JPH0464833B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a grindstone in which a single layer of abrasive grains is fixed by electrodeposition on a metal base.

The conventional production of this type of grindstone is as shown in FIGS. 7 to 11.

That is, as shown in FIG. 7, abrasive grains 53 are applied to the surface 52 of an electrodeposited master base metal 51 made of graphite, aluminum alloy, etc. whose surface has been finished with high precision in advance.
are dispersed in a single layer, and the abrasive grains 53 are bonded to the base metal 51 with a plating layer 54 of copper, nickel, etc., as shown in FIG.
The abrasive grains 53 are fixed by electrodeposition on top, and carbide abrasive grains such as diamond or CBN are used as the abrasive grains 53. The thickness of the plating layer 54 is generally greater than the diameter of the abrasive grains 53, and the abrasive grains 53 are buried in the plating layer 54.

Next, a grindstone base 56 that overlaps the plating layer 54 is superimposed on the master base metal 51 having a plating layer containing the abrasive grains 53, and the plating layer 54 and the base body 56 are bonded by synthetic resin, brazing, etc. layer 5
8 to join and integrate. This is shown in FIG.

Next, the master base metal 51 was peeled off from the surface of the plating layer 54 by a mechanical or chemical method, as shown in FIG.

Further, the surface of the plating layer 54 fixed to the surface of the base 56 is subjected to chemical surface treatment such as immersion in acid or electrical surface treatment such as electrolysis, and the tips 531 of the abrasive grains 53 of a predetermined amount necessary for grinding are applied. is exposed from the outer surface 541 of the plating layer 54 to form an abrasive surface 59,
This is shown in FIG. 11, and a completed grindstone 60 is obtained.

The above conventional techniques have the following disadvantages.

That is, first of all, when the grinding wheel base 56 including the plating layer is peeled off from the base metal 51, there is a risk of damaging the base metal 51. Therefore, it is necessary to replace the base metal when manufacturing the grindstone, which reduces the lifespan of the base metal. There are drawbacks in terms of durability and a total disadvantage in terms of cost.Secondly, etching of the plating layer using chemical or electrical means to expose the abrasive grains requires a long processing time, which is an improvement. Furthermore, the above treatment often causes acid and electrolyte to penetrate into the gap between the abrasive grains and the plating metal that holds them, so that they gradually corrode the whetstone base and the plating layer. There is also a risk that the holding power of the abrasive grains will be reduced and the abrasive grains will fall off early during use, which will shorten the life of the whetstone.

Further, the conventional technique requires a step of bonding the plating layer and the grinding wheel base, which is disadvantageous in that it increases the number of steps and requires an adhesive.

The present invention has been made to improve the disadvantages of the conventional electrodeposited grindstone manufacturing method and the grindstones obtained thereby.

The purpose of the present invention is to improve the life and durability of a master base metal in whetstone manufacturing, improve abrasive grain retention performance, reduce total cost, and improve total life of whetstone. It is an object of the present invention to provide a method for manufacturing an electrodeposited grindstone that is simplified and shortens the manufacturing process.

In order to achieve the above object, the present invention temporarily covers a part of the abrasive grains on the surface of the master base metal with a low melting point metal layer that has a melting point lower than that of the base metal and has a thickness of 30% to 45% of the average grain size of the abrasive grains. A plating layer having a melting point higher than that of the metal layer is provided on top of this metal layer so as to envelop the abrasive grains to form a grinding wheel master, and the master is placed on the grinding wheel base and heated at a temperature higher than the melting point of the metal layer. The gist is that the metal is heated at a temperature below the melting point of the plating layer and the base metal, melting only the metal, and allowing the molten metal to penetrate into the plating layer and the grinding wheel base through the communication portion provided in the plating layer. .

Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 6 show the manufacturing method according to the present invention in the order of steps. As shown in FIG. 1, diamond, CBN, etc. Carbide abrasive grains 3 are distributed and arranged. In this case, since the master base metal 1 is used repeatedly, a titanium alloy or a rigid material whose surface is plated with platinum is used.

Next, under the conditions shown in FIG. 1, abrasive grains 3 are fixed to the surface of the base metal 1 with a low melting point metal 4 by electrodeposition. The fixation by such a low melting point metal is the tip part 30 of the abrasive grain 3...
1, and a metal layer 40 built up on the surface 2 of the base metal 1.
1 to embed and hold the tips 301 of the abrasive grains 3, thereby temporarily holding the abrasive grains 3. The thickness H of the metal layer 401 needs to be set equal to the protruding amount of abrasive grains when the whetstone is completed, and is 30% of the average grain size of the abrasive grains.
A range of % to 45% is appropriate. Setting the amount of protrusion, that is, setting the thickness H of the metal layer 401, can be done by simply distributing the abrasive grains and depositing the low alloy metal on the surface 2 of the base metal 1, so it is only necessary to control the amount. This can be done easily and accurately in terms of dimensional accuracy. This is shown in Figure 2.

In this example, tin (melting point
231℃) is solder (tin/lead alloy for brazing, melting point
183°C to 283°C).

Subsequently, the abrasive grains 3 are placed on the metal layer 401 of the base metal on which the abrasive grains 3 are fixed with the low melting point metal 4.
1 and abrasive grain 3...
A metal for holding abrasive grains, such as copper or nickel, is plated so as to fill the base 302 of the abrasive grains, and a plating layer 5 is laminated on the metal layer 401 to obtain a whetstone master 6. Set the thickness to be necessary and sufficient to hold the grains.

After forming the above plating layer 5, a plurality of holes 10 reaching from the surface 501 of the layer 5 to the metal layer 401 are formed in the plating layer. This is shown in Figure 3.

Next, the whetstone master 6 is placed on the whetstone base 7 with the abrasive grains 3 side facing down, that is, the surface 501 side of the plating layer 5.
At this time, the grinding wheel base 7
A gap S is provided between the surface 701 of the plating layer 5 and the surface 501 of the plating layer 5, and the gap S communicates with the holes 10 provided in the plating layer 5 described above. 401 and the gap S are connected.
This is shown in Figure 4.

Next, this is heated to a predetermined temperature and the abrasive grain 3
The low melting point metal layer 4 temporarily holding the tip 301 of...
01 will be dissolved. Molten metal is in hole 1
0... to infiltrate into the gap S formed between the surface 701 of the grindstone base 7 and the surface 501 of the plating layer 5 facing downward, and the gap S is filled. By cooling from this state, the low melting point metal infiltrated into the gap S is solidified, and the grindstone base 7 and the plating layer 5 are joined by brazing 8. Also, with the above, abrasive grain 3... and master base metal 1
As a result of the metal temporarily holding the abrasive grains 3 between them being eluted, the abrasive grains 3 and the surface 2 of the base metal 1 are released,
Abrasive grains 3 are removed from base metal 1 without mechanical peeling work...
It becomes possible to separate the plating layer 401 from the plating layer 401. Therefore, the surface 2 of the base metal 1 is not damaged as in the conventional case. This is shown in FIG.

The grinding wheel 9 obtained by separating the base metal 1 is shown in FIG. 6, and the surface 502 of the plating layer 5 is fixed on the base 7 via the aforementioned metal 8 which functions as the brazing material 8.
The tips 301 of the abrasive grains 3 protrude by infiltration into the gap S of the metal layer 401 above, and the protrusion amount H becomes equal to the thickness H of the metal layer 401 as described above.
The base portions 302 are buried and held in the plating layer 5. Unlike the conventional method in which the plating layer is peeled off from the base metal 1 and the surface of the plating layer is etched, the tips of the tips 301 are aligned on the same horizontal plane, and the protrusion amount H is the same for all abrasive grains. You will get something excellent.

In this way, the metal layer 401 for holding abrasive grains was replaced with the brazing material 8, so that the metal layer and the brazing material were used both.

As shown in Fig. 6, the metal 11 molten in the hole 10...
The bonding effect of the brazing filler metal 8 may be reinforced by leaving the brazing filler metal 8 to remain.

As is clear from the above, according to the present invention, first, as described above, a low melting point metal is interposed as a temporary holding material between the metal plating layer that holds the abrasive grains and the master base, so that the plating layer is attached to the whetstone base. During heating bonding, the metal is dissolved and infiltrated between the plating layer and the whetstone base, thereby separating the master base metal, plating layer, and abrasive grains, and simultaneously joining the plating layer that holds the abrasive grains and the whetstone base. It can be lowered all at once.

Therefore, there is no need for a process for bonding and integrating the plating layer to the whetstone base, which simplifies the process. Also, there is no need for a separate bonding material such as adhesive, and it is possible to use metal for temporarily holding the abrasive grains. Since it can be used as a bonding material as it is, it is advantageous and rational in terms of material economy.

Further, as described above, it is not necessary to separate the master base metal and the plating layer, and the surface of the master base metal is not damaged as in the conventional case. Therefore, it is possible to use the master base repeatedly over a long period of time, improving its lifespan and durability, and thereby significantly reducing the cost, and by extension, the cost of grinding wheel manufacturing compared to the conventional method. Another advantage is that the master base metal and the plating layer holding the abrasive grains can be separated by a simple operation of heating and melting.

Next, a plating layer for holding the abrasive grains is formed on the low melting point metal layer that temporarily holds the abrasive grains, and then a conventional chemical and electrical etching process is performed to melt the metal layer and expose the abrasive grain tips. Unlike other methods, it prevents situations such as chemical erosion of the base material and plating layer and a decrease in abrasive grain retention, thereby improving the lifespan and durability of the grinding wheel, reducing total costs, and reducing the cost. The protrusion height of the abrasive grains can be set by setting the thickness of the melting point metal layer, and a highly accurate electrodeposited grindstone with a constant abrasive grain protrusion amount can be obtained.

The present invention has many advantages as described above.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIGS. 1 to 6 show the manufacturing process of the grindstone in order of process. Figure 2 is a similar view of the whetstone master temporarily held by a low melting point metal, Figure 3 is a diagram showing the whetstone master with metal plating layer formation, Figure 4 is a diagram of the whetstone master set on the whetstone base, and Figure 5 is a diagram showing the whetstone master being heated. After the treatment, FIG. 6 is a diagram of the obtained grindstone, and FIGS. 7 to 11 are diagrams illustrating conventional grindstone production in the order of steps. In the drawings, 1 is a base metal, 3 is an abrasive grain, 4 is a low melting point metal layer, 5 is a plating layer, 7 is a base, and 10 is a communicating portion.

Claims (1)

[Scope of Claims] 1 a The tips near the surface of the abrasive grains distributed and exposed on the surface of the base metal are treated with a metal having a melting point lower than that of the base metal, which accounts for 30% to 45% of the average particle diameter of the abrasive grains. (b) providing a plating layer with a metal having a higher melting point than the metal layer so as to wrap around the base of the abrasive grains protruding from the surface of the metal layer; a step of forming a communicating part between the surface of the layer and the metal layer when forming the plating layer, and forming a grindstone master consisting of the metal layer, abrasive grains, and the plating layer; c. placing the grindstone on the surface of the grindstone base; The masters are placed so that the surfaces of the plating layers face downward and are overlapped with a space between them, and the grindstone masters are heated at a temperature above the melting point of the metal layer and below the melting points of the plating layer and base metal to grind the metal. A method for producing an electroplated grindstone, which comprises the steps of melting only the layer and allowing the melt to penetrate between the plating layer and the surface of the grindstone base through the communicating part of the plating layer.