JP2018019076A - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP2018019076A
JP2018019076A JP2017131560A JP2017131560A JP2018019076A JP 2018019076 A JP2018019076 A JP 2018019076A JP 2017131560 A JP2017131560 A JP 2017131560A JP 2017131560 A JP2017131560 A JP 2017131560A JP 2018019076 A JP2018019076 A JP 2018019076A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
barrier layer
layer
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017131560A
Other languages
English (en)
Japanese (ja)
Inventor
パク、ホ−シク
Ho Sik Park
リ、ドン−クン
Dong Keun Lee
チョイ、ジェ−フン
Jae Hoon Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2018019076A publication Critical patent/JP2018019076A/ja
Priority to JP2022194059A priority Critical patent/JP2023022267A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
JP2017131560A 2016-07-28 2017-07-04 プリント回路基板 Pending JP2018019076A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022194059A JP2023022267A (ja) 2016-07-28 2022-12-05 プリント回路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160096078A KR102534940B1 (ko) 2016-07-28 2016-07-28 인쇄회로기판
KR10-2016-0096078 2016-07-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022194059A Division JP2023022267A (ja) 2016-07-28 2022-12-05 プリント回路基板

Publications (1)

Publication Number Publication Date
JP2018019076A true JP2018019076A (ja) 2018-02-01

Family

ID=61076635

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017131560A Pending JP2018019076A (ja) 2016-07-28 2017-07-04 プリント回路基板
JP2022194059A Pending JP2023022267A (ja) 2016-07-28 2022-12-05 プリント回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022194059A Pending JP2023022267A (ja) 2016-07-28 2022-12-05 プリント回路基板

Country Status (2)

Country Link
JP (2) JP2018019076A (ko)
KR (1) KR102534940B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220067355A (ko) * 2020-11-17 2022-05-24 주식회사 엔피테크놀로지 양면형 연성인쇄회로기판 제조 방법
KR20220067356A (ko) * 2020-11-17 2022-05-24 주식회사 엔피테크놀로지 연성인쇄회로기판 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220098528A (ko) 2021-01-04 2022-07-12 삼성전기주식회사 인쇄회로기판

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214252A (ja) * 2002-12-27 2004-07-29 Sumitomo Bakelite Co Ltd 片面回路基板の製造方法
WO2007069606A1 (ja) * 2005-12-14 2007-06-21 Shinko Electric Industries Co., Ltd. チップ内蔵基板およびチップ内蔵基板の製造方法
JP2008109140A (ja) * 2006-10-25 2008-05-08 Samsung Electro-Mechanics Co Ltd 回路基板及びその製造方法
JP2009033183A (ja) * 2008-09-01 2009-02-12 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板
WO2009101723A1 (ja) * 2008-02-11 2009-08-20 Ibiden Co., Ltd. 電子部品内蔵基板の製造方法
JP2011146477A (ja) * 2010-01-13 2011-07-28 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、並びに半導体パッケージ
JP2012209580A (ja) * 2007-10-05 2012-10-25 Shinko Electric Ind Co Ltd 配線基板及び半導体装置の製造方法
JP2013171939A (ja) * 2012-02-20 2013-09-02 Fujitsu Ltd 配線構造及びその製造方法並びに電子装置及びその製造方法
US20150279815A1 (en) * 2014-03-28 2015-10-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Substrate Having Conductive Columns

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100990575B1 (ko) 2008-07-08 2010-10-29 삼성전기주식회사 미세 패턴을 갖는 인쇄회로기판 및 그 제조 방법
KR102281458B1 (ko) * 2014-06-23 2021-07-27 삼성전기주식회사 소자 내장형 인쇄회로기판, 반도체 패키지 및 그 제조방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214252A (ja) * 2002-12-27 2004-07-29 Sumitomo Bakelite Co Ltd 片面回路基板の製造方法
WO2007069606A1 (ja) * 2005-12-14 2007-06-21 Shinko Electric Industries Co., Ltd. チップ内蔵基板およびチップ内蔵基板の製造方法
JP2008109140A (ja) * 2006-10-25 2008-05-08 Samsung Electro-Mechanics Co Ltd 回路基板及びその製造方法
JP2012209580A (ja) * 2007-10-05 2012-10-25 Shinko Electric Ind Co Ltd 配線基板及び半導体装置の製造方法
WO2009101723A1 (ja) * 2008-02-11 2009-08-20 Ibiden Co., Ltd. 電子部品内蔵基板の製造方法
JP2009033183A (ja) * 2008-09-01 2009-02-12 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板
JP2011146477A (ja) * 2010-01-13 2011-07-28 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、並びに半導体パッケージ
JP2013171939A (ja) * 2012-02-20 2013-09-02 Fujitsu Ltd 配線構造及びその製造方法並びに電子装置及びその製造方法
US20150279815A1 (en) * 2014-03-28 2015-10-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Substrate Having Conductive Columns

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220067355A (ko) * 2020-11-17 2022-05-24 주식회사 엔피테크놀로지 양면형 연성인쇄회로기판 제조 방법
KR20220067356A (ko) * 2020-11-17 2022-05-24 주식회사 엔피테크놀로지 연성인쇄회로기판 제조 방법
KR102425899B1 (ko) 2020-11-17 2022-07-28 주식회사 엔피테크놀로지 연성인쇄회로기판 제조 방법
KR102425898B1 (ko) 2020-11-17 2022-07-28 주식회사 엔피테크놀로지 양면형 연성인쇄회로기판 제조 방법

Also Published As

Publication number Publication date
JP2023022267A (ja) 2023-02-14
KR20180013017A (ko) 2018-02-07
KR102534940B1 (ko) 2023-05-22

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