JP2017533831A5 - - Google Patents

Download PDF

Info

Publication number
JP2017533831A5
JP2017533831A5 JP2017520355A JP2017520355A JP2017533831A5 JP 2017533831 A5 JP2017533831 A5 JP 2017533831A5 JP 2017520355 A JP2017520355 A JP 2017520355A JP 2017520355 A JP2017520355 A JP 2017520355A JP 2017533831 A5 JP2017533831 A5 JP 2017533831A5
Authority
JP
Japan
Prior art keywords
polishing pad
additive
precursor material
layers
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017520355A
Other languages
English (en)
Japanese (ja)
Other versions
JP6703985B2 (ja
JP2017533831A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/056021 external-priority patent/WO2016061506A1/en
Publication of JP2017533831A publication Critical patent/JP2017533831A/ja
Publication of JP2017533831A5 publication Critical patent/JP2017533831A5/ja
Application granted granted Critical
Publication of JP6703985B2 publication Critical patent/JP6703985B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017520355A 2014-10-17 2015-10-16 印刷による化学機械研磨パッド Active JP6703985B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462065190P 2014-10-17 2014-10-17
US62/065,190 2014-10-17
US201462066291P 2014-10-20 2014-10-20
US62/066,291 2014-10-20
PCT/US2015/056021 WO2016061506A1 (en) 2014-10-17 2015-10-16 Printed chemical mechanical polishing pad

Publications (3)

Publication Number Publication Date
JP2017533831A JP2017533831A (ja) 2017-11-16
JP2017533831A5 true JP2017533831A5 (enExample) 2018-11-29
JP6703985B2 JP6703985B2 (ja) 2020-06-03

Family

ID=55747430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017520355A Active JP6703985B2 (ja) 2014-10-17 2015-10-16 印刷による化学機械研磨パッド

Country Status (6)

