DE102014118749A1 - Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung - Google Patents

Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung Download PDF

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Publication number
DE102014118749A1
DE102014118749A1 DE102014118749.0A DE102014118749A DE102014118749A1 DE 102014118749 A1 DE102014118749 A1 DE 102014118749A1 DE 102014118749 A DE102014118749 A DE 102014118749A DE 102014118749 A1 DE102014118749 A1 DE 102014118749A1
Authority
DE
Germany
Prior art keywords
layer
ceramic
glass
functional layer
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102014118749.0A
Other languages
German (de)
English (en)
Inventor
Yasuharu Miyauchi
Pavol Dudesek
Edmund Payr
Günther Pudmich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102014118749.0A priority Critical patent/DE102014118749A1/de
Priority to CN201580065212.0A priority patent/CN107004504A/zh
Priority to US15/531,361 priority patent/US20170332491A1/en
Priority to EP15817170.2A priority patent/EP3234957A1/de
Priority to PCT/EP2015/079813 priority patent/WO2016096870A1/de
Priority to JP2017531824A priority patent/JP2017538293A/ja
Publication of DE102014118749A1 publication Critical patent/DE102014118749A1/de
Priority to JP2020126497A priority patent/JP2020184646A/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE102014118749.0A 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung Withdrawn DE102014118749A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102014118749.0A DE102014118749A1 (de) 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung
CN201580065212.0A CN107004504A (zh) 2014-12-16 2015-12-15 不变形的陶瓷基片及其制造方法
US15/531,361 US20170332491A1 (en) 2014-12-16 2015-12-15 Low-warpage ceramic carrier plate and method for production
EP15817170.2A EP3234957A1 (de) 2014-12-16 2015-12-15 Verzugsarme keramische trägerplatte und verfahren zur herstellung
PCT/EP2015/079813 WO2016096870A1 (de) 2014-12-16 2015-12-15 Verzugsarme keramische trägerplatte und verfahren zur herstellung
JP2017531824A JP2017538293A (ja) 2014-12-16 2015-12-15 歪みの少ないセラミックの支持プレート及び製造のための方法
JP2020126497A JP2020184646A (ja) 2014-12-16 2020-07-27 歪みの少ないセラミックの支持プレート及び製造のための方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014118749.0A DE102014118749A1 (de) 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung

Publications (1)

Publication Number Publication Date
DE102014118749A1 true DE102014118749A1 (de) 2016-06-16

Family

ID=55027717

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014118749.0A Withdrawn DE102014118749A1 (de) 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung

Country Status (6)

Country Link
US (1) US20170332491A1 (enExample)
EP (1) EP3234957A1 (enExample)
JP (2) JP2017538293A (enExample)
CN (1) CN107004504A (enExample)
DE (1) DE102014118749A1 (enExample)
WO (1) WO2016096870A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102464070B1 (ko) * 2016-09-29 2022-11-07 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR102732881B1 (ko) * 2016-09-29 2024-11-22 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR101963283B1 (ko) * 2017-02-10 2019-03-28 삼성전기주식회사 커패시터 부품
KR102404320B1 (ko) * 2017-08-31 2022-06-07 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
JP6766849B2 (ja) 2018-01-16 2020-10-14 株式会社デンソー 回転角度検出装置
CN111302789B (zh) * 2020-03-17 2021-01-19 华南理工大学 一种具有三明治结构的脉冲储能介质材料及其制备方法与应用
DE102020205305B4 (de) * 2020-04-27 2022-06-30 Eberspächer Catem Gmbh & Co. Kg PTC-Heizeinrichtung und Verfahren zu deren Herstellung
CN114373632B (zh) * 2022-01-22 2022-09-02 池州昀冢电子科技有限公司 多层陶瓷电容器及其制备方法
CN118692985A (zh) * 2024-08-26 2024-09-24 广东佛智芯微电子技术研究有限公司 一种玻璃键合三维堆叠结构及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143239A (ja) * 1992-11-02 1994-05-24 Sumitomo Metal Ind Ltd セラミックス基板の製造方法
JP3692623B2 (ja) * 1996-05-20 2005-09-07 株式会社デンソー セラミック積層体及びその製造方法
JP2000208074A (ja) * 1999-01-19 2000-07-28 Canon Inc 画像表示装置および陰極管
JP4535576B2 (ja) * 2000-07-31 2010-09-01 京セラ株式会社 多層配線基板の製造方法
JP4557417B2 (ja) * 2000-12-26 2010-10-06 京セラ株式会社 低温焼成セラミック配線基板の製造方法
DE10145364A1 (de) * 2001-09-14 2003-04-10 Epcos Ag Verfahren zur Herstellung eines keramischen Substrats
KR101108958B1 (ko) * 2003-02-25 2012-01-31 쿄세라 코포레이션 적층 세라믹 콘덴서 및 그 제조방법
WO2007004415A1 (ja) * 2005-07-01 2007-01-11 Murata Manufacturing Co., Ltd. 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート
DE102006000935B4 (de) * 2006-01-05 2016-03-10 Epcos Ag Monolithisches keramisches Bauelement und Verfahren zur Herstellung
JP2008060332A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 積層セラミック基板の製造方法及び積層セラミック基板
US20100103634A1 (en) * 2007-03-30 2010-04-29 Takuo Funaya Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment
JP2014160694A (ja) * 2013-02-19 2014-09-04 Panasonic Corp セラミック配線基板とバリスタ内蔵セラミック配線基板

Also Published As

Publication number Publication date
CN107004504A (zh) 2017-08-01
JP2020184646A (ja) 2020-11-12
US20170332491A1 (en) 2017-11-16
JP2017538293A (ja) 2017-12-21
EP3234957A1 (de) 2017-10-25
WO2016096870A1 (de) 2016-06-23

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Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: SNAPTRACK, INC., SAN DIEGO, US

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: BARDEHLE PAGENBERG PARTNERSCHAFT MBB PATENTANW, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee