. If the outer diameter of the projection (the hole diameter of the masking sheet) is less than 1.1 times the average particle diameter of the abrasive grains for grinding, When the abrasive grains for grinding are electrodeposited on the upper surface of the convex portion by electroplating, it becomes difficult to stably fix the abrasive grains one by one. Also, even if it can be fixed, if the outer diameter of the convex portion is less than 1.1 times the average particle size of the abrasive grains for grinding, the area for fixing the abrasive grains for grinding is reduced, so that The holding power is weak, and the abrasive grains for grinding tend to fall off during grinding. When the outer diameter of the convex portion (the hole diameter of the masking sheet) exceeds 1.5 times the average particle size of the abrasive grains for grinding, the abrasive grains for grinding are fixed to the upper surface of the convex portion by electrodeposition by electroplating. For example, two or more ground abrasive grains are fixed, and uniform dispersion cannot be performed. For this reason, the number of abrasive grains for grinding that comes into contact with the object to be ground increases or the dispersion increases, so that stable grinding cannot be performed and the effect of reducing grinding resistance is small.
[0014]
Here, it is desirable that the average grain size of the abrasive grains having a small grain size to be contained in the plating metal forming the projections is 20 μm or less. If the average grain size of the fine grains is larger than 20 μm, the sedimentation speed in the plating bath is high, and the abrasive grains are deposited on the surface of the base metal and block the non-masking portions of the masking pattern. As a result, the plating cannot be stably deposited due to, for example, burning of the plating, and it becomes impossible to form the projections. As abrasive grains contained in the plating metal for forming the convex portions, diamond abrasive grains, cBN abrasive grains, SiC abrasive grains, Si ₃ N ₄ abrasive grains, and Al ₂ O ₃ abrasive grains can be used.
[0015]
Further, it is desirable that the center interval between the adjacent convex portions is 1.5 to 3.5 times the average particle size of the abrasive grains to be used. If the center spacing of the projections is less than 1.5 times the average grain size of the abrasive grains for grinding, the number of abrasive grains in contact with the workpiece is increased and the cutting depth of the abrasive grains is reduced, so that the grinding is performed. The effect of reducing the resistance is reduced. If the distance between the centers of the protrusions exceeds 3.5 times the average particle size of the abrasive grains for grinding, the number of abrasive grains is too small, so the impact applied to each abrasive grain during grinding increases, and the abrasive grains are likely to fall off. Become.
[0016]
The method for producing an electrodeposition tool of the present invention includes the steps of electrodepositing the abrasive grains on the upper surface of the convex portion formed on the surface of the base metal by plating metal containing the abrasive particles having a small particle diameter, and the method of forming the convex portion and the convex portion. A manufacturing method according to the manufacturing method described in the above-mentioned JP-A-5-285846 can be employed except that no plating layer is formed therebetween. However, the method of electrodepositing and fixing the abrasive grains for grinding is different, and in the production method of the present invention, the electroplating treatment is performed in an electrolytic plating solution in which fine abrasive grains are suspended in a state where a masking pattern is formed. After depositing the plating metal containing the fine abrasive grains in the holes of the masking portion and forming the projections made of the plating metal containing the fine abrasive grains on the base metal surface, the abrasive grains are directly applied to the base metal surface in the plating solution. Spray and insert abrasive grains one by one into the holes of the non-masking area, temporarily fix the abrasive grains by electroplating, remove excess abrasive grains, and perform electroplating with the masking pattern formed To permanently fix the abrasive grains for grinding. Thereafter, by removing the masking pattern, a plating layer is not formed between the convex portions, and a grinding surface on which abrasive grains are fixed is formed on the upper surface of the convex portion.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIGS. 1A and 1B are diagrams schematically showing an arrangement state of abrasive grains in an embodiment in which the present invention is applied to a rotating disk grindstone. FIG. 1A is a perspective view showing an appearance of the grindstone, and FIG. And (c) is a partial sectional view showing the arrangement of abrasive grains.
[0018]
The grindstone 1 is a grindstone in which an abrasive grain layer 3 is formed on an outer peripheral surface of a disk-shaped base metal 2. The abrasive grain layer 3 is formed by plating one abrasive grain 5 on the upper surface of a large number of protrusions 4 formed on the surface of the base metal with a plating metal containing abrasive grains having a small particle diameter. (Including a plating metal layer 6 for fixing). As a result, the protruding height of the abrasive grains 5 from the surface of the base metal 2 is increased by the height of the projections 4, and a large chip pocket is formed between the projections 4. The powder discharge property is improved, and the grinding resistance is reduced. In addition, when the chips are discharged, the chips come into contact with the projections 4. Since the projections 4 are formed of a plated metal containing hard abrasive grains having a small particle diameter, the wear resistance is high and the life is long. Become.
[0019]
The abrasive grains 5 are diamond abrasive grains having an average particle size of about 220 μm. The convex portion 4 has a columnar shape, the height H is about 450 μm (about 2.05 times the average particle size of the abrasive grains 5), and the outer diameter D is about 250 μm (about 1.14 times the average particle size of the abrasive grains 5). ), And the center distance L between the protrusions 4 is about 500 μm (about 2.27 times the average grain diameter of the abrasive grains). The fine abrasive grains in the plated metal forming the projections 4 are diamond abrasive grains having an average particle size of 5 μm.
[0020]
FIG. 2 is an explanatory diagram of a method for forming the abrasive grain layer 3 of the grindstone 1 shown in FIG.
First, as shown in FIG. 2A, the masking portion 12 is formed by printing with a thermosetting resin ink on the transfer paper 11 so that the non-masking portion 13 is formed by a large number of holes having a depth of 660 μm. This is dried at room temperature. Next, a plastic film 14 is attached to the upper surface (the upper surface of the ink) of the masking section 12 to produce the masking sheet 10. The inner diameter of the hole which is the non-masking portion 13 is about 250 μm, the center interval between the non-masking portions 13 is about 500 μm, and the planar arrangement of the non-masking portion 13 is a staggered arrangement shifted by an angle of 60 degrees.
[0021]
Next, the masking sheet 10 is immersed in water, the transfer paper 11 is peeled off, and attached to the outer peripheral surface of the base metal 2. The side surface 2a and the mounting holes 2b (see FIG. 1A) of the base metal 2 are masked with a normal plating masking tape having no holes. Thereafter, the thermosetting ink is dried and cured in an atmosphere at 120 ° C. for about 1 hour, and the plastic film 14 is peeled off, so that a masking pattern in which a large number of holes become non-masking portions 13 is formed on the surface of the base metal 2. It is formed.
[0022]
Next, in a state where the masking pattern is formed, a pretreatment for plating is performed on the surface of the base metal 2, and thereafter, a diamond abrasive having an average particle diameter of 5 μm is mixed and suspended at a ratio of 5 g per liter of the plating solution. Then, a current having a current density of about 1.2 A / dm ² is passed for about 30 hours to deposit a plated metal layer 15 containing fine diamond abrasive grains having a height of about 450 μm inside the non-masking 13. This plated metal layer 15 becomes the projection 4 on the surface of the base metal 2 shown in FIG.
[0023]
Next, abrasive grains for grinding are scattered in the plating solution, and the plating solution is vibrated to put the abrasive grains 5 one by one on the plating metal layer 15 in each of the non-masking portions 13. A current having a current density of about 0.3 A / dm ² is flowed for about 8 hours to deposit a plating metal layer 6 having a thickness of 10 to 15% of the average grain size of the abrasive grains for grinding. Temporarily fixed to the upper surface of the layer 15 (see FIG. 2C). Thereafter, excess abrasive grains 5a are removed, and a current having a current density of about 0.5 A / dm ² is again passed through the plating solution for about 6 hours. And the abrasive grains 5 are permanently fixed (see FIG. 2D).
[0024]
Thereafter, the masking tape on the side surface 2a and the mounting hole 2b of the base metal 2 is peeled off, and the whole is immersed in a solvent to peel off and remove the masking portion 12, so that the abrasive grains 5 are formed on the upper surface of the projection 4 on the surface of the base metal 2. The abrasive layer 3 having a space (chip pocket) 8 in which the plating layer is not formed between the convex portions 4 is fixed (see FIG. 2E), and the rotation shown in FIG. A disc wheel 1 is obtained.
[0025]
In order to confirm the effect of the present invention, the rotary disk grindstone (invention) of the above embodiment, and the same base metal, abrasive grains and plating solution as those of the above embodiment were manufactured by the method described in Patent Document 1. A grinding test was performed using a rotating disk grindstone (comparative product).
〔Test condition〕
Grinding machine: Surface grinder Grinding material: Cemented carbide G2
Wheel speed: 1700m / min
Depth of cut: 20 μm / feed speed of pass table: 10 m / min
Grinding method: Plunge cut Grinding fluid: Soluble type [0026]
3A and 3B are diagrams showing test results, wherein FIG. 3A is a diagram showing the relationship between the amount of grinding and power consumption, FIG. 3B is a diagram showing the relationship between the amount of grinding and the surface roughness of the workpiece after grinding, c) is a diagram showing the relationship between the amount of grinding and the amount of wear in the grinding wheel radial direction.
[0027]
As shown in FIG. 3A, regarding the power consumption, the comparative product has a low protruding height of the abrasive grains from the upper surface of the plating layer. Is shown. On the other hand, in the present invention, since the abrasive grains for grinding are fixed to the upper surface of the projection, the height of the abrasive grains protruding from the surface of the base metal is high, and the chip pocket is large. This improves the discharge performance of the steel, reduces the grinding resistance, and shows low power consumption. The average power consumption of the invention product is about 39% lower than the average power consumption of the comparison product.
[0028]
As shown in FIG. 3B, the surface roughness of the material to be ground after the grinding is greater in the invention because the projection height of the abrasive grains is high and the interval between the cutting edges is large. Therefore, the surface roughness of the material to be ground is slightly larger than that of the comparative product. However, the surface roughness is not a problem in practical use.
