JP2018012180A - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP2018012180A JP2018012180A JP2016144144A JP2016144144A JP2018012180A JP 2018012180 A JP2018012180 A JP 2018012180A JP 2016144144 A JP2016144144 A JP 2016144144A JP 2016144144 A JP2016144144 A JP 2016144144A JP 2018012180 A JP2018012180 A JP 2018012180A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- holding
- suction
- workpiece
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 128
- 238000004891 communication Methods 0.000 claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 description 18
- 230000001681 protective effect Effects 0.000 description 17
- 238000007789 sealing Methods 0.000 description 9
- 239000012530 fluid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/06—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/08—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing combined with fluid systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
3:保持手段
30:保持テーブル 300:保持部 300a:保持面
301:枠体 301a:枠体の上面中の一段低い方の上面 301c:吸引路
301d:通水路 301e:吸引口
303:研削水吸引部
31:回転軸 311:第1の吸引路 312:第2の吸引路
33:ロータリージョイント 330:軸受け 331、332:連通路
333、334:環状溝 331a、332a:配管
35:回転手段 350:駆動軸 351:モータ 352:駆動プーリ
353:無端ベルト 354:従動プーリ
36:メカニカルシール 39:カバー
5:研削送り手段 50:ボールネジ 51:ガイドレール 52:モータ
53:昇降板 54:ホルダ
60:三方電磁弁 61:吸引源 62:エア供給源
7:研削手段 70:回転軸 70a、70b:流路 71:ハウジング 72:モータ
73:マウント 74:研削ホイール 740:研削砥石 741:ホイール基台
8:研削水供給手段 80:研削水供給源 81:配管
W:被加工物 Wa:被加工物の表面 Wb:被加工物の裏面 T1:保護テープ
A:着脱領域 B:研削領域
W1:被加工物 T2:保護テープ F:環状フレーム
30A:保持テーブル 307:枠体 307b:枠体の基部 307c:平板部
307d:環状保持部 307e:環状の外壁部 307f:環状凹み部
Claims (1)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物に研削水を供給しながら研削砥石で研削する研削手段と、を備える研削装置であって、
該保持手段は、
被加工物を吸引保持する保持部と該保持部の外側で研削水を吸引する研削水吸引部とを備える保持テーブルと、該保持テーブルの底面側の中央に一端を固定した回転軸と、該回転軸を囲繞する筒状のロータリージョイントと、該回転軸を回転させる回転手段と、を備え、
該回転軸には、該保持テーブルの該保持部に連通する第1の吸引路と該研削水吸引部に連通する第2の吸引路とを備え、
該ロータリージョイントには、該第1の吸引路と該第2の吸引路とを少なくとも吸引源に連通させる連通路を備え、
該回転軸と該ロータリージョイントとの間に、該第2の吸引路に流入する研削水を介在させる研削装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016144144A JP6792363B2 (ja) | 2016-07-22 | 2016-07-22 | 研削装置 |
TW106119313A TWI727056B (zh) | 2016-07-22 | 2017-06-09 | 研磨裝置 |
KR1020170083148A KR102220850B1 (ko) | 2016-07-22 | 2017-06-30 | 연삭 장치 |
MYPI2017702524A MY187029A (en) | 2016-07-22 | 2017-07-10 | Grinding apparatus |
SG10201705676VA SG10201705676VA (en) | 2016-07-22 | 2017-07-11 | Grinding apparatus |
CN201710594044.5A CN107639530B (zh) | 2016-07-22 | 2017-07-20 | 磨削装置 |
DE102017212468.7A DE102017212468B4 (de) | 2016-07-22 | 2017-07-20 | Schleifvorrichtung |
US15/655,964 US10343248B2 (en) | 2016-07-22 | 2017-07-21 | Grinding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016144144A JP6792363B2 (ja) | 2016-07-22 | 2016-07-22 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018012180A true JP2018012180A (ja) | 2018-01-25 |
JP6792363B2 JP6792363B2 (ja) | 2020-11-25 |
Family
ID=60890541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016144144A Active JP6792363B2 (ja) | 2016-07-22 | 2016-07-22 | 研削装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10343248B2 (ja) |
JP (1) | JP6792363B2 (ja) |
KR (1) | KR102220850B1 (ja) |
CN (1) | CN107639530B (ja) |
DE (1) | DE102017212468B4 (ja) |
MY (1) | MY187029A (ja) |
SG (1) | SG10201705676VA (ja) |
TW (1) | TWI727056B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019198931A (ja) * | 2018-05-17 | 2019-11-21 | 株式会社ディスコ | 保持テーブルの形成方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6389449B2 (ja) * | 2015-08-21 | 2018-09-12 | 信越半導体株式会社 | 研磨装置 |
US10096460B2 (en) * | 2016-08-02 | 2018-10-09 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of wafer thinning using grinding phase and separation phase |
JPWO2018092520A1 (ja) * | 2016-11-18 | 2019-10-17 | Agc株式会社 | 曲面板の加工装置、および外周部が加工された曲面板の製造方法 |
JP7096674B2 (ja) * | 2018-01-31 | 2022-07-06 | 株式会社ディスコ | 研削研磨装置及び研削研磨方法 |
JP7032217B2 (ja) * | 2018-04-05 | 2022-03-08 | 株式会社ディスコ | 研磨装置 |
CN109093518B (zh) * | 2018-09-11 | 2024-05-03 | 陕西富泰工业材料科技有限公司 | 一种金刚石砂轮用安装保护装置 |
CN109605223B (zh) * | 2019-01-15 | 2024-09-27 | 山东一唯自动化有限公司 | 一种万向浮动恒力打磨装置 |
JP7118558B2 (ja) * | 2019-01-17 | 2022-08-16 | 株式会社ディスコ | 被加工物の加工方法 |
CN112276752B (zh) * | 2020-10-28 | 2021-11-16 | 台州北平机床有限公司 | 立式磨床 |
CN114454024B (zh) * | 2021-03-02 | 2023-04-25 | 华中科技大学 | 晶圆加工设备 |
JP2023108931A (ja) * | 2022-01-26 | 2023-08-07 | 株式会社ディスコ | チャックテーブル及び研削装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10303152A (ja) * | 1997-04-28 | 1998-11-13 | Nec Corp | 自動研磨装置 |
JPH11254298A (ja) * | 1998-03-06 | 1999-09-21 | Speedfam Co Ltd | スラリー循環供給式平面研磨装置 |
JP2001287141A (ja) * | 2000-04-07 | 2001-10-16 | Disco Abrasive Syst Ltd | 研削装置 |
JP2007260850A (ja) * | 2006-03-29 | 2007-10-11 | Okamoto Machine Tool Works Ltd | 半導体基板の平坦化装置および平坦化方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103651U (ja) * | 1983-12-19 | 1985-07-15 | シチズン時計株式会社 | 真空吸着台 |
US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
US5665249A (en) * | 1994-10-17 | 1997-09-09 | Xerox Corporation | Micro-electromechanical die module with planarized thick film layer |
JP3923107B2 (ja) * | 1995-07-03 | 2007-05-30 | 株式会社Sumco | シリコンウェーハの製造方法およびその装置 |
KR100189970B1 (ko) * | 1995-08-07 | 1999-06-01 | 윤종용 | 웨이퍼 연마장치 |
US5658185A (en) * | 1995-10-25 | 1997-08-19 | International Business Machines Corporation | Chemical-mechanical polishing apparatus with slurry removal system and method |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US6190236B1 (en) * | 1996-10-16 | 2001-02-20 | Vlsi Technology, Inc. | Method and system for vacuum removal of chemical mechanical polishing by-products |
US5809987A (en) * | 1996-11-26 | 1998-09-22 | Micron Technology,Inc. | Apparatus for reducing damage to wafer cutting blades during wafer dicing |
JP3348429B2 (ja) * | 1996-12-26 | 2002-11-20 | 信越半導体株式会社 | 薄板ワーク平面研削方法 |
US5964653A (en) * | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
KR100286980B1 (ko) * | 1998-02-11 | 2001-04-16 | 윤종용 | 웨이퍼 연마 설비 및 웨이퍼 연마 방법 |
US6168683B1 (en) * | 1998-02-24 | 2001-01-02 | Speedfam-Ipec Corporation | Apparatus and method for the face-up surface treatment of wafers |
JP3045233B2 (ja) * | 1998-10-16 | 2000-05-29 | 株式会社東京精密 | ウェーハ研磨装置 |
JP2000237955A (ja) * | 1999-02-18 | 2000-09-05 | Speedfam-Ipec Co Ltd | 端面研磨装置におけるウエハ吸着部への液体の供給および真空引き機構 |
US6227950B1 (en) * | 1999-03-08 | 2001-05-08 | Speedfam-Ipec Corporation | Dual purpose handoff station for workpiece polishing machine |
JP3560144B2 (ja) * | 2000-06-19 | 2004-09-02 | 日本ピラー工業株式会社 | 多流路形ロータリジョイント |
JP4367823B2 (ja) | 2002-06-20 | 2009-11-18 | イーグル工業株式会社 | ロータリージョイント |
TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
CN100467210C (zh) * | 2004-03-25 | 2009-03-11 | 揖斐电株式会社 | 真空卡盘和吸附板 |
KR101004434B1 (ko) * | 2008-11-26 | 2010-12-28 | 세메스 주식회사 | 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법 |
