JPH08229828A - Super-abrasive grain tool, and manufacture thereof - Google Patents

Abstract

PURPOSE: To provide a super-abrasive grain tool in which super-abrasive grain are protruded uniformly, and in which both cutting performance and precision are excellent. CONSTITUTION: After super-abrasive grain 1 of an almost uniform grain size in an average grain size range of 50-1500μm is fixed to an inner wall surface of a ring-shaped die 5 in a single layer by a first and a second metal platings 7, 2 which are different from each other, a base metal 4 is inserted into the ring shape, a gap between an outer circumference of the base metal 4 and the second metal plating 2 is bound by binding material 3, and the die 5 and the first metal plating 7 are eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a superabrasive tool used for grinding various materials such as metals, ceramics, plastics and glass or for dressing various grindstones.

[0002]

2. Description of the Related Art Japanese Patent Publication No. 56-4
No. 2430 is proposed. This method is to reduce distortion and deformation in the manufacturing process in the conventional manufacturing method, and to form a superabrasive grain layer with a uniform protrusion amount.The superabrasive grains are formed on a metal base plate by a plurality of metal plating layers. It is characterized in that after fixing, further laminating a base on the metal plating layer, one of the metal base plate and the metal plating layer is dissolved and removed.

[0003]

The above proposal is excellent as a method for producing a high quality grindstone, but in actual practice, it requires a lot of skill and is inevitable in industrial production. It is hard to say that it is enough. Therefore, the object of the present invention is to
An object of the present invention is to provide a superabrasive grain tool in which superabrasive grains are uniformly projected and have high characteristics in sharpness and precision, and a method for easily manufacturing the tool.

[0004]

In order to achieve this object, the superabrasive grains forming the superabrasive grain layer in the present invention have an average grain size of 50 to 1500 μm. It is characterized in that the super-abrasive particles are selected and uniformly project from the metal-plated portion, and the metal-plated portion on the side where the super-abrasive particles do not project is integrally bonded to the outer edge of the base metal via a bonding material. .

The tool having the above structure is easily manufactured by including the following steps. The average particle size on the surface of the mold is 50 ~
A step of adhering superabrasive grains having a substantially uniform grain size within a range of 1500 μm to a single layer with a conductive adhesive, and immersing the die to which the superabrasive grains are adhered in a metal plating solution, 1 / average grain size
A step of applying a first metal plating having a thickness of less than 2 and a step of applying a second metal plating different from the first metal plating having a thickness at which each superabrasive grain is completely buried on the metal plating. A step of removing the mold from the superabrasive grain layer adhered by the plating, a step of integrally joining the second metal plating part and a base metal outer edge via a binding material, and a step of forming the superabrasive grain layer And removing the first metal plating by etching to uniformly expose the superabrasive grains.

Another feature of the present invention is that the mold is made of a conductive material or a material subjected to a conductive treatment, and the mold is made of superabrasive grains having an average particle size within a range of 50 to 1500 μm. After the step of immersing in the containing metal plating solution and applying the first metal plating having a thickness less than 1/2 of the average particle diameter of each of the above-mentioned superabrasive grains, the same steps as the above second metal plating It is a method of providing. The details will be described below with reference to examples.

[0007]

EXAMPLE FIG. 1 is a vertical side view of an example tool, and FIG.
B is the schematic which shows the one manufacturing process. In FIG. 1, 1 is a diamond particle of # 30/40 (average particle size 602 μm), which is about 60 mm from the surface of the Ni plated portion 2 with a thickness of about 1.5 mm.
It projects approximately uniformly at a height of ~ 100 μm. 3 is a bonding material for bonding the plated portion 2 and the outer edge of the steel base metal 4 into one body, which is a low melting point alloy having a thickness of about 2 mm in the embodiment. In the tool having the above-described structure, the diamond particles 1 which are superabrasive particles have a uniform protrusion, and the Ni-plated portion 2 that fixes the particles is sufficiently adhered and fixed without loosening around the particles. And the machining accuracy is kept high. The outer diameter D of the tool in this embodiment is 70 mm, the diameter H of the shaft hole 8 is 35 mm, and the thickness T is 22 mm.

FIG. 2A shows the next step. On the surface of the carbon mold 5, # 30/40 diamond particles 1 are further spread and held with a conductive adhesive 6 such as a synthetic resin containing Cu powder, and this mold is heated or cured to cure the resin. After doing C
It is dipped in a u plating solution to form a Cu plating layer 7 having a thickness of 60 to 100 μm. Next, change the plating solution to the above C
The diamond particles 1 are buried on the u-plated layer 1.
A Ni-plated part 2 having a thickness of 5 mm is applied.

