JPS60103651U - 真空吸着台 - Google Patents

真空吸着台

Info

Publication number
JPS60103651U
JPS60103651U JP1983195273U JP19527383U JPS60103651U JP S60103651 U JPS60103651 U JP S60103651U JP 1983195273 U JP1983195273 U JP 1983195273U JP 19527383 U JP19527383 U JP 19527383U JP S60103651 U JPS60103651 U JP S60103651U
Authority
JP
Japan
Prior art keywords
vacuum suction
suction table
porous material
firing
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983195273U
Other languages
English (en)
Inventor
勲 小山
初瀬　利和
Original Assignee
シチズン時計株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シチズン時計株式会社 filed Critical シチズン時計株式会社
Priority to JP1983195273U priority Critical patent/JPS60103651U/ja
Priority to US06/671,676 priority patent/US4597228A/en
Priority to DE8484308420T priority patent/DE3476348D1/de
Priority to EP84308420A priority patent/EP0147094B1/en
Publication of JPS60103651U publication Critical patent/JPS60103651U/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案の一実施例を示す断面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. （１）半導体ウェハなどの被吸着部材を真空吸引により
    密着させる平面状の吸着面を有する真空吸着台において
    、真空吸着台本体は多孔質物質の焼成により形成されて
    おり、被吸着部材の載置される平面状の吸着部を除（外
    縁部は前記吸着部を包囲する如く通気孔のない接着剤又
    は結合剤によって形成したことを特徴とする真空吸着（
    ２）外縁部は無機質の粒状物質の混在した接着剤又は結
    合剤によって形成されていることを特徴とする実用新案
    登録請求の範囲第１項記載の真空吸着台。
JP1983195273U 1983-12-19 1983-12-19 真空吸着台 Pending JPS60103651U (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1983195273U JPS60103651U (ja) 1983-12-19 1983-12-19 真空吸着台
US06/671,676 US4597228A (en) 1983-12-19 1984-11-15 Vacuum suction device
DE8484308420T DE3476348D1 (en) 1983-12-19 1984-12-04 Vacuum suction device
EP84308420A EP0147094B1 (en) 1983-12-19 1984-12-04 Vacuum suction device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983195273U JPS60103651U (ja) 1983-12-19 1983-12-19 真空吸着台

Publications (1)

Publication Number Publication Date
JPS60103651U true JPS60103651U (ja) 1985-07-15

Family

ID=16338413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983195273U Pending JPS60103651U (ja) 1983-12-19 1983-12-19 真空吸着台

Country Status (4)

Country Link
US (1) US4597228A (ja)
EP (1) EP0147094B1 (ja)
JP (1) JPS60103651U (ja)
DE (1) DE3476348D1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028418A (ja) * 2012-07-31 2014-02-13 Mitsuboshi Diamond Industrial Co Ltd 吸着テーブルの製造方法並びに吸着テーブル

Families Citing this family (46)

* Cited by examiner, † Cited by third party
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JPS63210148A (ja) * 1987-02-26 1988-08-31 Nikko Rika Kk 真空チヤツク用プラスチツクス焼結体
SE460955B (sv) * 1987-12-18 1989-12-11 Kommanditbolaget Cold Isostati Saett vid framstaellning av en roerformig pulverpresskropp samt en foer genomfoerande av saettet avsedd anordning
JP2719855B2 (ja) * 1991-05-24 1998-02-25 信越半導体株式会社 ウエーハ外周の鏡面面取り装置
DE4335980C2 (de) * 1993-10-21 1998-09-10 Wacker Siltronic Halbleitermat Verfahren zum Positionieren einer Werkstückhalterung
US5674115A (en) * 1994-07-06 1997-10-07 Sony Corporation Apparatus for grinding a master disc
JP3055401B2 (ja) * 1994-08-29 2000-06-26 信越半導体株式会社 ワークの平面研削方法及び装置
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
KR100189970B1 (ko) * 1995-08-07 1999-06-01 윤종용 웨이퍼 연마장치
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
US6126520A (en) * 1996-10-07 2000-10-03 Raytheon Company Fixture and methodology for coupling an optical component to a machine
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5809987A (en) * 1996-11-26 1998-09-22 Micron Technology,Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
JP3348429B2 (ja) * 1996-12-26 2002-11-20 信越半導体株式会社 薄板ワーク平面研削方法
JPH10193260A (ja) * 1996-12-27 1998-07-28 Shin Etsu Handotai Co Ltd ウエーハ保持治具
DE19722679A1 (de) * 1997-05-30 1998-12-03 Wacker Siltronic Halbleitermat Scheibenhalter und Verfahren zur Herstellung einer Halbleiterscheibe
US5964646A (en) * 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
JP2968784B1 (ja) * 1998-06-19 1999-11-02 日本電気株式会社 研磨方法およびそれに用いる装置
US6358129B2 (en) * 1998-11-11 2002-03-19 Micron Technology, Inc. Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
US6173948B1 (en) * 1999-01-20 2001-01-16 International Business Machines Corporation Dimensional compensating vacuum fixture
JP3623122B2 (ja) * 1999-02-12 2005-02-23 信越半導体株式会社 研磨用ワーク保持盤およびワークの研磨装置ならびにワークの研磨方法
US6112735A (en) * 1999-03-02 2000-09-05 Micron Technology, Inc. Complete blade and wafer handling and support system without tape
FR2802340B1 (fr) 1999-12-13 2003-09-05 Commissariat Energie Atomique Structure comportant des cellules photovoltaiques et procede de realisation
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
JP2004022899A (ja) * 2002-06-18 2004-01-22 Shinko Electric Ind Co Ltd 薄シリコンウエーハの加工方法
US20060086703A1 (en) * 2004-08-18 2006-04-27 Ling Liu System and method for singulating a substrate
JP4350695B2 (ja) * 2004-12-01 2009-10-21 株式会社フューチャービジョン 処理装置
US7434453B2 (en) * 2005-07-08 2008-10-14 General Electric Company Vacuum-assisted fixture for holding a part
CN1730239B (zh) * 2005-08-08 2010-04-07 罗淼 一种窄条玻璃的磨削方法
US20100024968A1 (en) * 2008-07-30 2010-02-04 United Technologies Corporation Adhesive installation tool
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
US10300569B2 (en) * 2014-10-14 2019-05-28 Technical Tooling L.L.C. Method for fabricating vacuum fixturing using granular media
US10933594B2 (en) * 2014-10-14 2021-03-02 Technical Tooling LLC Method for forming a part using a layup tool
KR20170016547A (ko) * 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
JP6792363B2 (ja) * 2016-07-22 2020-11-25 株式会社ディスコ 研削装置
JP6815138B2 (ja) * 2016-09-06 2021-01-20 株式会社ディスコ 吸引保持システム
TWI613449B (zh) * 2016-12-30 2018-02-01 致茂電子股份有限公司 吸附式測試裝置
US10780549B2 (en) * 2017-12-26 2020-09-22 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Polishing device
KR102420162B1 (ko) * 2018-02-09 2022-07-12 삼성전자주식회사 진공 척 및 이를 포함하는 반도체 제조 장치
US11529717B2 (en) * 2019-03-08 2022-12-20 The Boeing Company Supporting a contoured sheet of material during machining operations
CN114799345A (zh) * 2021-01-18 2022-07-29 广东博智林机器人有限公司 切割机器人
TWI770906B (zh) * 2021-03-26 2022-07-11 環球晶圓股份有限公司 晶圓表面缺陷檢測方法及其裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856441B2 (ja) * 1978-12-29 1983-12-15 三菱電機株式会社 照明装置

Family Cites Families (8)

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US2756644A (en) * 1953-09-04 1956-07-31 Gordon N Steele Vacuum fixture
DE1237942B (de) * 1962-07-19 1967-03-30 Siemens Ag Vorrichtung zum Haltern scheibenfoermiger Werkstuecke aus Halbleitermaterial durch Ansaugen
US3294392A (en) * 1963-05-31 1966-12-27 Dunham Tool Company Inc Vacuum chucking
DE1291698B (de) * 1965-06-14 1969-03-27 Siemens Ag Vorrichtung zur Halterung von Werkstuecken
US3652075A (en) * 1969-11-10 1972-03-28 Sheldon Thompson Vacuum chuck and related apparatus and methods
DD145824A1 (de) * 1979-08-10 1981-01-07 Ulf Weber Einrichtung zur vakuumaufspannung von halbleiterscheiben
US4521995A (en) * 1980-05-23 1985-06-11 Disco Co., Ltd. Wafer attracting and fixing device
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856441B2 (ja) * 1978-12-29 1983-12-15 三菱電機株式会社 照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028418A (ja) * 2012-07-31 2014-02-13 Mitsuboshi Diamond Industrial Co Ltd 吸着テーブルの製造方法並びに吸着テーブル

Also Published As

Publication number Publication date
EP0147094B1 (en) 1989-01-25
EP0147094A3 (en) 1986-09-17
US4597228A (en) 1986-07-01
EP0147094A2 (en) 1985-07-03
DE3476348D1 (en) 1989-03-02

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