CN107004504A - 不变形的陶瓷基片及其制造方法 - Google Patents

不变形的陶瓷基片及其制造方法 Download PDF

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Publication number
CN107004504A
CN107004504A CN201580065212.0A CN201580065212A CN107004504A CN 107004504 A CN107004504 A CN 107004504A CN 201580065212 A CN201580065212 A CN 201580065212A CN 107004504 A CN107004504 A CN 107004504A
Authority
CN
China
Prior art keywords
layer
interlayer
ceramic
functional layer
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580065212.0A
Other languages
English (en)
Chinese (zh)
Inventor
宫内安晴
帕沃尔·杜德赛克
埃德蒙·派尔
京特·普德米奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN107004504A publication Critical patent/CN107004504A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201580065212.0A 2014-12-16 2015-12-15 不变形的陶瓷基片及其制造方法 Pending CN107004504A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014118749.0A DE102014118749A1 (de) 2014-12-16 2014-12-16 Verzugsarme keramische Trägerplatte und Verfahren zur Herstellung
DE102014118749.0 2014-12-16
PCT/EP2015/079813 WO2016096870A1 (de) 2014-12-16 2015-12-15 Verzugsarme keramische trägerplatte und verfahren zur herstellung

Publications (1)

Publication Number Publication Date
CN107004504A true CN107004504A (zh) 2017-08-01

Family

ID=55027717

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580065212.0A Pending CN107004504A (zh) 2014-12-16 2015-12-15 不变形的陶瓷基片及其制造方法

Country Status (6)

Country Link
US (1) US20170332491A1 (enExample)
EP (1) EP3234957A1 (enExample)
JP (2) JP2017538293A (enExample)
CN (1) CN107004504A (enExample)
DE (1) DE102014118749A1 (enExample)
WO (1) WO2016096870A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109427485A (zh) * 2017-08-31 2019-03-05 三星电机株式会社 多层陶瓷电容器及其制造方法
CN111302789A (zh) * 2020-03-17 2020-06-19 华南理工大学 一种具有三明治结构的脉冲储能介质材料及其制备方法与应用
CN114126118A (zh) * 2020-04-27 2022-03-01 埃贝赫卡腾有限两合公司 Ptc加热装置及其制造方法
CN114373632A (zh) * 2022-01-22 2022-04-19 池州昀冢电子科技有限公司 多层陶瓷电容器及其制备方法
CN118692985A (zh) * 2024-08-26 2024-09-24 广东佛智芯微电子技术研究有限公司 一种玻璃键合三维堆叠结构及其制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102464070B1 (ko) * 2016-09-29 2022-11-07 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR102732881B1 (ko) * 2016-09-29 2024-11-22 주식회사 아모텍 정전기보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치
KR101963283B1 (ko) * 2017-02-10 2019-03-28 삼성전기주식회사 커패시터 부품
JP6766849B2 (ja) 2018-01-16 2020-10-14 株式会社デンソー 回転角度検出装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198647A (ja) * 2000-12-26 2002-07-12 Kyocera Corp 低温焼成セラミック配線基板の製造方法
DE10145364A1 (de) * 2001-09-14 2003-04-10 Epcos Ag Verfahren zur Herstellung eines keramischen Substrats
CN1525503A (zh) * 2003-02-25 2004-09-01 京瓷株式会社 叠层陶瓷电容器及其制造方法
US20070248801A1 (en) * 2005-07-01 2007-10-25 Murata Manufacturing Co., Ltd. Multilayer ceramic substrate, method for producing same, and composite green sheet for forming multilayer ceramic substrate
JP2008060332A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 積層セラミック基板の製造方法及び積層セラミック基板
US20090035560A1 (en) * 2006-01-05 2009-02-05 Christian Block Monolithic Ceramic Component and Production Method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143239A (ja) * 1992-11-02 1994-05-24 Sumitomo Metal Ind Ltd セラミックス基板の製造方法
JP3692623B2 (ja) * 1996-05-20 2005-09-07 株式会社デンソー セラミック積層体及びその製造方法
JP2000208074A (ja) * 1999-01-19 2000-07-28 Canon Inc 画像表示装置および陰極管
JP4535576B2 (ja) * 2000-07-31 2010-09-01 京セラ株式会社 多層配線基板の製造方法
WO2008120755A1 (ja) * 2007-03-30 2008-10-09 Nec Corporation 機能素子内蔵回路基板及びその製造方法、並びに電子機器
JP2014160694A (ja) * 2013-02-19 2014-09-04 Panasonic Corp セラミック配線基板とバリスタ内蔵セラミック配線基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198647A (ja) * 2000-12-26 2002-07-12 Kyocera Corp 低温焼成セラミック配線基板の製造方法
DE10145364A1 (de) * 2001-09-14 2003-04-10 Epcos Ag Verfahren zur Herstellung eines keramischen Substrats
CN1525503A (zh) * 2003-02-25 2004-09-01 京瓷株式会社 叠层陶瓷电容器及其制造方法
US20070248801A1 (en) * 2005-07-01 2007-10-25 Murata Manufacturing Co., Ltd. Multilayer ceramic substrate, method for producing same, and composite green sheet for forming multilayer ceramic substrate
US20090035560A1 (en) * 2006-01-05 2009-02-05 Christian Block Monolithic Ceramic Component and Production Method
JP2008060332A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 積層セラミック基板の製造方法及び積層セラミック基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109427485A (zh) * 2017-08-31 2019-03-05 三星电机株式会社 多层陶瓷电容器及其制造方法
US10763041B2 (en) 2017-08-31 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
CN111302789A (zh) * 2020-03-17 2020-06-19 华南理工大学 一种具有三明治结构的脉冲储能介质材料及其制备方法与应用
CN111302789B (zh) * 2020-03-17 2021-01-19 华南理工大学 一种具有三明治结构的脉冲储能介质材料及其制备方法与应用
CN114126118A (zh) * 2020-04-27 2022-03-01 埃贝赫卡腾有限两合公司 Ptc加热装置及其制造方法
CN114373632A (zh) * 2022-01-22 2022-04-19 池州昀冢电子科技有限公司 多层陶瓷电容器及其制备方法
CN114373632B (zh) * 2022-01-22 2022-09-02 池州昀冢电子科技有限公司 多层陶瓷电容器及其制备方法
CN118692985A (zh) * 2024-08-26 2024-09-24 广东佛智芯微电子技术研究有限公司 一种玻璃键合三维堆叠结构及其制备方法

Also Published As

Publication number Publication date
DE102014118749A1 (de) 2016-06-16
JP2020184646A (ja) 2020-11-12
WO2016096870A1 (de) 2016-06-23
EP3234957A1 (de) 2017-10-25
US20170332491A1 (en) 2017-11-16
JP2017538293A (ja) 2017-12-21

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170801