As shown in FIG. 3C, the invention product showed almost the same value as the comparative product with respect to the wear amount in the grindstone radial direction.
[0029]
Further, in order to confirm the effect of including the fine abrasive grains in the convex portion formed on the base metal surface, a grinding stone was manufactured without including the fine abrasive particles in the convex portion, and a grinding test was performed. As the material to be ground, a material that easily wears the plated metal due to the contact of the swarf was used.
〔Test condition〕
Grinding machine: Surface grinder Grinding material: Normal pressure sintered silicon nitride grinding wheel Peripheral speed: 1800 m / min
Cutting depth: 20 μm / pass table feed speed: 20 m / min
Grinding fluid: Noritake Cool SA-02 (trade name)
[0030]
The test results showed that the life of the comparative wheel was about 46% shorter than that of the inventive wheel. This is because, in the case of the comparative whetstone, the abrasion resistance is low because the projections do not contain fine abrasive grains, and when the chips passing between the projections come into contact with the projections during grinding, the projections This is because the abrasive grains on the upper surface of the convex portion are in an unstable fixed state due to the abrasion, and the abrasive grains for grinding fall off even in a state where they can still be used. On the other hand, in the whetstone of the present invention, the abrasion of the convex portion due to the contact of the cutting chips is small, so that the stable fixed state of the abrasive grains for grinding is maintained, the abrasive grains for grinding can be used effectively, and the life is prolonged.
[0031]
【The invention's effect】
A large number of cylindrical projections made of a metal binder containing fine abrasive grains are formed on the surface of the base metal serving as a grinding surface, and one grinding abrasive is provided on the upper surface of each of these projections. The height of the convex portion is 0.5 to 6 times the average particle size of the abrasive grains for grinding, and the outer diameter of the convex portion is the average particle size of the abrasive particles for grinding. By using an electrodeposition tool that is 1.1 to 1.5 times and has no plating layer formed between the projections, a large chip pocket is formed between the projections, The protrusion amount of the abrasive grains from the gold surface is also increased, so that the supply of the grinding fluid and the discharge of the cutting chips are improved, and the grinding resistance is reduced. Further, the abrasion resistance of the protruding portion against cutting chips is improved, and the life of the tool can be extended.
[Brief description of the drawings]
FIG. 1 is a view schematically showing an arrangement state of abrasive grains in an embodiment in which the present invention is applied to a rotating disk grindstone.
FIG. 2 is an explanatory view of a method for forming an abrasive layer of the grindstone shown in FIG.
FIG. 3 is a diagram showing a grinding test result.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Whetstone 2 Base metal 2a Side face 2b of base metal Mounting hole 3 of base metal 3 Abrasive layer 4 Convex part 5 Abrasive grains 5a Abrasive grains 6, 7, 15 Plating metal layer 8 Space (chip pocket)
DESCRIPTION OF SYMBOLS 10 Masking sheet 11 Transfer paper 12 Masking part 13 Non-masking part 14 Plastic film

Claims (6)

A large number of cylindrical projections made of a metal binder containing fine abrasive grains are formed on the surface of the base metal serving as a grinding surface, and one grinding abrasive is provided on the upper surface of each of these projections. The height of the convex portion is 0.5 to 6 times the average particle size of the abrasive grains for grinding, and the outer diameter of the convex portion is the average particle size of the abrasive particles for grinding. An electroplated tool having a ratio of 1.1 to 1.5 times, wherein no plating layer is formed between the convex portions. The electrodeposited tool according to claim 1, wherein the average grain size of the abrasive grains having a small grain size contained in the projections is 20 µm or less. The electrodeposition tool according to claim 1, wherein a center distance between the protrusions is 1.5 to 3.5 times an outer diameter of the protrusion. A step of forming a masking sheet having a large number of holes with a predetermined hole diameter and affixing the masking sheet to a base metal surface having a ground surface to form a masking pattern having a non-masking portion with a large number of holes on the base metal surface. Electroplating is performed in an electrolytic plating solution in which micro-abrasive particles having an average particle diameter of 20 μm or less are suspended in a state where the masking pattern is formed, and plating including the micro-abrasive particles in the holes of the non-masking portion A step of depositing a metal to form a number of projections made of a plating metal including the fine abrasive grains on the base metal surface, and performing an electroplating process in a state where the masking pattern is formed, and forming each of the plurality of projections. Electrodepositing one abrasive grain for grinding on the upper surface of the electrodeposition tool. The inside diameter of the holes in the masking sheet is 1.1 to 1.5 times the average particle size of the abrasive grains for grinding, and the thickness of the masking sheet is 1 to 7.5 times the average particle size of the abrasive grains for grinding. The method for manufacturing an electrodeposited tool according to claim 4, wherein the number is doubled. The method for manufacturing an electrodeposited tool according to claim 4 or 5, wherein a center interval between holes of the masking sheet is set to 1.5 to 3.5 times an inner diameter of the hole.

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