JP2018107372A - 半導体装置、半導体装置の製造方法及び電子装置 - Google Patents
半導体装置、半導体装置の製造方法及び電子装置 Download PDFInfo
- Publication number
- JP2018107372A JP2018107372A JP2016254877A JP2016254877A JP2018107372A JP 2018107372 A JP2018107372 A JP 2018107372A JP 2016254877 A JP2016254877 A JP 2016254877A JP 2016254877 A JP2016254877 A JP 2016254877A JP 2018107372 A JP2018107372 A JP 2018107372A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- layer
- semiconductor device
- cavity
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 226
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 25
- 230000003071 parasitic effect Effects 0.000 abstract description 34
- 238000009413 insulation Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 539
- 239000000463 material Substances 0.000 description 67
- 238000000034 method Methods 0.000 description 59
- 230000015572 biosynthetic process Effects 0.000 description 32
- 229910052581 Si3N4 Inorganic materials 0.000 description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 23
- 239000003990 capacitor Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 17
- 230000006866 deterioration Effects 0.000 description 16
- 238000005530 etching Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000007769 metal material Substances 0.000 description 8
- 238000011049 filling Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- WABPQHHGFIMREM-BKFZFHPZSA-N lead-212 Chemical compound [212Pb] WABPQHHGFIMREM-BKFZFHPZSA-N 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000006303 photolysis reaction Methods 0.000 description 3
- 230000015843 photosynthesis, light reaction Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-RNFDNDRNSA-N lead-211 Chemical compound [211Pb] WABPQHHGFIMREM-RNFDNDRNSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- DKCRDQKHMMPWPG-UHFFFAOYSA-N 3-methylpiperidine-2,6-dione Chemical compound CC1CCC(=O)NC1=O DKCRDQKHMMPWPG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/408—Electrodes ; Multistep manufacturing processes therefor with an insulating layer with a particular dielectric or electrostatic property, e.g. with static charges or for controlling trapped charges or moving ions, or with a plate acting on the insulator potential or the insulator charges, e.g. for controlling charges effect or potential distribution in the insulating layer, or with a semi-insulating layer contacting directly the semiconductor surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4821—Bridge structure with air gap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
- H02M1/4208—Arrangements for improving power factor of AC input
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
- H02M5/40—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc
- H02M5/42—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters
- H02M5/44—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac
- H02M5/453—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac using devices of a triode or transistor type requiring continuous application of a control signal
- H02M5/458—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc by static converters using discharge tubes or semiconductor devices to convert the intermediate dc into ac using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/32—Modifications of amplifiers to reduce non-linear distortion
- H03F1/3241—Modifications of amplifiers to reduce non-linear distortion using predistortion circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/32—Modifications of amplifiers to reduce non-linear distortion
- H03F1/3241—Modifications of amplifiers to reduce non-linear distortion using predistortion circuits
- H03F1/3247—Modifications of amplifiers to reduce non-linear distortion using predistortion circuits using feedback acting on predistortion circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/193—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
- H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6683—High-frequency adaptations for monolithic microwave integrated circuit [MMIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Junction Field-Effect Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
図1は半導体装置の一例を示す図である。図1には、半導体装置の一例の要部断面を模式的に図示している。
半導体装置600には、チャネル層(電子走行層)、スペーサ層、電子供給層及びキャップ層等を含む化合物半導体層620が用いられる。
まず、第1の実施の形態について説明する。
化合物半導体層20は、炭化ケイ素(SiC)等の半導体基板20a上にバッファ層20bを介して積層された電子走行層20c、スペーサ層20d、電子供給層20e及びキャップ層20fを含む。
図3(A)〜図3(C)には、上記のHEMT10及びその上層に設けられる絶縁層31及び絶縁層32(並びに絶縁層33及び絶縁層34)を、絶縁層32側から見た時の要部平面レイアウトの一例を模式的に図示している。
開口80を埋める絶縁層35には、例えば、絶縁層32に用いられるSiN等の材料よりも誘電率が低い、Low−k材料等の比較的低誘電率の材料が用いられる。このような材料としては、シルセスキオキサン、例えばメチルシルセスキオキサンを用いることができ、この場合、形成される絶縁層35の内部には、その材料の籠状の分子構造に由来した空孔が形成される。即ち、絶縁層35は、多孔質層となる。このような材料を絶縁層35に用いることで、空洞31aの上方に設けられる絶縁部に起因した寄生容量の発生が抑えられる。更に、絶縁層35で開口80が埋められることで、耐湿性が高められ、空洞31a及びHEMT10への水分の浸入、それによるHEMT10の特性の劣化が抑えられる。
次に、第2の実施の形態について説明する。
図5〜図8は第2の実施の形態に係る半導体装置の形成方法を示す図である。図5(A)〜図5(C)、図6(A)〜図6(C)、図7(A)及び図7(B)、並びに図8(A)及び図8(B)には、それぞれ第2の実施の形態に係る半導体装置の形成方法の、各工程の要部断面を模式的に図示している。
GaN及びAlGaNを用いるGaN系HEMTの場合であれば、まず、SiC等の半導体基板20a上に、例えばMOVPE(Metal Organic Vapor Phase Epitaxy)法により、i−GaNのバッファ層20b及び電子走行層20c、i−AlGaNのスペーサ層20d、n−AlGaNの電子供給層20e、n−GaNのキャップ層20fが順に積層され、化合物半導体層20が形成される。
次いで、電子供給層20e上に、ソース電極又はドレイン電極として用いられる電極12及び電極13が形成される。
その際は、まず、フォトリソグラフィ技術を用いて、絶縁層30上に、ゲート電極11(例えばT型のゲート電極11の脚部)を形成する領域に開口部を有するレジストが形成される。そのレジストをマスクにしたドライエッチング、例えば六フッ化硫黄(SF6)ガスを用いたドライエッチングにより、そのレジストの開口部に露出する絶縁層30が除去される。その後、そのレジストが除去され、ゲート電極11を形成する領域を含む領域に開口部を有するレジストが新たに形成される。そして、全面、即ち新たに形成されたレジストの上面及び開口部内に、ゲート電極11となる金属材料、例えばNi膜及びAu膜が積層されて堆積され、その後、そのレジストがその上面に堆積されたNi膜及びAu膜と共に除去される(リフトオフ法)。これにより、化合物半導体層20のキャップ層20f上に、T型のゲート電極11が形成される。
HEMT10等が形成された化合物半導体層20上に、図5(B)に示すように、犠牲層90が形成される。
その際は、まず、犠牲層90が覆われるように、比較的低誘電率の材料が用いられて、絶縁層31が形成される。例えば、絶縁層31として、多孔質層が形成される。
その際は、例えば、真空中で、絶縁層31を透過する紫外線等の光が、絶縁層31を通して犠牲層90に照射される。犠牲層90は、照射される光によって分解され、ガス化される。ガス化された犠牲層90の成分は、多孔質の絶縁層31の空孔を通じて絶縁層31の外部に排出される。これにより、絶縁層31に空洞31aが形成される。
これらの絶縁層32、絶縁層33及び絶縁層34のうち、SiN等が用いられる絶縁層32及び絶縁層34は、紫外線等の光の透過率が比較的低い。このような絶縁層32及び絶縁層34を含む、絶縁層31上の絶縁層32、絶縁層33及び絶縁層34が、犠牲層90の上方から除去されていることで、紫外線等の光が犠牲層90まで到達し易くなり、犠牲層90の分解、ガス化の効率が高まる。
半導体装置1Aでは、空洞31aの上方からSiN等の比較的高誘電率の絶縁層32及び絶縁層34が除去され、更に、空洞31a内におけるゲート電極11周囲の犠牲層90の残存が抑えられるため、それらに起因した寄生容量の発生が抑えられる。これにより、寄生容量による特性の劣化が抑えられた半導体装置1Aが実現される。
即ち、図6(C)に示した開口80の形成後、犠牲層90を除去することなく、図8(A)に示すように、開口80を絶縁層35で埋める。その後、図8(B)に示すように、犠牲層90を除去し、空洞31aを形成する。絶縁層35には、紫外線等の光の透過率が比較的高く、緻密性が比較的低い多孔質のものが用いられる。このような絶縁層35を用いると、空洞31aの形成(犠牲層90の除去)前に開口80を絶縁層35で埋めても、光を犠牲層90まで到達させてそれを分解、ガス化し、ガス化した成分を絶縁層31及び絶縁層35の空孔を通じて排出することができる。絶縁層35に、絶縁層31よりも空孔率の高い材料を用いると、空孔率の低い材料を用いる場合に比べて、犠牲層90の除去効率を高めることが可能になる。
ここでは、上記第1及び第2の実施の形態で述べた半導体装置1A及び半導体装置1Bの変形例を、第3の実施の形態として説明する。
ここでは、半導体装置の形成方法のいくつかの別例を、第4の実施の形態として説明する。
尚、上記図8(A)及び図8(B)に示した例に従い、開口80の形成後、その開口80を絶縁層35で埋めた後、絶縁層31及び絶縁層35の空孔を通じて犠牲層90を除去し、空洞31aを形成するようにしてもよい。
このように空洞31a、及び開口80を埋める絶縁層35を形成した後に、配線50a及び配線50b等を形成する方法では、図12(B)に示す半導体装置1Baのように、開口80を埋める絶縁層35上に配線50cを形成することもできる。配線50cは、配線50a及び配線50b等と分離された配線でもよいし、配線50a及び配線50b等のいずれかと接続された又は一体の配線でもよい。開口80を埋める絶縁層35上にも配線50cを形成することができるため、半導体装置1Baにおける配線レイアウトの自由度を向上させることが可能になる。
以上の説明では、HEMTのゲート電極の周囲に空洞を設けた半導体装置を例にしたが、上記のような手法を半導体装置の配線層に採用することもできる。このような例を、第5の実施の形態として説明する。
配線111及び配線112は、互いに異なる電位の電気信号が供給される配線でもよいし、互いに同じ電位の電気信号が供給される配線でもよい。
配線111及び配線112の形成後、図17(B)に示すように、配線111及び配線112を覆うように、犠牲層130が形成される。犠牲層130には、紫外線等の光によって分解される材料が用いられる。犠牲層130は、フォトリソグラフィ技術及びエッチング技術を用いて所定の領域(配設領域)、例えば配線111及び配線112の一部又は全部が内包される領域に形成される。
尚、ここでは配線層110を含む半導体装置1E,1Ea,1Fを例示したが、上記のような構成を有する配線層110を、回路基板に適用することもできる。
ここでは、上記のような半導体装置を用いた半導体パッケージを、第6の実施の形態として説明する。
図19に示す半導体パッケージ200は、例えば上記第1の実施の形態で述べた半導体装置1Aが搭載されたリードフレーム210、及びそれらを封止する樹脂220を含む。
半導体装置1Aでは、ゲート電極11の周囲に空洞31aが設けられ、更にその空洞31aの上方の開口80によって比較的高誘電率の絶縁層32が除去されることで、寄生容量が低減され、寄生容量による高周波特性等の特性の劣化が抑えられる。このような高性能の半導体装置が用いられ、高性能の半導体パッケージ200が実現される。
ここでは、上記のような半導体装置を用いた力率改善回路を、第7の実施の形態として説明する。
図20に示す力率改善(Power Factor Correction;PFC)回路300は、スイッチ素子310、ダイオード320、チョークコイル330、コンデンサ340、コンデンサ350、ダイオードブリッジ360、及び交流電源370(AC)を含む。
ここでは、上記のような半導体装置を用いた電源装置を、第8の実施の形態として説明する。
図21に示す電源装置400は、高圧の一次側回路410及び低圧の二次側回路420、並びに一次側回路410と二次側回路420との間に設けられるトランス430を含む。
このような構成を有する電源装置400の、その一次側回路410に含まれるPFC回路300のスイッチ素子310、並びにフルブリッジインバータ回路440のスイッチ素子441〜444に、上記第1〜第5の実施の形態で述べたような半導体装置1A,1B,1C,1D,1E,1F等が用いられる。電源装置400の、二次側回路420のスイッチ素子421〜423には、シリコンを用いた通常のMIS(Metal Insulator Semiconductor)型FET(Field Effect Transistor)が用いられる。
ここでは、上記のような半導体装置を用いた増幅器を、第9の実施の形態として説明する。
図22に示す増幅器500は、ディジタルプレディストーション回路510、ミキサー520、ミキサー530、及びパワーアンプ540が含まれる。
10,610 HEMT
11,611 ゲート電極
12,13,612,613 電極
11a,12a,13a パッド
20,620 化合物半導体層
20a 半導体基板
20b バッファ層
20c 電子走行層
20d スペーサ層
20e 電子供給層
20f キャップ層
21,621 素子分離領域
30,31,32,33,34,35,36,37,38,39,113,114,115,116,630,631,632,633,634 絶縁層
31a,113a,631a 空洞
40a,40b,40c,40d,640a,640b,640c コンタクト部
41a,41b コンタクトホール
50a,50b,50c,111,112,650a,650b 配線
60,660 キャパシタ
61,661 下部電極
62,662 上部電極
80,81,82,120 開口
90,130 犠牲層
100 基板
110 配線層
200 半導体パッケージ
210 リードフレーム
210a ダイパッド
211 ゲートリード
212 ソースリード
213 ドレインリード
220 樹脂
230 ワイヤ
300 PFC回路
310,421,422,423,441,442,443,444 スイッチ素子
320 ダイオード
330 チョークコイル
340,350 コンデンサ
360 ダイオードブリッジ
370 交流電源
400 電源装置
410 一次側回路
420 二次側回路
430 トランス
440 フルブリッジインバータ回路
500 増幅器
510 ディジタルプレディストーション回路
520,530 ミキサー
540 パワーアンプ
Claims (13)
- 基板と、
前記基板上に設けられた第1導体部と、
前記基板上に設けられ、前記第1導体部を覆い、前記第1導体部の周囲に空洞を有する第1絶縁層と、
前記第1絶縁層上に設けられ、前記空洞に対応する部位に開口を有する第2絶縁層と
を含むことを特徴とする半導体装置。 - 前記第1絶縁層は、多孔質であることを特徴とする請求項1に記載の半導体装置。
- 前記第2絶縁層は、前記第1絶縁層よりも誘電率が高いことを特徴とする請求項1又は2に記載の半導体装置。
- 前記開口内に設けられ、前記第2絶縁層よりも誘電率が低い第3絶縁層を含むことを特徴とする請求項1乃至3のいずれかに記載の半導体装置。
- 前記第3絶縁層は、多孔質であることを特徴とする請求項4に記載の半導体装置。
- 前記第3絶縁層上に設けられた第2導体部を含むことを特徴とする請求項4又は5に記載の半導体装置。
- 前記基板は、化合物半導体層であり、
前記第1導体部は、ゲート電極であり、
前記化合物半導体層上の前記ゲート電極の両側に設けられたソース電極及びドレイン電極を含むことを特徴とする請求項1乃至6のいずれかに記載の半導体装置。 - 前記ソース電極及び前記ドレイン電極はそれぞれ、平面視で、少なくとも一部が前記空洞と重複することを特徴とする請求項7に記載の半導体装置。
- 前記基板上に設けられ、前記空洞内に位置する第3導体部を含むことを特徴とする請求項1乃至6のいずれかに記載の半導体装置。
- 前記基板上に設けられ、前記第1絶縁層内に位置する第4導体部を含むことを特徴とする請求項1乃至6のいずれかに記載の半導体装置。
- 基板上に設けられた第1導体部の周囲に犠牲層を形成する工程と、
前記基板上に、前記第1導体部及び前記犠牲層を覆う第1絶縁層を形成する工程と、
前記第1絶縁層上に、前記犠牲層に対応する部位に開口を有する第2絶縁層を形成する工程と、
前記第1絶縁層及び前記開口を通して前記犠牲層を除去し、前記第1導体部の周囲に空洞を形成する工程と
を含むことを特徴とする半導体装置の製造方法。 - 前記開口内に、前記第2絶縁層よりも誘電率が低い第3絶縁層を形成する工程を含むことを特徴とする請求項11に記載の半導体装置の製造方法。
- 基板と、
前記基板上に設けられた第1導体部と、
前記基板上に設けられ、前記第1導体部を覆い、前記第1導体部の周囲に空洞を有する第1絶縁層と、
前記第1絶縁層上に設けられ、前記空洞に対応する部位に開口を有する第2絶縁層と
を含む半導体装置を備えることを特徴とする電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016254877A JP6810350B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置、半導体装置の製造方法及び電子装置 |
US15/798,843 US10276671B2 (en) | 2016-12-28 | 2017-10-31 | Semiconductor device, method for manufacturing semiconductor device, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016254877A JP6810350B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置、半導体装置の製造方法及び電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018107372A true JP2018107372A (ja) | 2018-07-05 |
JP6810350B2 JP6810350B2 (ja) | 2021-01-06 |
Family