JP2010153585A (ja) * | 2008-12-25 | 2010-07-08 | Ebara Corp | 基板保持具および基板保持方法 |
JP6087565B2 (ja) * | 2012-10-03 | 2017-03-01 | 株式会社ディスコ | 研削装置および研削方法 |
JP2014079838A (ja) * | 2012-10-16 | 2014-05-08 | Disco Abrasive Syst Ltd | 研削装置 |
JP6340277B2 (ja) * | 2014-07-18 | 2018-06-06 | 株式会社ディスコ | 加工装置 |
KR102330997B1 (ko) * | 2015-06-01 | 2021-11-26 | 가부시키가이샤 에바라 세이사꾸쇼 | 처리 대상물을 보유 지지하기 위한 테이블 및 당해 테이블을 갖는 처리 장치 |
-
2016
- 2016-07-22 JP JP2016144144A patent/JP6792363B2/ja active Active
-
2017
- 2017-06-09 TW TW106119313A patent/TWI727056B/zh active
- 2017-06-30 KR KR1020170083148A patent/KR102220850B1/ko active IP Right Grant
- 2017-07-10 MY MYPI2017702524A patent/MY187029A/en unknown
- 2017-07-11 SG SG10201705676VA patent/SG10201705676VA/en unknown
- 2017-07-20 CN CN201710594044.5A patent/CN107639530B/zh active Active
- 2017-07-20 DE DE102017212468.7A patent/DE102017212468B4/de active Active
- 2017-07-21 US US15/655,964 patent/US10343248B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10303152A (ja) * | 1997-04-28 | 1998-11-13 | Nec Corp | 自動研磨装置 |
JPH11254298A (ja) * | 1998-03-06 | 1999-09-21 | Speedfam Co Ltd | スラリー循環供給式平面研磨装置 |
JP2001287141A (ja) * | 2000-04-07 | 2001-10-16 | Disco Abrasive Syst Ltd | 研削装置 |
JP2007260850A (ja) * | 2006-03-29 | 2007-10-11 | Okamoto Machine Tool Works Ltd | 半導体基板の平坦化装置および平坦化方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019198931A (ja) * | 2018-05-17 | 2019-11-21 | 株式会社ディスコ | 保持テーブルの形成方法 |
JP7140544B2 (ja) | 2018-05-17 | 2022-09-21 | 株式会社ディスコ | 保持テーブルの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102220850B1 (ko) | 2021-02-25 |
US10343248B2 (en) | 2019-07-09 |
JP6792363B2 (ja) | 2020-11-25 |
US20180021911A1 (en) | 2018-01-25 |
SG10201705676VA (en) | 2018-02-27 |
MY187029A (en) | 2021-08-26 |
CN107639530B (zh) | 2021-05-25 |
CN107639530A (zh) | 2018-01-30 |
TWI727056B (zh) | 2021-05-11 |
DE102017212468A1 (de) | 2018-01-25 |
TW201808528A (zh) | 2018-03-16 |
DE102017212468B4 (de) | 2024-02-29 |
KR20180010979A (ko) | 2018-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2018012180A (ja) | 研削装置 | |
CN107756238B (zh) | 研磨装置 | |
KR102310075B1 (ko) | 척테이블과 연삭 장치 | |
KR102466078B1 (ko) | 척 테이블 기구 | |
CN107887313B (zh) | 加工装置 | |
JP6049183B2 (ja) | 研削装置 | |
KR101995597B1 (ko) | 절삭 장치의 척테이블 | |
JP2021024036A (ja) | エッジトリミング装置 | |
JP6767803B2 (ja) | 加工装置 | |
TW202305923A (zh) | 加工裝置 | |
JP6534861B2 (ja) | 研削装置 | |
KR102717934B1 (ko) | 척 테이블 | |
JP7045212B2 (ja) | 研削装置 | |
JP2017213628A (ja) | 切削装置 | |
JP2023108931A (ja) | チャックテーブル及び研削装置 | |
KR20140055984A (ko) | 가공 장치 | |
JP2022015497A (ja) | ウェーハを吸引保持するチャックテーブル、及びウェーハのハーフカット方法 | |
JP7529387B2 (ja) | 被加工物の研削方法 | |
JP2023008104A (ja) | 板状ワークを吸引保持するチャックテーブル、チャックテーブルを備える加工装置、及び加工装置を用いた板状ワークの加工方法 | |
TW202330191A (zh) | 磨削裝置 | |
JP2022117656A (ja) | 研削ホイール、及びウェーハの研削方法 | |
JP5460344B2 (ja) | 研削装置 | |
JP2016154170A (ja) | 研削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190523 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200604 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200623 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200818 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201013 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201106 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6792363 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |