JP2011139010A - 回路基板およびその製造方法 - Google Patents
回路基板およびその製造方法 Download PDFInfo
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- JP2011139010A JP2011139010A JP2010100677A JP2010100677A JP2011139010A JP 2011139010 A JP2011139010 A JP 2011139010A JP 2010100677 A JP2010100677 A JP 2010100677A JP 2010100677 A JP2010100677 A JP 2010100677A JP 2011139010 A JP2011139010 A JP 2011139010A
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- Prior art keywords
- layer
- insulating layer
- electroless plating
- circuit board
- dielectric layer
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000007772 electroless plating Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 4
- 239000004431 polycarbonate resin Substances 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 12
- 239000000654 additive Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
【解決手段】回路基板の製造方法は、以下のステップを有する。基板の少なくとも1つの表面に誘電層を形成する。誘電層の上に絶縁層を形成する。絶縁層の一部および誘電層の一部を取り除いて、誘電層および絶縁層の中に少なくとも1つのブラインドバイアを形成する。ブラインドバイアの側壁および絶縁層の残りの部分の上に無電解メッキ層を形成する。ここで、絶縁層と無電解メッキ層の間の結合力は、誘電層と無電解メッキ層の間の結合力よりも大きい。パターン化された導電層をメッキして、無電解メッキ層を覆う。
【選択図】図1E
Description
100 基板
100a、100b 表面
102 電気接続パッド
104 パターン化された回路
110 誘電層
120 絶縁層
130、130a 無電解メッキ層
140 パターン化された導電層
150 パターン化されたフォトレジスト層
152 開口
C ブラインドバイア
Claims (19)
- 基板の少なくとも1つの表面に誘電層を形成することと、
前記誘電層の上に絶縁層を形成することと、
前記絶縁層の一部および前記誘電層の一部を取り除いて、前記誘電層および前記絶縁層の中に少なくとも1つのブラインドバイアを形成することと、
前記ブラインドバイアの側壁および前記絶縁層の残りの部分の上に無電解メッキ層を形成することと、
パターン化された導電層をメッキして、前記無電解メッキ層を覆うことと
を含み、前記絶縁層と前記無電解メッキ層の間の結合力が、前記誘電層と前記無電解メッキ層の間の結合力よりも大きい回路基板の製造方法。 - 前記誘電層が、熱硬化性樹脂を含む請求項1記載の製造方法。
- 前記誘電層が、エポキシ樹脂またはガラス繊維強化エポキシ樹脂を含む請求項2記載の製造方法。
- 前記絶縁層が、熱可塑性樹脂を含む請求項1記載の製造方法。
- 前記絶縁層が、ポリカーボネート樹脂、ポリエステル樹脂、またはポリイミド樹脂を含む請求項4記載の製造方法。
- 前記誘電層の上に前記絶縁層を形成する前記ステップの後に、前記絶縁層に対して表面粗化処理を行うことをさらに含む請求項1記載の製造方法。
- 前記絶縁層を形成する方法が、コーティングプロセスまたはインクジェット印刷プロセスを行うことを含む請求項1記載の製造方法。
- 前記少なくとも1つのブラインドバイアを形成する方法が、レーザ穴あけプロセスを行うことを含む請求項1記載の製造方法。
- 前記少なくとも1つのブラインドバイアを形成する前記ステップが、さらに、前記ブラインドバイアの下に配置された電気接続パッドを露出して、前記電気接続パッドを前記基板の前記表面に配置することを含む請求項1記載の製造方法。
- 前記パターン化された導電層をメッキする前記ステップの前に、前記無電解メッキ層の上にパターン化されたフォトレジスト層を形成することをさらに含む請求項1記載の製造方法。
- 前記パターン化された導電層をメッキする前記ステップの後に、前記パターン化されたフォトレジスト層および前記パターン化された導電層によって覆われていない前記無電解メッキ層を取り除くことをさらに含む請求項10記載の製造方法。
- 基板と、
前記基板の少なくとも1つの表面に配置された誘電層と、
前記誘電層の上に配置された絶縁層と、
前記絶縁層の一部および少なくとも1つのブラインドバイアの側壁を覆う無電解メッキ層と、
前記無電解メッキ層の上、および前記ブラインドバイアの中に配置されたパターン化された導電層と
を含み、前記ブラインドバイアが前記誘電層および前記絶縁層の中に形成され、前記絶縁層と前記無電解メッキ層の間の結合力が、前記誘電層と前記無電解メッキ層の間の結合力よりも大きい回路基板。 - 前記誘電層が、熱硬化性樹脂を含む請求項12記載の回路基板。
- 前記誘電層が、エポキシ樹脂またはガラス繊維強化エポキシ樹脂を含む請求項13記載の回路基板。
- 前記絶縁層が、熱可塑性樹脂を含む請求項12記載の回路基板。
- 前記絶縁層が、ポリカーボネート樹脂、ポリエステル樹脂、またはポリイミド樹脂を含む請求項15記載の回路基板。
- 前記無電解メッキ層の材料が、Cu、Ni、Ag、Cr、およびSnから成る群から選ばれた金属である請求項12記載の回路基板。
- 前記パターン化された導電層が、Cuを含む請求項12記載の回路基板。
- 前記基板の表面が、その上に電気接続パッドを有し、前記パターン化された導電層が、前記ブラインドバイアを介して前記電気接続パッドに電気的に接続された請求項12記載の回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98146204A TWI471073B (zh) | 2009-12-31 | 2009-12-31 | 線路基板及其製作方法 |
TW098146204 | 2009-12-31 |