ID=62630799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016254877A Active JP6810350B2 (ja) | 2016-12-28 | 2016-12-28 | 半導体装置、半導体装置の製造方法及び電子装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10276671B2 (ja) |
JP (1) | JP6810350B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021124706A1 (ja) * | 2019-12-20 | 2021-06-24 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びその製造方法、並びに電子機器 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108475697A (zh) * | 2015-12-22 | 2018-08-31 | 英特尔公司 | 具有嵌入式电介质间隔的纳米线晶体管 |
KR102177894B1 (ko) * | 2017-04-04 | 2020-11-12 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
JP6370515B1 (ja) * | 2017-11-14 | 2018-08-08 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
CN111863955A (zh) * | 2019-04-25 | 2020-10-30 | 世界先进积体电路股份有限公司 | 半导体结构 |
US10886394B1 (en) * | 2019-06-19 | 2021-01-05 | Vanguard International Semiconductor Corporation | Semiconductor structure |
CN112335039B (zh) * | 2020-07-08 | 2021-12-10 | 英诺赛科(珠海)科技有限公司 | 电子装置和其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209522A (ja) * | 2013-04-16 | 2014-11-06 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP2015046445A (ja) * | 2013-08-27 | 2015-03-12 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3189779B2 (ja) | 1998-03-20 | 2001-07-16 | 日本電気株式会社 | 半導体装置の製造方法 |
JP5186776B2 (ja) * | 2007-02-22 | 2013-04-24 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP5365062B2 (ja) | 2008-05-07 | 2013-12-11 | 富士通株式会社 | 半導体装置及びその製造方法 |
KR101762661B1 (ko) * | 2010-09-17 | 2017-08-04 | 삼성전자주식회사 | 반도체 소자 제조 방법 |
US8735863B2 (en) * | 2011-01-28 | 2014-05-27 | Privatran | Integrated nonvolatile resistive memory elements |
JP5821429B2 (ja) * | 2011-09-01 | 2015-11-24 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
US9975762B2 (en) * | 2013-03-13 | 2018-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked semiconductor structure and method of forming the same |
KR102154112B1 (ko) * | 2013-08-01 | 2020-09-09 | 삼성전자주식회사 | 금속 배선들을 포함하는 반도체 장치 및 그 제조 방법 |
US9725310B2 (en) * | 2013-12-20 | 2017-08-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micro electromechanical system sensor and method of forming the same |
US9365411B2 (en) * | 2014-02-03 | 2016-06-14 | Seiko Epson Corporation | MEMS device and method for manufacturing the same |
JP6237429B2 (ja) | 2014-04-14 | 2017-11-29 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
KR102185235B1 (ko) * | 2014-10-10 | 2020-12-02 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6520197B2 (ja) * | 2015-02-20 | 2019-05-29 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US9935115B2 (en) * | 2015-11-18 | 2018-04-03 | Toshiba Memory Corporation | Nonvolatile semiconductor storage device and method of manufacturing nonvolatile semiconductor storage device |
US9368572B1 (en) * | 2015-11-21 | 2016-06-14 | International Business Machines Corporation | Vertical transistor with air-gap spacer |
US9653347B1 (en) * | 2016-03-31 | 2017-05-16 | International Business Machines Corporation | Vertical air gap subtractive etch back end metal |
-
2016
- 2016-12-28 JP JP2016254877A patent/JP6810350B2/ja active Active
-
2017
- 2017-10-31 US US15/798,843 patent/US10276671B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209522A (ja) * | 2013-04-16 | 2014-11-06 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP2015046445A (ja) * | 2013-08-27 | 2015-03-12 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021124706A1 (ja) * | 2019-12-20 | 2021-06-24 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びその製造方法、並びに電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP6810350B2 (ja) | 2021-01-06 |
US20180182854A1 (en) | 2018-06-28 |
US10276671B2 (en) | 2019-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6810350B2 (ja) | 半導体装置、半導体装置の製造方法及び電子装置 | |
JP6237429B2 (ja) | 化合物半導体装置及びその製造方法 | |
US9685338B2 (en) | Compound semiconductor device and method of manufacturing the same | |
JP5874173B2 (ja) | 化合物半導体装置及びその製造方法 | |
TWI535008B (zh) | 半導體裝置及其製造方法 | |
JP6268366B2 (ja) | 半導体装置 | |
JP2012178416A (ja) | 化合物半導体装置及びその製造方法 | |
JP2012054354A (ja) | 化合物半導体装置及びその製造方法 | |
JP5712583B2 (ja) | 化合物半導体装置及びその製造方法 | |
JP6291997B2 (ja) | 半導体装置の製造方法 | |
JP2017228621A (ja) | 半導体装置及び半導体装置の製造方法 | |
JP2020027911A (ja) | 化合物半導体装置、化合物半導体装置の製造方法及び増幅器 | |
JP6859646B2 (ja) | 化合物半導体装置、化合物半導体装置の製造方法、電源装置、及び増幅器 | |
US10043727B2 (en) | Compound semiconductor device and method of manufacturing the same | |
JP2021052025A (ja) | 半導体装置、半導体装置の製造方法及び電子装置 | |
JP5789959B2 (ja) | 化合物半導体装置及びその製造方法 | |
JP6792135B2 (ja) | 化合物半導体装置及びその製造方法 | |
JP2021114547A (ja) | 半導体装置 | |
JP2021114590A (ja) | 半導体装置、半導体装置の製造方法及び電子装置 | |
JP2016086125A (ja) | 化合物半導体装置及びその製造方法 | |
JP6540361B2 (ja) | 半導体装置及びその製造方法 | |
JP6561559B2 (ja) | 半導体装置及び半導体装置の製造方法 | |
JP2021114588A (ja) | 半導体装置、半導体装置の製造方法及び電子装置 | |
JP2022170890A (ja) | 半導体装置、半導体装置の製造方法及び電子装置 | |
JP2023080485A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190910 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20190917 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190917 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200430 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200519 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201110 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201123 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6810350 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |