JP2017533831A5 - - Google Patents

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Publication number
JP2017533831A5
JP2017533831A5 JP2017520355A JP2017520355A JP2017533831A5 JP 2017533831 A5 JP2017533831 A5 JP 2017533831A5 JP 2017520355 A JP2017520355 A JP 2017520355A JP 2017520355 A JP2017520355 A JP 2017520355A JP 2017533831 A5 JP2017533831 A5 JP 2017533831A5
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JP
Japan
Prior art keywords
polishing pad
additive
precursor material
layers
layer
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JP2017520355A
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English (en)
Japanese (ja)
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JP6703985B2 (ja
JP2017533831A (ja
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Priority claimed from PCT/US2015/056021 external-priority patent/WO2016061506A1/en
Publication of JP2017533831A publication Critical patent/JP2017533831A/ja
Publication of JP2017533831A5 publication Critical patent/JP2017533831A5/ja
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JP2017520355A 2014-10-17 2015-10-16 印刷による化学機械研磨パッド Active JP6703985B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462065190P 2014-10-17 2014-10-17
US62/065,190 2014-10-17
US201462066291P 2014-10-20 2014-10-20
US62/066,291 2014-10-20
PCT/US2015/056021 WO2016061506A1 (en) 2014-10-17 2015-10-16 Printed chemical mechanical polishing pad

Publications (3)

Publication Number Publication Date
JP2017533831A JP2017533831A (ja) 2017-11-16
JP2017533831A5 true JP2017533831A5 (enExample) 2018-11-29
JP6703985B2 JP6703985B2 (ja) 2020-06-03

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JP2017520355A Active JP6703985B2 (ja) 2014-10-17 2015-10-16 印刷による化学機械研磨パッド

Country Status (6)

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US (2) US10322491B2 (enExample)
JP (1) JP6703985B2 (enExample)
KR (2) KR102426444B1 (enExample)
CN (1) CN107073677B (enExample)
TW (1) TWI689406B (enExample)
WO (1) WO2016061506A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN108698206B (zh) 2016-01-19 2021-04-02 应用材料公司 多孔化学机械抛光垫
US11072053B2 (en) * 2016-01-21 2021-07-27 3M Innovative Properties Company Methods of making metal bond and vitreous bond abrasive articles, and abrasive article precursors
EP3257660A1 (en) * 2016-06-13 2017-12-20 Siemens Aktiengesellschaft Method of providing an abrasive means and of additively manufacturing a component
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR101897659B1 (ko) * 2017-01-16 2018-09-13 원광대학교산학협력단 이중기공 세포지지체 제조시스템 및 제조방법, 그리고 세포지지체
IT201700038586A1 (it) * 2017-04-07 2018-10-07 Aros Srl Metodo per la realizzazione di un utensile.
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11826876B2 (en) * 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
WO2020106526A1 (en) * 2018-11-19 2020-05-28 Applied Materials, Inc. Low viscosity uv-curable formulation for 3d printing
CN109483418B (zh) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11731231B2 (en) * 2019-01-28 2023-08-22 Micron Technology, Inc. Polishing system, polishing pad, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN110076339A (zh) * 2019-03-06 2019-08-02 上海工程技术大学 一种复杂空腔增材制件内外表面的抛光方法
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
JP2022531478A (ja) * 2019-05-07 2022-07-06 シーエムシー マテリアルズ,インコーポレイティド バットベースの生成を介する化学機械平坦化パッド
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN110977801A (zh) * 2019-12-20 2020-04-10 中国科学院长春光学精密机械与物理研究所 一种沥青抛光盘制备装置
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US11738517B2 (en) 2020-06-18 2023-08-29 Applied Materials, Inc. Multi dispense head alignment using image processing
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
EP4408615A4 (en) * 2021-09-29 2025-11-12 Entegris Inc BUFFER CONDITIONER WITH POLYMER SUPPORT PLATE
KR102700222B1 (ko) * 2021-10-12 2024-08-29 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
US20230405765A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Dual-cure resin for preparing chemical mechanical polishing pads
WO2023244740A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Uv-curable resins for chemical mechanical polishing pads
US20250121472A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Polishing articles for hybrid bonding applications
CN120839671A (zh) * 2025-09-22 2025-10-28 华侨大学 一种增材制造铣磨头及其一体化成型的批量制造方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919082A (en) * 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP2000061817A (ja) * 1998-08-24 2000-02-29 Nikon Corp 研磨パッド
WO2001091975A1 (en) * 2000-05-31 2001-12-06 Jsr Corporation Abrasive material
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
JP2004281685A (ja) * 2003-03-14 2004-10-07 Mitsubishi Electric Corp 半導体基板の研磨用パッドおよび半導体基板の研磨方法
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
KR101108024B1 (ko) * 2003-06-03 2012-01-25 넥스플래너 코퍼레이션 화학 기계적 평탄화를 위한 기능적으로 그레이딩된 패드의합성
US7435161B2 (en) 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100640998B1 (ko) 2003-09-19 2006-11-02 엘지.필립스 엘시디 주식회사 액정표시장치용 브라켓 구조
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
WO2006057720A1 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US8075745B2 (en) 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7815778B2 (en) 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於cmp之特製拋光墊及其製造方法及其用途
KR101616535B1 (ko) * 2005-02-18 2016-04-29 넥스플래너 코퍼레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
JP2006231464A (ja) * 2005-02-24 2006-09-07 Nitta Haas Inc 研磨パッド
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
KR20100082770A (ko) * 2007-09-03 2010-07-19 세미퀘스트, 인코포레이티드 폴리싱 패드
US8177603B2 (en) 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
US8292692B2 (en) 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
US9162340B2 (en) 2009-12-30 2015-10-20 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
KR20130095430A (ko) * 2012-02-20 2013-08-28 케이피엑스케미칼 주식회사 연마패드 및 그 제조방법
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
SG11201602207QA (en) 2013-09-25 2016-04-28 3M Innovative Properties Co Multi-layered polishing pads
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法

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