JP2017538293A - 歪みの少ないセラミックの支持プレート及び製造のための方法 - Google Patents

歪みの少ないセラミックの支持プレート及び製造のための方法 Download PDF

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Publication number
JP2017538293A
JP2017538293A JP2017531824A JP2017531824A JP2017538293A JP 2017538293 A JP2017538293 A JP 2017538293A JP 2017531824 A JP2017531824 A JP 2017531824A JP 2017531824 A JP2017531824 A JP 2017531824A JP 2017538293 A JP2017538293 A JP 2017538293A
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Prior art keywords
layer
support plate
ceramic
tension
glass
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JP2017531824A
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Japanese (ja)
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JP2017538293A5 (enExample
Inventor
ミヤウチ、ヤスハル
ドゥデセク、パボル
パイヤー、エトムント
プトミヒ、ギュンター
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スナップトラック・インコーポレーテッド
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Publication of JP2017538293A5 publication Critical patent/JP2017538293A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2017531824A 2014-12-16 2015-12-15 歪みの少ないセラミックの支持プレート及び製造のための方法 Withdrawn JP2017538293A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014118749.0A DE102014118749A1 (de) 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung
DE102014118749.0 2014-12-16
PCT/EP2015/079813 WO2016096870A1 (de) 2014-12-16 2015-12-15 Verzugsarme keramische trägerplatte und verfahren zur herstellung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020126497A Division JP2020184646A (ja) 2014-12-16 2020-07-27 歪みの少ないセラミックの支持プレート及び製造のための方法

Publications (2)

Publication Number Publication Date
JP2017538293A true JP2017538293A (ja) 2017-12-21
JP2017538293A5 JP2017538293A5 (enExample) 2018-12-27

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JP2017531824A Withdrawn JP2017538293A (ja) 2014-12-16 2015-12-15 歪みの少ないセラミックの支持プレート及び製造のための方法
JP2020126497A Pending JP2020184646A (ja) 2014-12-16 2020-07-27 歪みの少ないセラミックの支持プレート及び製造のための方法

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Country Link
US (1) US20170332491A1 (enExample)
EP (1) EP3234957A1 (enExample)
JP (2) JP2017538293A (enExample)
CN (1) CN107004504A (enExample)
DE (1) DE102014118749A1 (enExample)
WO (1) WO2016096870A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102732881B1 (ko) * 2016-09-29 2024-11-22 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR102464070B1 (ko) * 2016-09-29 2022-11-07 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR101963283B1 (ko) * 2017-02-10 2019-03-28 삼성전기주식회사 커패시터 부품
KR102404320B1 (ko) * 2017-08-31 2022-06-07 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
JP6766849B2 (ja) 2018-01-16 2020-10-14 株式会社デンソー 回転角度検出装置
CN111302789B (zh) * 2020-03-17 2021-01-19 华南理工大学 一种具有三明治结构的脉冲储能介质材料及其制备方法与应用
DE102020205305B4 (de) * 2020-04-27 2022-06-30 Eberspächer Catem Gmbh & Co. Kg PTC-Heizeinrichtung und Verfahren zu deren Herstellung
CN114373632B (zh) * 2022-01-22 2022-09-02 池州昀冢电子科技有限公司 多层陶瓷电容器及其制备方法
CN118692985A (zh) * 2024-08-26 2024-09-24 广东佛智芯微电子技术研究有限公司 一种玻璃键合三维堆叠结构及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143239A (ja) * 1992-11-02 1994-05-24 Sumitomo Metal Ind Ltd セラミックス基板の製造方法
JP2002050869A (ja) * 2000-07-31 2002-02-15 Kyocera Corp 多層配線基板の製造方法
JP2002198647A (ja) * 2000-12-26 2002-07-12 Kyocera Corp 低温焼成セラミック配線基板の製造方法
WO2007004415A1 (ja) * 2005-07-01 2007-01-11 Murata Manufacturing Co., Ltd. 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート
JP2008060332A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 積層セラミック基板の製造方法及び積層セラミック基板
JP2009522792A (ja) * 2006-01-05 2009-06-11 エプコス アクチエンゲゼルシャフト モノリシックセラミック素子および作製方法
JP2014160694A (ja) * 2013-02-19 2014-09-04 Panasonic Corp セラミック配線基板とバリスタ内蔵セラミック配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3692623B2 (ja) * 1996-05-20 2005-09-07 株式会社デンソー セラミック積層体及びその製造方法
JP2000208074A (ja) * 1999-01-19 2000-07-28 Canon Inc 画像表示装置および陰極管
DE10145364A1 (de) * 2001-09-14 2003-04-10 Epcos Ag Verfahren zur Herstellung eines keramischen Substrats
KR101108958B1 (ko) * 2003-02-25 2012-01-31 쿄세라 코포레이션 적층 세라믹 콘덴서 및 그 제조방법
JPWO2008120755A1 (ja) * 2007-03-30 2010-07-15 日本電気株式会社 機能素子内蔵回路基板及びその製造方法、並びに電子機器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143239A (ja) * 1992-11-02 1994-05-24 Sumitomo Metal Ind Ltd セラミックス基板の製造方法
JP2002050869A (ja) * 2000-07-31 2002-02-15 Kyocera Corp 多層配線基板の製造方法
JP2002198647A (ja) * 2000-12-26 2002-07-12 Kyocera Corp 低温焼成セラミック配線基板の製造方法
WO2007004415A1 (ja) * 2005-07-01 2007-01-11 Murata Manufacturing Co., Ltd. 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート
JP2009522792A (ja) * 2006-01-05 2009-06-11 エプコス アクチエンゲゼルシャフト モノリシックセラミック素子および作製方法
JP2008060332A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 積層セラミック基板の製造方法及び積層セラミック基板
JP2014160694A (ja) * 2013-02-19 2014-09-04 Panasonic Corp セラミック配線基板とバリスタ内蔵セラミック配線基板

Also Published As

Publication number Publication date
EP3234957A1 (de) 2017-10-25
US20170332491A1 (en) 2017-11-16
DE102014118749A1 (de) 2016-06-16
CN107004504A (zh) 2017-08-01
WO2016096870A1 (de) 2016-06-23
JP2020184646A (ja) 2020-11-12

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