JP2018093066A - 基板液処理装置、および基板液処理方法 - Google Patents
基板液処理装置、および基板液処理方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 476
- 239000007788 liquid Substances 0.000 title claims abstract description 159
- 238000003672 processing method Methods 0.000 title claims abstract description 5
- 230000032258 transport Effects 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 93
- 238000001035 drying Methods 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 64
- 230000007723 transport mechanism Effects 0.000 description 56
- 238000005530 etching Methods 0.000 description 51
- 230000007246 mechanism Effects 0.000 description 37
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 32
- 239000007864 aqueous solution Substances 0.000 description 29
- 238000004140 cleaning Methods 0.000 description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000000969 carrier Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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Abstract
Description
3 ロット形成部
4 ロット載置部
5 ロット搬送部(搬送部)
6 ロット処理部
7 基板回転部
8 基板
14 キャリア載置台(載置部)
15 基板搬送機構(搬送部)
23 エッチング処理装置
26 乾燥処理装置(乾燥部)
27 処理槽(液処理槽)
39 液処理部
49 処理液供給ノズル(吐出部)
49a 吐出口
60 ケース
61 支持部
61a 載置面
62 開口部
63 突出部
63a 内周壁
Claims (11)
- 外部から搬入された基板が載置される載置部と、
前記基板の板面が水平方向と直交する姿勢で前記基板を処理液に浸漬させることで、前記基板を処理する液処理部と、
前記載置部と前記液処理部との間で前記基板を搬送する搬送部と、
前記液処理部によって第1処理が行われた前記基板を前記基板の板面に垂直な軸を中心に回転させる回転部と、
を備え
前記回転部は、前記基板を前記第1処理が行われたときと異なる向きに回転させ、
前記搬送部は、
前記液処理部によって前記第1処理が行われた前記基板を前記液処理部から前記回転部に搬送し、前記回転部によって回転された前記基板を前記回転部から前記液処理部に搬送し、
前記液処理部は、
前記回転部によって回転された前記基板を前記処理液に浸漬させることで第2処理を行う
基板液処理装置。 - 前記回転部は、
前記基板を収容した状態で回転するケースを備え、
前記ケースには、前記基板が同一方向から搬入され、および搬出されるように複数の開口部が形成される
請求項1に記載の基板液処理装置。 - 前記回転部は、
前記基板の板面に垂直な軸を中心に前記基板を180度回転させる
請求項1または2に記載の基板液処理装置。 - 前記回転部は、
複数設けられる
請求項1から3のいずれか一つに記載の基板液処理装置。 - 前記回転部は、
前記基板を支持する支持部を備え、
前記支持部は、
前記基板が載置される載置面の外側から、上方に向けて突出し、前記基板の外周端に沿った内周壁が形成される突出部を備える
請求項1から4のいずれか一つに記載の基板液処理装置。 - 前記基板を乾燥させる乾燥部
を備え、
前記搬送部は、
前記乾燥部によって乾燥された前記基板を前記回転部に搬送する
請求項1から5のいずれか一つに記載の基板液処理装置。 - 前記液処理部は、
前記第1処理、および前記第2処理を同一の処理条件で行う
請求項1から6のいずれか一つに記載の基板液処理装置。 - 前記液処理部は、
同一の前記処理液が貯留される複数の液処理漕を備え、
同一の前記基板に対して、前記第1処理、および前記第2処理を同一の前記液処理漕で行う
請求項1から7のいずれか一つに記載の基板液処理装置。 - 前記液処理部は、
同一の前記処理液が貯留される複数の液処理漕を備え、
前記複数の液処理漕の中で、前記基板が浸漬されていない空き状態の前記液処理漕に前記基板を浸漬させる
請求項1から7のいずれか一つに記載の基板液処理装置。 - 前記液処理部は、
前記処理液を前記基板の板面に沿って吐出する吐出部
を備える請求項1から9のいずれか一つに記載の基板液処理装置。 - 外部から搬入された基板が載置される載置部から、前記基板の板面が水平方向と直交する姿勢で前記基板を処理液に浸漬させることで前記基板を処理する液処理部に、搬送部を用いて前記基板を搬送し、
前記液処理部において、前記基板を前記処理液に浸漬させることで第1処理を行い、
前記第1処理が行われた前記基板を、前記液処理部から、前記基板の板面に垂直な軸を中心に前記基板を回転させる回転部に、前記搬送部を用いて搬送し、
前記回転部において、前記基板を前記第1処理が行われたときと異なる向きに回転させ、
前記回転部によって回転された前記基板を、前記搬送部によって前記回転部から前記液処理部に搬送し、
前記液処理部において、前記回転部によって回転された前記基板を前記処理液に浸漬させることで第2処理を行う
基板液処理方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2016235382A JP6762214B2 (ja) | 2016-12-02 | 2016-12-02 | 基板液処理装置、および基板液処理方法 |
KR1020170156521A KR102405523B1 (ko) | 2016-12-02 | 2017-11-22 | 기판 액처리 장치 및 기판 액처리 방법 |
US15/826,886 US10916456B2 (en) | 2016-12-02 | 2017-11-30 | Substrate liquid processing apparatus and substrate liquid processing method |
CN201711247114.6A CN108155115B (zh) | 2016-12-02 | 2017-12-01 | 基板液处理装置和基板液处理方法 |
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JP2016235382A JP6762214B2 (ja) | 2016-12-02 | 2016-12-02 | 基板液処理装置、および基板液処理方法 |
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JP6762214B2 JP6762214B2 (ja) | 2020-09-30 |
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Citations (6)
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JP4832201B2 (ja) * | 2006-07-24 | 2011-12-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
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JP4862903B2 (ja) * | 2009-03-06 | 2012-01-25 | 東京エレクトロン株式会社 | 基板処理装置、濾材の再生方法及び記憶媒体 |
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US10043650B2 (en) * | 2016-09-22 | 2018-08-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for wet chemical bath process |
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JP2000301082A (ja) * | 1999-04-20 | 2000-10-31 | Tokyo Electron Ltd | 処理装置 |
JP2002064075A (ja) * | 2000-06-05 | 2002-02-28 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
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JP6762214B2 (ja) | 2020-09-30 |
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