Publications (3)
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JP2011139010A true JP2011139010A (ja) | 2011-07-14 |
JP2011139010A5 JP2011139010A5 (ja) | 2012-07-05 |
JP5165723B2 JP5165723B2 (ja) | 2013-03-21 |
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JP2010100677A Active JP5165723B2 (ja) | 2009-12-31 | 2010-04-26 | 回路基板およびその製造方法 |
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US (1) | US8247705B2 (ja) |
JP (1) | JP5165723B2 (ja) |
TW (1) | TWI471073B (ja) |
Cited By (1)
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KR20130141372A (ko) * | 2012-06-15 | 2013-12-26 | 신꼬오덴기 고교 가부시키가이샤 | 배선 기판 및 그 제조 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201304640A (zh) * | 2011-07-08 | 2013-01-16 | Kinsus Interconnect Tech Corp | 電路載板導電凸塊的製作方法 |
CN102905474B (zh) * | 2011-07-28 | 2015-09-30 | 景硕科技股份有限公司 | 电路载板导电凸块的制作方法 |
KR20130065216A (ko) * | 2011-12-09 | 2013-06-19 | 삼성전기주식회사 | 다층 인쇄회로기판 및 그 제조방법 |
CN105491796B (zh) * | 2014-10-08 | 2019-02-22 | 深圳市昶东鑫线路板有限公司 | 电路板的制作方法 |
Citations (1)
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JP2004189981A (ja) * | 2002-12-13 | 2004-07-08 | Kanegafuchi Chem Ind Co Ltd | 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法 |
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IT1256647B (it) | 1992-12-11 | 1995-12-12 | Montecatini Tecnologie Srl | Procedimento per la preparazione di (co) polimeri a larga distribuzione di pesi molecolari dell'etilene. |
TW296436B (ja) | 1996-04-09 | 1997-01-21 | Matsushita Electric Ind Co Ltd | |
TWI253714B (en) * | 2004-12-21 | 2006-04-21 | Phoenix Prec Technology Corp | Method for fabricating a multi-layer circuit board with fine pitch |
JP2007059689A (ja) | 2005-08-25 | 2007-03-08 | Shinko Electric Ind Co Ltd | ガラスクロス含有樹脂層を含む構造の積層製品及びその製造方法 |
TWI358979B (en) * | 2008-04-23 | 2012-02-21 | Mutual Tek Ind Co Ltd | Printed circuit board with embedded electronic com |
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- 2010-03-05 US US12/718,226 patent/US8247705B2/en active Active
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Patent Citations (1)
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JP2004189981A (ja) * | 2002-12-13 | 2004-07-08 | Kanegafuchi Chem Ind Co Ltd | 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130141372A (ko) * | 2012-06-15 | 2013-12-26 | 신꼬오덴기 고교 가부시키가이샤 | 배선 기판 및 그 제조 방법 |
JP2014003054A (ja) * | 2012-06-15 | 2014-01-09 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
KR102049327B1 (ko) * | 2012-06-15 | 2019-11-28 | 신꼬오덴기 고교 가부시키가이샤 | 배선 기판 및 그 제조 방법 |
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Publication number | Publication date |
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US20110155427A1 (en) | 2011-06-30 |
TW201124026A (en) | 2011-07-01 |
US8247705B2 (en) | 2012-08-21 |
JP5165723B2 (ja) | 2013-03-21 |
TWI471073B (zh) | 2015-01-21 |
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