Country Link
US (2) US10322491B2 (enExample)
JP (1) JP6703985B2 (enExample)
KR (2) KR102426444B1 (enExample)
CN (1) CN107073677B (enExample)
TW (1) TWI689406B (enExample)
WO (1) WO2016061506A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
EP3405309B1 (en) * 2016-01-21 2022-04-27 3M Innovative Properties Company Methods of making metal bond and vitreous bond abrasive articles
EP3257660A1 (en) * 2016-06-13 2017-12-20 Siemens Aktiengesellschaft Method of providing an abrasive means and of additively manufacturing a component
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR101897659B1 (ko) * 2017-01-16 2018-09-13 원광대학교산학협력단 이중기공 세포지지체 제조시스템 및 제조방법, 그리고 세포지지체
IT201700038586A1 (it) * 2017-04-07 2018-10-07 Aros Srl Metodo per la realizzazione di un utensile.
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11826876B2 (en) * 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
WO2020106526A1 (en) * 2018-11-19 2020-05-28 Applied Materials, Inc. Low viscosity uv-curable formulation for 3d printing
CN109483418B (zh) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11731231B2 (en) * 2019-01-28 2023-08-22 Micron Technology, Inc. Polishing system, polishing pad, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN110076339A (zh) * 2019-03-06 2019-08-02 上海工程技术大学 一种复杂空腔增材制件内外表面的抛光方法
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
JP2022531472A (ja) * 2019-05-07 2022-07-06 シーエムシー マテリアルズ，インコーポレイティド 一定の溝容積を有する化学機械平坦化パッド
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
CN110977801A (zh) * 2019-12-20 2020-04-10 中国科学院长春光学精密机械与物理研究所 一种沥青抛光盘制备装置
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN115666852A (zh) * 2020-04-21 2023-01-31 美商智能垫有限责任公司 具有凸出结构的化学机械抛光垫
US11738517B2 (en) 2020-06-18 2023-08-29 Applied Materials, Inc. Multi dispense head alignment using image processing
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
KR20240060700A (ko) * 2021-09-29 2024-05-08 엔테그리스, 아이엔씨. 폴리머 백킹 플레이트를 갖는 패드 컨디셔너
KR102700222B1 (ko) * 2021-10-12 2024-08-29 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
US20230405765A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Dual-cure resin for preparing chemical mechanical polishing pads
TW202419495A (zh) * 2022-06-15 2024-05-16 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之uv可固化樹脂
US20250121472A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Polishing articles for hybrid bonding applications
CN120839671A (zh) * 2025-09-22 2025-10-28 华侨大学 一种增材制造铣磨头及其一体化成型的批量制造方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919082A (en) 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP2000061817A (ja) 1998-08-24 2000-02-29 Nikon Corp 研磨パッド
EP1295682B1 (en) * 2000-05-31 2007-10-24 JSR Corporation Abrasive material
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
US6592443B1 (en) * 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
JP2004281685A (ja) * 2003-03-14 2004-10-07 Mitsubishi Electric Corp 半導体基板の研磨用パッドおよび半導体基板の研磨方法
WO2005000529A1 (en) * 2003-06-03 2005-01-06 Neopad Technologies Corporation Synthesis of a functionally graded pad for chemical mechanical planarization
US20060189269A1 (en) 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7435161B2 (en) 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100640998B1 (ko) 2003-09-19 2006-11-02 엘지.필립스 엘시디 주식회사 액정표시장치용 브라켓 구조
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
US7815778B2 (en) 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
WO2006057713A2 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7530880B2 (en) 2004-11-29 2009-05-12 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR101616535B1 (ko) 2005-02-18 2016-04-29 넥스플래너 코퍼레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
JP2006231464A (ja) * 2005-02-24 2006-09-07 Nitta Haas Inc 研磨パッド
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
US8066555B2 (en) * 2007-09-03 2011-11-29 Semiquest Inc. Polishing pad
KR101618273B1 (ko) 2008-04-29 2016-05-04 세미퀘스트, 인코포레이티드 연마 패드 조성물, 및 이의 제조 방법 및 용도
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
US8292692B2 (en) 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
CN102686362A (zh) 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
KR20130095430A (ko) * 2012-02-20 2013-08-28 케이피엑스케미칼 주식회사 연마패드 및 그 제조방법
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
WO2015048011A1 (en) 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法

Similar Documents

Publication Publication Date Title
JP2017533831A5 (enExample)
JP6898379B2 (ja) 印刷による化学機械研磨パッド
CN104968500B (zh) 三维部件直接喷墨打印的系统及方法
JP2017533832A5 (enExample)
TWI671162B (zh) 拋光物和用於製造化學機械拋光物的整合系統
TW201531397A (zh) 產生三維物件之技術（二）
KR101971413B1 (ko) 입체 물체 생성
TWI780484B (zh) 具有受控孔隙率的印刷式化學機械研磨墊
EP3478462B1 (en) Printed razor blades
US20010046834A1 (en) Pad surface texture formed by solid phase droplets
JP2017520422A5 (enExample)
JP2012011310A5 (enExample)
US7422318B2 (en) Image forming apparatus
JP2012131094A5 (enExample)
JP7177932B2 (ja) ３ｄ印刷のための低粘度ｕｖ硬化性調合物
JP2012180588A5 (enExample)
JP2013052546A (ja) 撥液表面を有する構造体、インクジェットヘッドのノズルプレート、ならびに、該構造体および該ノズルプレートのクリーニング方法
JP2013065624A5 (enExample)
JP2012004555A5 (enExample)
JP2011074140A (ja) 多孔フィルム及びその製造方法
US8357428B2 (en) Method for producing porous film
JPWO2019203261A5 (enExample)
TWI548481B (zh) 拋光墊及其製造方法
JP5988936B2 (ja) 撥水膜、成膜方法、ノズルプレート、インクジェットヘッド、及びインクジェット記録装置
JP5455805B2 (ja) 液体吐出ヘッドおよび液体吐出装置