CN101336147A - Electroplated abrasive tools, methods, and molds - Google Patents
Electroplated abrasive tools, methods, and molds Download PDFInfo
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- CN101336147A CN101336147A CNA2006800521572A CN200680052157A CN101336147A CN 101336147 A CN101336147 A CN 101336147A CN A2006800521572 A CNA2006800521572 A CN A2006800521572A CN 200680052157 A CN200680052157 A CN 200680052157A CN 101336147 A CN101336147 A CN 101336147A
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- polishing particles
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- die face
- deposition
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Abstract
The present invention provides for a mold that can position and hold abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process. The mold can include an insulating material with a molding surface suitable for holding the abrasive particles in place during this process. Additionally, a method for making an abrasive tool using such a mold is provided, as well as abrasive tools made thereby. In one aspect of this invention, abrasive tools can have abrasive particle tips that are arranged in accordance with a predetermined vertical pattern and/or a predetermined horizontal pattern in a manner that requires little or no post electrodeposition processing.
Description
Technical field
The method and the mould that the invention relates to a kind of electroplated abrasive tools and make electroplated abrasive tools.Therefore, the present invention relates to electrochemistry, material science and physical field.
Background technology
Milling tool has multiple application, comprises cutting, boring, saw, grinding, lappingout (Lapping) and the polishing of material.Wherein a kind of common milling tool form is to use the abrasive grains on a tool substrate to cut, grind and operation such as polishing.
The superfinishing particle, as diamond, glomerocryst diamond (Polycrystalline Diamond, PCD), cubic boron nitride (CBN) and polycrystalline cubic boron nitride (PCBN), pass conductibility owing to have high hardness, atomic density and high heat, therefore be widely used in the application of many removal materials.For example, trimming dish (Dressing Disk), grinding disc, saw cutter, scroll saw and drill bit all have the superfinishing particle and are attached on the base material.
Although superabrasive tool has significant advantage, many problems continue the usefulness and the service life of the many existing superabrasive tools of constraint.For example, the layout of superfinishing particle still has a difficulty with fixing.Another extra problem is the height that the superfinishing particle extends on base material.In many application, it is useful making all particles on the tool substrate extend to identical haply even height.In many examples, evenly the particle height can help the operating load on the even distribution of particle, and thereby the reserving degree of promoting particle.In other example, make particle on instrument, have different height and benefit according to a default elevational plot.
Existing many methods that are used to assemble superabrasive tool, for example hard solder, hot pressing, infiltration and plating or the like.Yet can't producing, the great majority in these methods have the instrument that above-mentioned superfinishing particle is arranged characteristic.In addition, the instrument by the known method manufacturing needs back assembling processing procedure so that obtain a working surface with appropriate characteristics (for example suitable particle exposes degree).
Therefore, this area continues to seek to allow accurately polishing particles to be carried out level and is arranged vertically and can reaches electroplated abrasive tools and method and the mould that only needs a little or need not the suitable working surface of back assembling processing procedure.
Summary of the invention
Therefore, the invention provides electroplated abrasive tools, it has the particle that a plurality of whiles dispose according to level and elevational plot, and only need a little or need not the back processing procedure, the present invention and the manufacturing and the using method of this electroplated abrasive tools are provided.In addition, the present invention also is provided for the device of a part in the fabrication schedule.
On the one hand, the invention provides a kind of location and the fixing mould of polishing particles, it is to be attached on the electrically-conductive backing plate with electrolysis mode in the electrolysis step.This mould can comprise exhausted raw material or by the insulating materials manufacturing, this insulating materials has a die face (Molding Surface), when this die face appends to polishing particles on the electrically-conductive backing plate at the electrodeposit of a material, can fix polishing particles.
On the other hand, provide a kind of manufacture method of electroplated abrasive tools, this electroplated abrasive tools includes and a plurality ofly is coupled to polishing particles on the base material by the electro-deposition material.This method can comprise step: 1) temporarily these a plurality of polishing particles are fixed on the die face of a mould, for example at this said mould; 2) this mould is navigated to an electro-deposition chamber, and the die face of mould is with the additional base material of electrolysis mode towards this a plurality of polishing particles desire; 3) by an electro-deposition material, should append on this base material by a plurality of polishing particles with electrolysis mode; And 4) remove this mould.
Again on the other hand, the present invention comprises milling tool, and aspect certain, milling tool can method manufacturing described herein.This kind instrument generally comprises a substrate, and this substrate includes a plurality of polishing particles, and these a plurality of polishing particles are coupled on this substrate by an electro-deposition material.This plural number polishing particles can have the tip that disposes according to a default elevational plot.
The invention described above feature and advantage are in following detailed description and relevant have further elaboration among graphic.
Description of drawings
Fig. 1 a is to show that each of the series of steps that is used to the instrument of making in one embodiment of the invention is graphic to Fig. 1 h.
Fig. 1 a is the bottom view in one embodiment of the invention, and it shows the die face of a mould.
Fig. 1 b is along the cutaway view of Fig. 1 aA-A line segment in one embodiment of the invention.
Fig. 1 c be in one embodiment of the invention according to the cutaway view of Fig. 1 b, it shows that one sticks together coating layer on the mould die face.
Fig. 1 d is the bottom view of a mould in one embodiment of the invention, and it shows the layout of polishing particles on die face.
Fig. 1 e be in one embodiment of the invention according to the cutaway view of Fig. 1 c, it shows the layout of polishing particles on die face.
Fig. 1 f is the phantom of electro-deposition chamber in one embodiment of the invention, and it shows the direction of a tool substrate and a mould.
Fig. 1 g be in one embodiment of the invention according to the phantom of Fig. 1 f, it shows that polishing particles is coupled to this tool substrate by an electro-deposition material.
Fig. 1 h is the cutaway view of an instrument in one embodiment of the invention.
Fig. 2 a is that to be used to each of series of steps of the instrument of making in another embodiment of the present invention graphic to Fig. 2 c.
Fig. 2 a is the cutaway view of a mould in another embodiment of the present invention, and it shows the layout of polishing particles on die face.
Fig. 2 b be in another embodiment of the present invention according to the cutaway view of Fig. 2 a, it shows a tool substrate and is coupled to polishing particles on this tool substrate by an electro-deposition material.
Fig. 2 c is the cutaway view of an instrument in another embodiment of the present invention.
Above-mentioned graphic only as further understanding demonstration purposes of the present invention.The actual size that it should be noted each layer and each feature can be with shown different.
The component symbol description
10 moulds electro-deposition chambers 100
14 insulating materials, 18 die faces
22 polishing particles, 26 holes
30 electrolyte, 34 zones
38 adhesion materials, 42 tips
49 working surfaces, 50 instruments
54 base materials, 56 surfaces
58 electro-deposition materials, 62 elevational plot
The specific embodiment
Before disclosing and describing the present invention, should be appreciated that invention is in no way limited in disclosed ad hoc structure, fabrication steps or material in the literary composition, but can expand the equipollent of being understood by skilled persons will in those association areas to.Also will be appreciated that, only be used to narrate certain embodiments, but not intention causes restriction at this employed term.
To reach " being somebody's turn to do " be to have comprised plural usage to employed article " " in specification and the additional claim, unless specific other connotation of pointing out in the article.For example, " polishing particles " comprised one or more such particles.
Definition
When description and request are of the present invention, can use following term according to the definition of following proposition.
Employed in the literary composition " insulating materials " is meant one or more materials, and this material forms a mould with a method, and this method effectively avoids the electro-deposition buildup of material on the die face of this insulating materials.As explaining in the literary composition, this insulating materials can comprise non-conductive and/or conductive material.
Employed in the literary composition " die face " is meant the surface on this insulating materials that can be fixed with polishing particles.
Employed in the literary composition " default figure " is meant the nonrandom configuration of a kind of polishing particles or hole, and this configuration is before assembling one comprises this kind particle or the instrument of hole or device, is determined in advance.
Employed in the literary composition " horizontal figure " is meant that a kind of polishing particles or hole are dispersed throughout a lip-deep configuration, and this surface is the surface that polishing particles or hole are desired to append to.
Employed in the literary composition " elevational plot " is meant the configuration of the height that a kind of tip of polishing particles is extended on the working surface of an instrument or tool substrate.
Employed in the literary composition " working surface " be meant in when operation, towards or desire and one polished, the grinding or the surface of contacted a kind of instrument of the workpiece of frosted or tool substrate.
Employed in the literary composition " lattice " is meant a horizontal figure, and its adjacent polishing particles is with equidistant intervals, and with regard to hole, adjacent holes is with separately equidistant.
Employed in the literary composition " back electro-deposition program " is meant the trimming or the polish process of some conventional method, and this trimming or polish process are to be used to make an instrument to expose its working surface.
Employed in the literary composition " fixing (holding) " " temporary transient fixing (temporarily securing) " is meant coupling or supports particle with in order to avoid particle to come off from coupling or the surface of supporting this particle or to move on this surface.For example, in certain embodiments, gravity is enough to the polishing particles coupling or is supported on this surface.
Employed in the literary composition " model (Template) " is meant that one has the device of a plurality of holes, and these a plurality of holes are used to polishing particles is fixed on the mould according to a default figure.The configuration of hole can be controlled this default figure on this model.In use, model one side is positioned against the die face of a mould, and the diamond particle then intersperses among the model opposite side.These a plurality of holes can be designed to and allow each hole only mate single polishing particles, and make polishing particles drop passing hole and contact die face.These a plurality of holes also can be designed to its particle that can only hold the specified particle diameter size.Particle in hole can contact die face so that make particle be fixed on the die face.Remaining loose polishing particles can be removed.This model then removes on mould afterwards.
Employed in the literary composition " haply ", during about definite character or item, be meant an error degree, this error degree is small fully so that can't measurability ground impairment this definite character or item.
Employed word " approximately " in the literary composition when linking to each other with indivedual numerals or digital scope, is meant a real figure or a scope that is higher or lower than the actual numerical value that is linked a little.
Employed a plurality of article, construction package, composition assembly and/or material or the like in the literary composition can be listed in the common bar row for simplicity.Yet these tabulations should be interpreted as: each assembly in the bar row all is independent and unique assembly.Therefore, any independent assembly in these row, can not be only because this independent assembly of indication explanation with not different with any other assembly in the bar row, just be interpreted as with other assembly impartial haply.
Concentration, quantity and other numerical data in the text can range format be expressed or are presented.The reader should be appreciated that, scope of application form only be for convenience with succinctly, so should flexibly be interpreted as not only comprising by the numerical value of clear narration with limited range, also comprised these independent numerical value or subranges that disclosed, independent numerical value among being positioned at this scope and subrange are known the exposure.For example, a digital scope " about 1 to about 5 " should be interpreted as being not only comprised clear narration about 1 to about 5, also should comprise the independent numerical value and the subrange that are among this scope.Therefore, this scope has comprised such as independent numerical value 2,3 and 4 and subrange 1 to 3,2 to 4 and 3 to 5 or the like.
Same rule is applicable to only narrates single numerical value.In addition, the scope of being narrated no matter this explanation should be employed or the range of characteristic.
The present invention
The present invention has comprised the electro-deposition manufacture method of a plurality of (plating) milling tool, these a plurality of manufacture methods allow preferably to control configuration and the fixed condition of polishing particles on a tool substrate according to being positioned at a vertical and horizontal figure, and these a plurality of methods only seldom or not need to need the back electro-deposition program on this tool work surface.In other words, working surface is produced by electro-deposition program itself.The applicant is also developed and a mould to be used in this manufacture method, a plurality of milling tools of being produced by this manufacture method of concurrent exhibition.
Please refer to Fig. 1 a to Fig. 1 e, it shows the present invention's one mould 10.This mould 10 can be used in an electrolysis program a plurality of polishing particles 22 are located and are fixed to a die face 18 of this mould 10.Please refer to Fig. 1 f to Fig. 1 h, it shows in an embodiment of the present invention, the part-structure that the mould 10 of the 100 li uses in an electro-deposition chamber is presented.Similarly, Fig. 2 a has shown in an embodiment of the present invention to Fig. 2 c, is used other example of structure that mould 10 presents.
As above-mentioned graphic as shown in, this mould 10 has comprised an insulating materials 14.This insulating materials 14 can avoid electro-deposition material (Electrodeposited Material) 58 to be accumulated on this die face 18 effectively.To Fig. 1 h, and Fig. 2 a is in Fig. 2 c in the shown example at Fig. 1 f, and the tip 42 of these a plurality of polishing particles 22 forms the part of the working surface 49 of an instrument 50, and during electro-deposition, this a plurality of most advanced and sophisticated 42 is fixed on this die face 18.Can avoid this electro-deposition material 58 to accumulate on the working surface 49 of this polishing particles 22 most advanced and sophisticated 42 and this instrument 50.
In one embodiment, this insulating materials 14 has at least one hole 26 that runs through this insulating materials 14.Please refer to Fig. 1 a to Fig. 1 e, in another embodiment, this insulating materials 14 has a plurality of holes 26 that run through this insulating materials 14.These a plurality of holes 26 can pass the surface 56 that this mould 10 arrives these tool substrate 54 (according to Fig. 1 a to Fig. 1 e circularly for an electrolyte 30 from a zone 34 that is positioned at mould 10 outsides, diagrams such as 34,54,56 not), so that allow this in order to polishing particles 22 is fixed on the material generation electro-deposition on the tool substrate 54.Because this circulation is necessary for the ion (not shown) concentration of the electrolyte that maintains electro-deposition place, so this circulation is useful.In the example of Fig. 1 g, Fig. 1 h, Fig. 2 b and Fig. 2 c, electro-deposition place is on the surface 56 of this tool substrate 54.
In certain embodiments, these a plurality of holes 26 can dispose according to a default figure.For example, this default figure can be a lattice, shown in Fig. 1 a and Fig. 1 d.This lattice figure helps to distribute equably the ion of electrolyte 30 to base material 54.Uniform ion is distributed with to help electro-deposition material 58 set up equably and spreads on the surface of this tool substrate 54, so then helps with uniform strength polishing particles 22 is fixing.
In other embodiments, these a plurality of holes 26 can be configured to and allow the specific region that more electro-deposition takes place.For example, Fig. 2 b has shown that these a plurality of holes 26 are positioned at a plurality of recesses of this mould.Near the ion that more electrolyte 30 is arranged at hole 26 places, to cause having more electro-deposition material 58 to be formed at this place.
This insulating materials 14 can several different methods form.In one embodiment, this exhausted material 14 can be formed by a resin.For example, this resin material can be an artificial resin or a polymeric material, for example pi (Polyimide).This resin material also can comprise epoxides (Epoxies), lacquer (Lacquers), polish lacquer (Vanishes), acrylate copolymer (acrylic polymers) and composition thereof.In addition, this resin material can be an elastomeric material, and comprise Nature and Man and make rubber, styrene-butadiene (Styrene-Butadiene) for example, poly-chloroprene rubber (Polychloroprene Elastomers), fluorubber (Fluoroelastomers), ethylene-propylene-diene terpolymer (Ethylene PropyleneDiene), nitrite rubber (Nitrile Elastomers) is as acrylonitrile-butadiene rubber (Buna-N) and NBR rubber, polysiloxane group (Polysiloxanes), polyisobutene (Polyisobutylenes) and potassamide acid esters (Urethanes).
In other embodiments, as long as this insulating materials 14 avoids this electro-deposition material 58 to be formed at this die face 18 effectively or haply, this insulating materials 14 can comprise conductive component.For example, this insulating materials 14 can be a stainless steel substrate (not shown) that is coated with the insulated paint (not shown).
This insulating materials 14 also can comprise a die face 18, and this die face 18 is to carry out electrolytic deposition and when polishing particles 22 being fixed on a conductive base 54 (for example tool substrate 54) surface 56, be used for fixing this polishing particles 22 at an electro-deposition material 58.This mould 10 can be fixed this polishing particles 22 as diamond particle or the like in many ways.For example, on die face 18, can stick together an adhesion material 38 to fix this polishing particles 22.This adhesion material 38 can be used for each polishing particles 22 of separate configurations.Other fixedly the method for polishing particles 22 can comprise magnetic force, frictional force and gravity or the like.For example, in one embodiment, this die face can include a plurality of grooves and be fixed among the groove for these a plurality of polishing particles frictions.
Please refer to Fig. 1 e, in one embodiment, these a plurality of polishing particles 22 are fixed so that directly contact die face 18.Valuably, can control the elevational plot 62 of an a pair of required instrument 50 by the shape of configuration die face.Please refer to Fig. 2 a to Fig. 2 c, for example, this die face can be configured to have a shape of putting upside down with an elevational plot so that the polishing particles on the corresponding tool substrate 54.
These die face 18 shapes itself are applicable to many application of milling tool 50.For example, that this die face can be haply is smooth (as Fig. 1 a to shown in Fig. 1 g), concavity or convex, or this die face can comprise a plurality of recesses and protuberance (as Fig. 2 a and Fig. 2 b) simultaneously.(ChemicalMechanical Polishing, CMP) in the useful especially example, the recess of this die face can have about 1/1000 slope or about 1/1000 concavity to chemically mechanical polishing at another.In this last example, can make the elevational plot 62 of a polishing tool have one and protrude profile, this protrusions profile has about 1/1000 slope, and this is the condition that CMP uses the common requirement of institute.
In addition, directly contact among the embodiment of die face 18 with polishing particles 22, can this a plurality of polishing particles tips 42 as tool work surface 49 parts be set according to a default elevational plot at some.This can help the even trimming and the good completion quality (not shown) of polished thing.In addition, this can allow polished thing to have special trimming figure.
Among some embodiment, these a plurality of polishing particles 22 can be fixed on this die face 18 according to a default horizontal figure.Therefore, the spacing between the polishing particles on these tool substrate 54 surfaces 56 is able to controlled.Such control can have some benefits.For example, controlled polishing particles spacing can increase usefulness by reducing excessive frictional force (or drag) and reducing the heat energy that is produced in polishing process.In certain embodiments, these a plurality of polishing particles regularly must be on tool surfaces distribute.For reaching these application, these a plurality of polishing particles can be fixed on this die face according to a lattice figure.
These a plurality of polishing particles can be positioned on this die face according to a default horizontal figure by various technology.For example, this plural number polishing particles can be arranged on the die face individually.Perhaps, can use a model (as above-mentioned defined) to come more efficiently polishing particles to be arranged on this die face.Other method can be used transfer belt or other transfer printing media, and polishing particles temporarily is arranged on this transfer belt according to a default horizontal figure, then is transferred on this die face.
In an embodiment of the present invention, these a plurality of polishing particles 22 can be secured on this die face 18 with the default figure of hole 26 figure complementations according to one.For example, these a plurality of polishing particles and hole can be respectively according to disposing as the lattice figure of Fig. 1 d shown in respectively.Valuably, these complementary mutually figures can make electrolyte 30 with the ion concentration electro-deposition that equates haply around each polishing particles.Therefore, the amount of fixing the electro-deposition material 58 of each polishing particles respectively equates haply.This helps by distributing the operating load that equates the haply reservation degree to the polishing particles maximum to each polishing particles.
In other embodiments, these a plurality of polishing particles 22 can be secured on this die face 18 according to a figure, and this figure is to make the polishing particles distribution density at least one specific region of this die face higher, and is higher than all the other regional polishing particles distribution densities of die face.This figure is particularly useful in the application of CMP.For example, can make on the periphery of a plate-like milling tool and have a higher polishing particles distribution density.The periphery rotary speed of plate-like milling tool is higher than the center, and in the main edge of this plate-like instrument bigger pressure is arranged.The applicant is in the U.S. the 10/109th of application on March 27th, 2002, No. 531 patent application cases and the U.S. the 10/954th that applies on September 29th, 2004, No. 956 patent application cases have disclosed other polishing particles figure and configuration, and these a plurality of polishing particles and configuration are incorporated into herein and as with reference to case.
In another aspect of this invention, provide one in order to make the manufacture method of milling tool 50, wherein this milling tool is by an electro-deposition material 58 a plurality of polishing particles 22 to be attached on the base material 54.In an initial step, a plurality of polishing particles can temporarily be fixed on the die face 18 of a mould 10, and are as described herein, and then, this mould can be set in the electro-deposition chamber 100 with the polishing particles that is fixed, and with die face towards base material.Next, on the surface 56 of base material 54, and these a plurality of polishing particles are additional on this base material with electrolysis mode by the electro-deposition material with a material electro-deposition.This mould can be removed, to expose a whole or milling tool partly, the polishing particles that this milling tool has then comprised base material and has been attached to substrate surface.
In an example, these a plurality of polishing particles 22 can be secured on the die face 18 of mould 10 by an above-mentioned adhesion material 38.By this die face towards base material 54, electro-deposition material 58 can begin to be formed on this base material, till the part of polishing particles is capped.This electro-deposition material can more firmly be attached to polishing particles on this adhesion material, and therefore, can remove this mould easily to expose the tip of polishing particles.
In one embodiment, this base material 54 can be a conductive material, as stainless steel.This base material itself can be used as an electrode in electrolytic process, this base material itself also can be used as a tool body (not shown).Perhaps, this base material can just be fixed on the tool body after a while via a method.
In another embodiment of the present invention, this electro-deposition material 58 can be a metal material, for example a metal or a metal composition material.For example, this electro-deposition material can be metal, as nickel, chromium, copper, titanium, tungsten, tin, iron, silver, gold, manganese, magnesium, zinc, aluminium, tantalum, its alloy or its mixture.This metal composition material can be a constituent that includes at least a above-mentioned metal.
In the present invention on the other hand, provide a milling tool 50 by the said method manufacturing.This milling tool includes a base material 54, and a plurality of polishing particles 22 are attached on this base material 54 by electro-deposition material 58.The tip 42 of these a plurality of polishing particles can dispose according to a default elevational plot.In addition, the part of these a plurality of polishing particles can expose to outside the electro-deposition material and do not covered by the electro-deposition material.
For example, these a plurality of polishing particles 22 can be set in and have an equal equal altitudes or have an impartial haply height on this base material.This elevational plot also can be convex, concavity or has a plurality of convexs zone and concave regions simultaneously.
In addition, these a plurality of polishing particles 22 can be disposed on this base material according to a preset level figure.For example, these a plurality of polishing particles can dispose according to an above-mentioned lattice.This plural number polishing particles can be higher via the polishing particles distribution density that is configured to make a specific region on the base material, and be higher than all the other regional polishing particles distribution densities on this base material.These vertical and horizontal figures have many aforesaid advantages.
In other embodiment of the present invention, a milling tool 50 can only need seldom or not need the back electro-deposition program of the working surface of this instrument.In this embodiment, electro-deposition material 58 is formed on the base material 54 of this instrument, and can not form at the working surface 49 that this instrument is finished.Therefore, expose at this completed working surface tip 42 of not needing also to need to process to make polishing particles as other conventional method.This impact that helps avoid because of rebuilding this milling tool working surface damages polishing particles.
Example
In order to allow the present invention be understood more, below will provide several examples.Only this multiple example is limited category of the present invention.
Example 1:CMP rebuilds device (CMP Pad Dresser)
One for the mould of polyimide (1mm thickness) be to be stamped to have the hole of a plurality of foundation one lattice figures configuration.Each hole center and other adjacent holes center have the spacing of a 0.7mm, and each hole has the diameter of 0.5mm.One surface of this polyimide is gone up (for example die face) and is coated with an acrylic acid (acryl) (polymer) adhesive agent (50micron thickness).Additional on the whole have a plurality of diamond particle that possess 100/120 granularity (mesh), and each diamond particle lays respectively at the center of four adjacent holes on every side.This is arranged on the stainless steel substrate (having 108mm diameter and 6.5mm thickness) of a plate-like by the die face adjacency that diamond covered.These a plurality of diamond particle are between die face stainless steel and base material.This mould and base material are positioned among plastics (PVC) ring 48 so that can among the electrolysis program mould and base material be fixed together.This base material contacts a negative electrode.Electrolyte is nickel sulfide solution.This plastic hoop, mould and base material immersion are positioned at the electrolyte among the PVC layer, and this PVC layer is used to seal this electrolyte.Electrolysis is carried out to make electrodeposition of nickel on this base material.Electrolysis continues nearly to have covered approximately average 2/3 diamond particle size up to nickel.This pi mould then is removed so that obtain this adds diamond particle by electric deposition nickel base material.
Example 2
As described below and make 30 moulds:
Each mould is formed by a stainless steel disk body with about 120mm diameter and about 120micron thickness respectively.Each disk body is etched and be formed with a plurality of holes with planography way, and these a plurality of holes dispose according to lattice figures as described below.These a plurality of holes are distributed in one on each disk body center and have among the round zone of about 100mm diameter, and all the other then do not have hole in abutting connection with the zone that the disk body periphery has about 20mm width on each disk body.Measure the spacing (being the hole spacing) of the approximate center point between adjacent holes, some disk bodies have following hole spacing:
1. ten disk bodies have the hole spacing of about 800micron, the about 400mircon of each hole diameter.
2. ten disk bodies have the hole spacing of about 600micron, the about 300mircon of each hole diameter.
3. ten disk bodies have the hole spacing of about 400micron, the about 200mircon of each hole diameter.
Be coated with polish lacquer, rubber on each disk body or be coated with inert material or insulating materials so that promote its electrical insulation property.Yet mould is originally as low electric conductivity or non-conductive material, so above-mentioned application step can be used as non-essential optional step in some applications.In some example, when polishing particles is insulation (as the diamond particle), this stainless steel disk body or other electric conductivity disk body and a cathode base can be isolated by the polishing particles of intermediary and by this this disk body be insulated.
By using above-mentioned mould, following program can be rebuild device (Diamond PadConditioner) in order to make a diamond:
1. on the both sides of each mould, be coated with an adhesion layer, and each side all is assembled with a polishing particles model.These a plurality of polishing particles models are disposed and are selected the polishing particles that possesses preliminary dimension suitably to hold, and allow these a plurality of polishing particles to stick together between the hole of the mould of this correspondence model (in other words, each hole in each model is configured and is complementary configured with hole in the mould, will be attached on the die surface rather than falls into the hole that passes mould to guarantee polishing particles.)
2. this mould is to wear the corresponding combined hole that is run through formation in this assembly on each assembly with at least one in conjunction with tenon with the model assembly, to fix this assembly.Yet, it should be noted that other mechanism also can be used in conjunction with mould in this assembly and model as clamp, adhesive agent or the like.
3. the diamond particle (MBG-660 of Diamond Innovation company manufacturing) of tool appropriate size is separately positioned in the hole of model and receives single polishing particles that is about to adhere to die surface to make each model hole hold.
4. remove unnecessary diamond particle by each mould/modes such as model assembly of overturning, vibrate, rock.
5. remove model on each mould so that these a plurality of diamond particles are sticked together according to plate pattern on each surface of this mould.In some example, plate pattern can make each diamond particle lay respectively at the center of corresponding four adjacent perforated on the mould.
6. be arranged at two in each mould being put and possess between the stainless steel substrate of about 100mm diameter and about 6.5mm thickness, be located between mould and the base material to make the diamond particle.Because the dimensional variations amplitude of polishing particles is small, has only some large-sized polishing particles can contact this base material if possible.
The outer peripheral edges of each mould press respectively be provided with a heavy steel loop with guarantee that mould can not be moved during the electro-deposition program, translation or distortion or the like.In some aspects, this heavy steel loop in fact slightly the periphery of bending mould on each side of mould, to be formed with recess.The hypotenuse of this recess can this mechanism be controlled slightly, and in some aspects, this slope can be about 1/1000.So can make diamond particle on this base material working surface periphery a little less than the center of base material in (approximately 50micron) instrument finished product.
8. each mould/base material assembly is placed the fixing hole of a plastic processing frame.The base portion of these a plurality of base materials is connected on the negative electrode of an electroplating bath.This a plurality of moulds/base material assembly nickel electrowinning solution (promptly being arranged in electrolytic bath or the cylinder) that cures covers, and when this base material energising, and nickel ion reduces and the nickel metal is deposited on this base material.When forming a nickel dam on base material, nickel dam increases to this mould, and the diamond particle that is additional to this mould finally can be coated by nickel dam and embed in this nickel dam with a selected degree.The degree of depth that polishing particles is imbedded can be controlled by the operator of this program.On the one hand, the degree of depth of this nickel dam can be about 1/3 to 2/3 of distance between mould and the substrate.Because this electrolytic solution flows through the perforation of this mould capable of circulationly, therefore can make this nickel dam evenly and apace form and finish.
9. this mould can't be electric excessively with polish lacquer coating or other insulating materials selected for use because of the insulation diamond particle of intermediary, so nickel can not be deposited on this mould or the close diamond particle position of die face.
10. in case nickel dam forms and finishes, and this milling tool and mould is shifted out from electroplating solution, and be separated from each other so that expose the die face of this milling tool.This mould is then reusable.
Because this nickel dam increases to mould from base material, and because this growth program causes polishing particles to append on this base material, influence so expose the profile that the vertical section outward appearance at diamond particle tip can be subjected to this mould die face on the last milling tool finished product.In this way, this a plurality of diamond particles tip can dispose according to the default elevational plot of one on the working surface of this last milling tool finished product.In addition, because the character of this program, the milling tool finished product does not need by afterwards assembling the program that finishes or working and finish.In other words, in some aspects,, promptly finished an operational milling tool finished product simultaneously in case nickel dam formation finishes and this milling tool shifts out from electroplating bath.
Certainly, the reader will be appreciated that above-mentioned example is only for explanation the application of the principles of the present invention.Under the prerequisite of category of the present invention and spirit, the affiliated technical field of this case is had the knack of this skill person and can be made multiple modification and different configurations, and the claim after being attached to then desires to contain these modification and different configurations.Therefore, when the details that is considered to be the most practical and preferred embodiment among the present invention is at present as above disclosed, for the staff who is familiar with this technology, can make the multiple change that has comprised size, material, profile, form, function, method of operating, assembling and used and unrestricted herein according to the notion that is proposed and principle.
Claims (47)
1. a mould reaches fixing a plurality of polishing particles in order to the location, and these a plurality of polishing particles are during an electro-deposition program, are additional on the conductive substrate with electrolysis mode, and this mould includes:
One insulating materials has a die face, and this die face is in order to fixing these a plurality of polishing particles during the electro-deposition of a material, and wherein the material of this electro-deposition is fixed to polishing particles on this conductive substrate.
2. mould as claimed in claim 1 further includes an adhesive agent, and this adhesive agent sticks together on die face with fixing these a plurality of polishing particles.
3. mould as claimed in claim 1, wherein this insulating materials has at least one hole and runs through and be formed on this insulating materials, and this hole passes this mould for an electrolyte circularly from a zone that is positioned at the mould outside and arrives this die face.
4. mould as claimed in claim 3 wherein runs through on this insulating materials and is formed with a plurality of holes.
5. mould as claimed in claim 4, wherein these a plurality of holes dispose according to a default figure.
6. mould as claimed in claim 5 should default figure be a lattice wherein.
7. mould as claimed in claim 1, wherein this die face has a shape, and this shape is to put upside down mutually with an elevational plot that is applied to polishing particles.
8. mould as claimed in claim 7, wherein this die face is smooth haply.
9. mould as claimed in claim 7, wherein this die face is concavity and has at least one recess.
10. mould as claimed in claim 9, wherein the slope of this recess is about 1/1000.
11. mould as claimed in claim 7, wherein this die face is a convex.
12. mould as claimed in claim 7, wherein this die face has a plurality of recesses and protuberance.
13. mould as claimed in claim 1, wherein these a plurality of polishing particles are to be fixed on this die face according to a default horizontal figure.
14. mould as claimed in claim 13, wherein this preset level figure is a lattice figure.
15. mould as claimed in claim 5, wherein these a plurality of polishing particles are to be fixed on this die face the figure complementation of this default figure and this hole according to a default figure.
16. mould as claimed in claim 15, wherein the figure of the figure of polishing particles and hole is respectively a lattice figure.
17. mould as claimed in claim 13 wherein should default horizontal figure makes the polishing particles distribution density at least one specific region of this die face higher, and is higher than all the other regional polishing particles distribution densities of die face.
18. mould as claimed in claim 1, wherein this insulating materials includes a resin material.
19. mould as claimed in claim 18, wherein this resin is an artificial resin.
20. mould as claimed in claim 18, wherein this resin material is a polymeric material.
21. mould as claimed in claim 18, wherein this resin material is selected from one by the wherein a kind of of group that epoxides, lacquer, polish lacquer, acryl polymer and composition thereof constitute.
22. mould as claimed in claim 21, this insulating materials are a polish lacquer.
23. mould as claimed in claim 21, this insulating materials are an acryl polymer.
24. mould as claimed in claim 1, this insulating materials are an elastomeric material.
25. mould as claimed in claim 24, this elastomeric material are natural rubber or artificial rubber.
26. the method for a fabrication tool, this instrument are by an electro-deposition material a plurality of polishing particles to be attached on the base material, wherein this manufacture method includes:
Temporarily will these a plurality of polishing particles be fixed to one according to claim 1 on the die face of mould;
This mould is navigated in the electro-deposition chamber, and with die face towards a base material, wherein these a plurality of polishing particles soon will be additional on this base material with electrolysis mode;
Should a plurality of polishing particles with electrolysis mode, be attached on this base material by an electro-deposition material; And
Remove this mould.
27. manufacture method as claimed in claim 26, wherein this base material includes a conductive material.
28. manufacture method as claimed in claim 27, wherein this conductive material is a stainless steel.
29. manufacture method as claimed in claim 26, wherein this base material is a tool body.
30. manufacture method as claimed in claim 26 further comprises one and removes this base material from this electro-deposition chamber and base material is appended to the step of a tool body.
31. manufacture method as claimed in claim 26, wherein this electro-deposition material is a metal material.
32. manufacture method as claimed in claim 26, wherein this electric metal material is a metal composition material.
33. manufacture method as claimed in claim 32, wherein this metal group material package of becoming a useful person contains at least one element, and this element is to be selected from wherein a kind of by group that nickel, chromium, copper, titanium, tungsten, tin, iron, silver, gold, manganese, magnesium, zinc, aluminium, tantalum, its alloy or its mixture constituted.
34. manufacture method as claimed in claim 33, wherein this metal group material package of becoming a useful person has contained nickel.
35. manufacture method as claimed in claim 31, wherein this metal constituent is made up of a metal.
36. manufacture method as claimed in claim 35, wherein this metal is an element, and this element is selected from wherein a kind of by group that nickel, chromium, copper, titanium, tungsten, tin, iron, silver, gold, manganese, magnesium, zinc, aluminium, tantalum, its alloy or its mixture constituted.
37. manufacture method as claimed in claim 36, this metal are nickel.
38. the instrument by the described manufacture method manufacturing of claim 26, it includes:
One base material, this base material is combined with a plurality of polishing particles by an electro-deposition material, these a plurality of polishing particles have a tip respectively, and these a plurality of polishing particles are most advanced and sophisticated to be disposed according to a default elevational plot, and a part exposes on this electro-deposition material and do not covered by the electro-deposition material.
39. instrument as claimed in claim 38 wherein should default elevational plot be an impartial height figure that makes progress from base material.
40. instrument as claimed in claim 38 should default elevational plot be a convex figure wherein.
41. instrument as claimed in claim 38 should default elevational plot be a concavity figure wherein.
42. instrument as claimed in claim 38 wherein should default elevational plot include a plurality of convexs zone and concave regions simultaneously.
43. instrument as claimed in claim 38, wherein these a plurality of polishing particles further dispose according to a default horizontal figure.
44. instrument as claimed in claim 43 should default horizontal figure be a lattice wherein.
45. instrument as claimed in claim 43 wherein should make the polishing particles distribution density of a specific region on the base material higher by default horizontal figure, and be higher than all the other regional polishing particles distribution densities on this base material.
46. instrument as claimed in claim 36, wherein the order of this electro-deposition material forms the working surface that finishes without any need for back electro-deposition program.
47. an instrument, it includes:
One base material, this base material is combined with a plurality of polishing particles by an electro-deposition material, these a plurality of polishing particles are most advanced and sophisticated to be disposed according to a default horizontal figure, and make a part expose on this electro-deposition material according to a default elevational plot, this electro-deposition material has a working surface that is produced by the electro-deposition program.
Applications Claiming Priority (2)
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|---|---|---|---|
| US11/292,938 | 2005-12-02 | ||
| US11/292,938 US20070128994A1 (en) | 2005-12-02 | 2005-12-02 | Electroplated abrasive tools, methods, and molds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101336147A true CN101336147A (en) | 2008-12-31 |
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ID=38119418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800521572A Pending CN101336147A (en) | 2005-12-02 | 2006-11-30 | Electroplated abrasive tools, methods, and molds |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20070128994A1 (en) |
| CN (1) | CN101336147A (en) |
| TW (1) | TW200800504A (en) |
| WO (1) | WO2007120224A2 (en) |
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| US6368198B1 (en) * | 1999-11-22 | 2002-04-09 | Kinik Company | Diamond grid CMP pad dresser |
| EP0950470B1 (en) * | 1998-04-13 | 2004-11-03 | Toyoda Koki Kabushiki Kaisha | Abrasive tool and the method of producing the same |
| US6409904B1 (en) * | 1998-12-01 | 2002-06-25 | Nutool, Inc. | Method and apparatus for depositing and controlling the texture of a thin film |
| US7201645B2 (en) * | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
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-
2005
- 2005-12-02 US US11/292,938 patent/US20070128994A1/en not_active Abandoned
-
2006
- 2006-11-30 CN CNA2006800521572A patent/CN101336147A/en active Pending
- 2006-11-30 WO PCT/US2006/046029 patent/WO2007120224A2/en active Application Filing
- 2006-12-01 TW TW095144571A patent/TW200800504A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152250A (en) * | 2010-12-29 | 2011-08-17 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
| CN102152250B (en) * | 2010-12-29 | 2015-01-21 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
| CN107471126A (en) * | 2016-06-08 | 2017-12-15 | Kapp 机床有限责任公司 | Manufacture method for the dressing tool of grinding tool |
| CN107471126B (en) * | 2016-06-08 | 2020-09-22 | Kapp 机床有限责任公司 | Method for producing dressing tool for grinding tool |
| TWI644747B (en) * | 2016-09-29 | 2018-12-21 | 逢甲大學 | Electrochemical discharge machining device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007120224A2 (en) | 2007-10-25 |
| TW200800504A (en) | 2008-01-01 |
| US20070128994A1 (en) | 2007-06-07 |
| WO2007120224A3 (en) | 2007-12-27 |
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