The respective conditions of the Cu plating and the Ni plating are as follows. (Cu plating) Liquid composition Copper pyrophosphate 75 to 105 g / l Metallic copper 26 to 36 g / l Potassium pyrophosphate 280 to 370 g / l Ammonia water 2 to 5 cc / l Brightener 1 to 4 cc / l Plating Conditions Current density 0.2 A / dm ² Temperature 45 to 50 ° C

(Ni plating) Composition of liquid Nickel sulfate 250 g / l Nickel chloride 45 g / l Boric acid 40 g / l Brightening agent 1 g / l Plating conditions Current density 1 A / dm ² Temperature 40 to 45 ° C.

FIG. 2B shows a steel base metal 4 formed on the Ni-plated portion 2 shown in FIG. 2A by a bonding material 3 made of a low melting point alloy.
It shows a state in which the mold 5 is destroyed and removed by integrally bonding to the outer edge of the mold. In the embodiment, the thickness of the binder 3 is 2 mm, but it can be increased or decreased if necessary. Also, remove the mold 5 from the base metal 4
It may be done before joining with.

The entire base metal 4 obtained by the above steps or only the plated portion is dipped in a Cu etching solution to form C.
The u plating layer 7 is removed by dissolution. In this case, the etching is electrolytic etching, but chemical etching can also be used. At this time, the Ni-plated portion 2 is not dissolved, the holding of the diamond particles 1 by the Ni-plated portion 2 is not loose, and only the preset thickness of the Cu plating layer 7 is completely dissolved and removed, and the diamond particles 1 A uniform amount of protrusion is guaranteed. When the resin of the conductive adhesive remains on the surface of the Cu plating layer 7, it may be removed by thermal decomposition or machining.

FIG. 3 shows an outline of another embodiment. An apparatus 10 is filled with a Cu plating solution 11 having the above composition and a Cu positive electrode 12 is provided. A ring-shaped mold 5 made of carbon was dipped in the same solution, and diamond particles 1 of # 80/100 (average particle size 181 μm) were so floated in the ring-shaped mold 5 soaked.
And a current is applied to generate a Cu plating layer 7 with the particles 1 in contact with the ring-shaped inner wall of the mold 5.
The layer promotes fixation of the particles 1 to the inner wall of the mold 5.

At this time, it is important that the Cu plating layer 7 is formed so as to have a thickness of at least less than about 1/2 of the average particle diameter of the particles. In this embodiment, the thickness is 70 μm.

As a result, the diamond particles 1 are fixed on the inner peripheral wall surface of the mold 5 as a single layer. In the figure, 12 is a Cu anode, 13 is a support for the mold 5, and 14 is a cage inserted so that the floating of the diamond particles 1 is concentrated around the ring shape of the mold 5.

After the Cu plating layer 7 is formed, the plating conditions are changed to the Ni plating conditions described above, and the Ni on the Cu plating layer 7 is changed.
The plated portion 2 is formed. The Ni-plated portion 2 surely holds the particles 1 and improves the bonding with the base metal 4 described later. Therefore, the Ni-plated portion 2 needs to have a thickness equal to or more than the thickness at which the particles 1 are completely buried. mm. When this plating is finished, the mold 5 may be removed by cutting or the like, but in the present embodiment, the following steps were performed. The plated condition is shown in Fig. 2.
It is as follows.

The mold 5 plated with two layers is taken out from the plating bath, washed as required, and then the shaft hole 8 prepared in advance.
The steel annular base metal 4 having the above is inserted into the ring of the mold 5. Then, a molten bonding material 3 made of a low melting point alloy is poured into a gap between the outer periphery of the base metal 4 and the Ni-plated portion 2 formed on the inner peripheral wall surface of the die 5 to bond them together. The gap in the example is 2 mm.

Next, the shaft hole 8 of the base metal 4 is attached to the rotary shaft of the lathe, the outermost peripheral die 5 is cut and removed, and the Cu plating layer 7 is formed.
Exposed. The exposed plating layer 7 was completely removed by the same etching treatment as described above to complete the tool.

[0019]

The diamond particles 1 of the tool manufactured in this manner completely project by the thickness of the Cu plating layer 7. Since the Ni-plated portion 2 holding the particles is less likely to be removed by etching as compared with the Cu-plating, only the Cu-plating is completely removed and the Ni-plating around the particles surrounding the particles does not elute. The particles are sufficiently retained, and the amount of protrusion can be made uniform according to the setting of the Cu plating layer thickness.

Further, in the superabrasive tool, as shown in FIG. 4A, it is desirable that the superabrasive grain 1 is bonded to the Ni-plated portion 2 only in the vicinity 15 of the particle and the joint height is high.
As a result, high particle retention and a large amount of processing waste are stored.
A sufficient amount of particles that can be discharged is obtained. Typically,
When superabrasive grain particles, which are non-conductive materials, are to be held by plating, the height of the bonding portion decreases conversely only in the vicinity 15 of the particles due to the electrical characteristics, as shown in FIG. 4B. However, according to the method of the present invention, as shown in FIG. 4C, the first plating 7 is removed and the second plating 2 has a structure in which the abrasive grains are held. A combined state will be obtained.

In the above embodiment, Cu, which is easy to plate and etch, is used as the first plating layer, and Ni, which is easy to plate and has high corrosion resistance and holding power, is used as the second plating portion. If necessary, Ag may be used as the first plating layer, or one or both sides of the plating layer may be Z-plated.
It is also possible to change the combination with n, Cr, Co or the like. Further, although the binding material 3 is shown to be made of metal, it is also possible to use a binding material of synthetic resin, and the base metal 4 can be formed of other material such as aluminum alloy. As the superabrasive grains, CBN grains and the like are used in addition to the above-mentioned diamond grains.

[0022]

As described in the above paragraphs, in the present invention, the superabrasive grain layer has a uniform grain size within the range of 50 to 1500 μm in average grain size, so that a single layer has a uniform protrusion amount. Since it is formed and has high abrasive retention, it has high processing performance and processing accuracy. Moreover, since the tool is manufactured by two-layer plating using a mold, bonding with a base metal by a bonding material, and etching of only one layer in the plating layer, it can be easily performed according to a preset size configuration. be able to.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a grinding tool in an example.

2A and 2B are schematic views of a partial cross section of a superabrasive layer explaining a manufacturing process of an example.

FIG. 3 is a schematic view of a plating apparatus for explaining a plating method according to another embodiment.

4A, 4B, and 4C are enlarged schematic views of a cross section of a bonding portion for explaining a state in which superabrasive grains are bonded and held by a plating portion.

[Explanation of symbols]

 1 Diamond Particles (Super Abrasive Grains) 2 Ni Plated Part 3 Binder 4 Base Metal 5 Type 6 Conductive Adhesive 7 Cu Plating Layer 8 Base Metal Shaft Hole 10 Equipment (Plating Equipment) 11 Cu Plating Liquid 12 Cu Anode 13 Support Platform 14 Cage 15 Near diamond particles D Tool outer diameter H Tool shaft hole diameter T Tool thickness

Claims (3)

[Claims] 1. A tool having a superabrasive grain layer on an outer edge of a base metal, wherein the superabrasive grain layer is a single layer of superabrasive grains having a substantially uniform grain size within a range of 50 to 1500 μm. The metal-plated portion formed so as to uniformly project from the metal-plated portion and on the side where the superabrasive grains of the superabrasive grain layer do not project is attached to the outer edge of the base metal through a binder.
A superabrasive tool characterized by being bonded to the body. 2. A step of adhering superabrasive particles having an average particle diameter within the range of 50 to 1500 μm on the surface of a mold with a conductive adhesive in a single layer, and adhering the superabrasive particles. The step of immersing the mold in a metal plating solution and applying the first metal plating having a thickness of less than 1/2 of the average particle diameter of each superabrasive grain, A second metal plating having a thickness different from that of the first metal plating to be buried in the metal, a step of removing the mold from the superabrasive grain layer fixed by the plating, and a second metal plating portion. And a step of integrally bonding the outer edge of the base metal via a bonding material, and a step of uniformly removing the superabrasive grains by removing the first metal plating of the superabrasive grain layer by etching. And a method for manufacturing a superabrasive tool. 3. A die is immersed in a metal plating solution containing superabrasive grains having an average grain size within a range of 50 to 1500 μm so that the superabrasive grains form a single layer on the die surface. The step of applying a first metal plating having a thickness of less than 1/2 of the average grain size of the grains and the thickness at which the superabrasive grains are completely embedded on the metal plating are different from those of the first metal. 2. A step of applying metal plating, a step of removing the mold from the superabrasive grain layer fixed by the plating,
A step of integrally bonding the second metal plating part and the outer edge of the base metal through a bonding material; and removing the first metal plating of the superabrasive grain layer by etching to uniformly expose the superabrasive grains. A method of manufacturing a superabrasive tool, comprising the steps of: