JP2015517922A5 - - Google Patents

Download PDF

Info

Publication number
JP2015517922A5
JP2015517922A5 JP2015508994A JP2015508994A JP2015517922A5 JP 2015517922 A5 JP2015517922 A5 JP 2015517922A5 JP 2015508994 A JP2015508994 A JP 2015508994A JP 2015508994 A JP2015508994 A JP 2015508994A JP 2015517922 A5 JP2015517922 A5 JP 2015517922A5
Authority
JP
Japan
Prior art keywords
precursor
layer
layers
polishing
pad material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015508994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015517922A (ja
JP6180512B2 (ja
Filing date
Publication date
Priority claimed from US13/591,051 external-priority patent/US9067299B2/en
Application filed filed Critical
Publication of JP2015517922A publication Critical patent/JP2015517922A/ja
Publication of JP2015517922A5 publication Critical patent/JP2015517922A5/ja
Application granted granted Critical
Publication of JP6180512B2 publication Critical patent/JP6180512B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015508994A 2012-04-25 2013-04-05 研磨剤粒子を有する印刷による化学機械研磨パッド Active JP6180512B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261638461P 2012-04-25 2012-04-25
US61/638,461 2012-04-25
US13/591,051 US9067299B2 (en) 2012-04-25 2012-08-21 Printed chemical mechanical polishing pad
US13/591,051 2012-08-21
PCT/US2013/035513 WO2013162856A1 (en) 2012-04-25 2013-04-05 Printed chemical mechanical polishing pad

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2017116092A Division JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2017116093A Division JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド

Publications (3)

Publication Number Publication Date
JP2015517922A JP2015517922A (ja) 2015-06-25
JP2015517922A5 true JP2015517922A5 (enExample) 2016-06-02
JP6180512B2 JP6180512B2 (ja) 2017-08-16

Family

ID=49476099

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2015508994A Active JP6180512B2 (ja) 2012-04-25 2013-04-05 研磨剤粒子を有する印刷による化学機械研磨パッド
JP2017116093A Active JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド
JP2017116092A Active JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2019070349A Active JP6898379B2 (ja) 2012-04-25 2019-04-02 印刷による化学機械研磨パッド

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2017116093A Active JP6620125B2 (ja) 2012-04-25 2017-06-13 バッキング層および研磨層を有する印刷による化学機械研磨パッド
JP2017116092A Active JP6697419B2 (ja) 2012-04-25 2017-06-13 印刷による化学機械研磨パッド
JP2019070349A Active JP6898379B2 (ja) 2012-04-25 2019-04-02 印刷による化学機械研磨パッド

Country Status (8)

Country Link
US (8) US9067299B2 (enExample)
EP (2) EP2842157B1 (enExample)
JP (4) JP6180512B2 (enExample)
KR (6) KR102344467B1 (enExample)
CN (2) CN107030595B (enExample)
SG (2) SG11201406448UA (enExample)
TW (7) TWI795287B (enExample)
WO (1) WO2013162856A1 (enExample)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US20160354896A1 (en) * 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
US9738032B2 (en) * 2014-06-06 2017-08-22 Xerox Corporation System for controlling operation of a printer during three-dimensional object printing with reference to a distance from the surface of object
JP6329437B2 (ja) * 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
CN106536165B (zh) 2014-07-09 2020-10-13 应用材料公司 增材制造中的层状加热、线状加热、等离子体加热及多重馈给材料
US20160101500A1 (en) * 2014-10-09 2016-04-14 Applied Materials, Inc. Chemical mechanical polishing pad with internal channels
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
TWI652735B (zh) 2014-10-09 2019-03-01 美商應用材料股份有限公司 具有內部通道的化學機械研磨墊
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (zh) * 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
WO2016061585A1 (en) * 2014-10-17 2016-04-21 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) * 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10994473B2 (en) * 2015-02-10 2021-05-04 Optomec, Inc. Fabrication of three dimensional structures by in-flight curing of aerosols
WO2016181751A1 (ja) * 2015-05-13 2016-11-17 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
WO2016209696A1 (en) 2015-06-25 2016-12-29 3M Innovative Properties Company Methods of making metal bond abrasive articles and metal bond abrasive articles
CN205703794U (zh) * 2015-06-29 2016-11-23 智胜科技股份有限公司 研磨垫的研磨层
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) * 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) * 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN113146464A (zh) * 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
SG11201806820UA (en) * 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
US12325208B2 (en) 2016-07-22 2025-06-10 Virginia Tech Intellectual Properties, Inc. Corrugated three dimensional (3D) additive manufacturing
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
CN106239943B (zh) * 2016-09-26 2018-10-16 华侨大学 一种针对熔融沉积制造fdm成型件的抛光机及其使用方法
TWI647070B (zh) * 2017-02-20 2019-01-11 詠巨科技有限公司 組合式修整器及其製造方法
KR102464517B1 (ko) 2017-02-28 2022-11-10 쓰리엠 이노베이티브 프로퍼티즈 캄파니 금속 접합 연마 용품 및 금속 접합 연마 용품을 제조하는 방법
US10596763B2 (en) * 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
DE202018104180U1 (de) 2017-07-20 2018-10-25 DIT Diamanttechnik GmbH & Co. KG Generativ gefertigtes Schleifwerkzeug zur Bearbeitung von Hartstoffen und Composites
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US20200247932A1 (en) 2017-10-02 2020-08-06 Basf Se Uv curable compositions with controlled mechanical and chemical properties, methods, and articles therefrom
EP3694664A4 (en) * 2017-10-10 2021-10-27 Applied Materials, Inc. SELECTIVE POWDER DISTRIBUTION FOR ADDITIVE MANUFACTURING
US10632746B2 (en) 2017-11-13 2020-04-28 Optomec, Inc. Shuttering of aerosol streams
JP2019107839A (ja) * 2017-12-20 2019-07-04 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
CN108274123B (zh) * 2017-12-28 2020-07-07 北京航空航天大学 一种用于激光增材构件内壁的增材-抛光一体化加工方法
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
CN113056496B (zh) * 2018-11-19 2023-09-08 应用材料公司 用于3d打印的低粘度uv可固化配方
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102699594B1 (ko) 2019-05-31 2024-08-28 어플라이드 머티어리얼스, 인코포레이티드 연마 플래튼들 및 연마 플래튼 제조 방법들
US11367643B2 (en) * 2019-06-28 2022-06-21 Applied Materials, Inc. Method for substrate registration and anchoring in inkjet printing
JP2022545469A (ja) 2019-08-21 2022-10-27 アプライド マテリアルズ インコーポレイテッド 研磨パッドの付加製造
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
MX2022004618A (es) * 2019-10-16 2022-05-06 Saint Gobain Abrasives Inc Articulos abrasivos y metodos de formacion.
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN113070810A (zh) * 2020-01-03 2021-07-06 铨科光电材料股份有限公司 晶圆抛光垫
JP7479668B2 (ja) * 2020-01-28 2024-05-09 株式会社東邦鋼機製作所 触媒パッド、その製造方法および製造装置
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US11612978B2 (en) 2020-06-09 2023-03-28 Applied Materials, Inc. Additive manufacturing of polishing pads
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022051521A1 (en) 2020-09-03 2022-03-10 Basf Se Reactive polyurethane elastomer
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2024509814A (ja) 2021-03-05 2024-03-05 サンーゴバン アブレイシブズ,インコーポレイティド 研磨物品及びそれを形成するための方法
TW202247905A (zh) 2021-04-29 2022-12-16 美商阿普托麥克股份有限公司 用於氣溶膠噴射裝置之高可靠性鞘護輸送路徑
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
KR20240113596A (ko) 2021-12-08 2024-07-22 바스프 에스이 높은 열변형 온도를 가진 광경화성 수지
EP4457057A1 (en) 2021-12-30 2024-11-06 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
US12296434B2 (en) 2021-12-30 2025-05-13 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
US20250091260A1 (en) 2022-01-31 2025-03-20 Kuraray Co., Ltd. Method for manufacturing resin sheet by using 3d printer, and polishing pad having polishing layer obtained thereby
US20240227120A1 (en) * 2022-12-22 2024-07-11 Applied Materials, Inc. Uv curable printable formulations for high performance 3d printed cmp pads
CN118305724B (zh) * 2024-05-15 2025-10-14 安徽禾臣新材料有限公司 一种用于晶体表面抛光的压纹白垫及其生产工艺

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387380A (en) * 1989-12-08 1995-02-07 Massachusetts Institute Of Technology Three-dimensional printing techniques
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5906863A (en) * 1994-08-08 1999-05-25 Lombardi; John Methods for the preparation of reinforced three-dimensional bodies
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
JP4163756B2 (ja) 1997-01-13 2008-10-08 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法
US5940674A (en) * 1997-04-09 1999-08-17 Massachusetts Institute Of Technology Three-dimensional product manufacture using masks
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
DE19834559A1 (de) * 1998-07-31 2000-02-03 Friedrich Schiller Uni Jena Bu Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen
WO2001064396A1 (en) * 2000-02-28 2001-09-07 Rodel Holdings, Inc. Polishing pad surface texture formed by solid phase droplets
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
AU2000238145A1 (en) * 2000-03-24 2001-10-08 Generis Gmbh Method for manufacturing a structural part by a multi-layer deposition technique
EP1284842B1 (en) * 2000-05-27 2005-10-19 Rohm and Haas Electronic Materials CMP Holdings, Inc. Polishing pads for chemical mechanical planarization
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
KR100905266B1 (ko) 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
US20020111707A1 (en) * 2000-12-20 2002-08-15 Zhimin Li Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
GB0127252D0 (en) * 2001-11-13 2002-01-02 Vantico Ag Production of composite articles composed of thin layers
DE10224981B4 (de) * 2002-06-05 2004-08-19 Generis Gmbh Verfahren zum schichtweisen Aufbau von Modellen
EP1539500A4 (en) * 2002-09-12 2006-03-29 Objet Geometries Ltd DEVICE, SYSTEM AND METHOD FOR CALIBRATING IN THREE-DIMENSIONAL MODEL PRESSURE
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
US20050012247A1 (en) * 2003-07-18 2005-01-20 Laura Kramer Systems and methods for using multi-part curable materials
US7120512B2 (en) * 2003-08-25 2006-10-10 Hewlett-Packard Development Company, L.P. Method and a system for solid freeform fabricating using non-reactive powder
WO2005021248A1 (ja) * 2003-08-27 2005-03-10 Fuji Photo Film Co., Ltd. 三次元造形物の製造方法
GB0323462D0 (en) * 2003-10-07 2003-11-05 Fujifilm Electronic Imaging Providing a surface layer or structure on a substrate
KR20050038835A (ko) * 2003-10-23 2005-04-29 동부아남반도체 주식회사 패드 그루브 구조
KR100576465B1 (ko) 2003-12-01 2006-05-08 주식회사 하이닉스반도체 연마입자 함침 조성물을 이용한 연마 패드
US7216009B2 (en) 2004-06-14 2007-05-08 Micron Technology, Inc. Machine vision systems for use with programmable material consolidation system and associated methods and structures
JP2006095680A (ja) * 2004-09-14 2006-04-13 Zhiguo Long 切割研磨シートとその製造方法
KR100606457B1 (ko) 2004-11-11 2006-11-23 한국기계연구원 3차원 프린팅 조형시스템
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於cmp之特製拋光墊及其製造方法及其用途
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7524345B2 (en) 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
KR101554834B1 (ko) 2005-10-12 2015-09-21 세이가가쿠 고교 가부시키가이샤 점막에 적용하는 작용제 및 그것의 제조 방법
KR100761847B1 (ko) * 2005-12-07 2007-09-28 삼성전자주식회사 연마 입자가 내재된 연마 패드, 이의 제조 방법, 및 이를포함하는 화학적 기계적 연마 장치
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20070212979A1 (en) 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
US20070235904A1 (en) * 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
KR100842486B1 (ko) 2006-10-30 2008-07-01 동부일렉트로닉스 주식회사 Cmp 장비의 폴리싱패드와 이의 제조장치
US7862320B2 (en) * 2007-07-17 2011-01-04 Seiko Epson Corporation Three-dimensional object forming apparatus and method for forming three dimensional object
EP2664443B1 (en) * 2007-07-25 2021-08-25 Stratasys Ltd. Solid freeform fabrication using a plurality of modeling materials
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
WO2009145069A1 (ja) * 2008-05-26 2009-12-03 ソニー株式会社 造形装置および造形方法
US8282866B2 (en) * 2008-06-30 2012-10-09 Seiko Epson Corporation Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device
KR20100073095A (ko) * 2008-12-22 2010-07-01 주식회사 하이닉스반도체 화학기계적 연마용 연마 패드
KR20110120893A (ko) * 2009-01-16 2011-11-04 어플라이드 머티어리얼스, 인코포레이티드 윈도우 지지부를 가지는 폴리싱 패드 및 시스템
JP2012094559A (ja) * 2010-10-22 2012-05-17 Sumco Corp 硬脆性ウェーハの平坦化加工方法および平坦化加工用パッド
US20120316458A1 (en) 2011-06-11 2012-12-13 Aliphcom, Inc. Data-capable band for medical diagnosis, monitoring, and treatment
EP2819822B1 (en) 2012-03-01 2016-09-28 Stratasys Ltd. Cationic polymerizable compositions and methods of use thereof
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein

Similar Documents

Publication Publication Date Title
JP2015517922A5 (enExample)
JP2017537817A5 (enExample)
JP6898379B2 (ja) 印刷による化学機械研磨パッド
US10456977B2 (en) Printing head, printing apparatus, printing method and printed article
KR102130284B1 (ko) 3d 프린팅을 위한 가열을 제어하는 기법
JP6647569B2 (ja) 三次元造形装置
US20210402696A1 (en) Printhead cleaning system
JP2017533831A5 (enExample)
JP2012131094A5 (enExample)
JP2010510050A5 (enExample)
WO2015100086A4 (en) Methods and systems for three-dimensional printing utilizing multiple binder fluids
CN105848838A (zh) 具有加速执行的用于3d打印方法的设备和方法
US20010046834A1 (en) Pad surface texture formed by solid phase droplets
JP2017524579A (ja) 複数素材三次元プリンタ
JP2017533105A (ja) 研磨用物品、及び、化学機械研磨用物品を製造するための統合型のシステムと方法
CN104822466A (zh) 用于通过粒状材料等对产品进行数字装饰的方法及机器
CN102555027A (zh) 三维造型装置、三维造型方法、通过该方法形成的模型
WO2008151063A3 (en) High definition versatile stereolithic method and material
JP2014130881A5 (enExample)
TWI779796B (zh) 於輸送帶上之研磨墊的積層製造
KR101363481B1 (ko) 입체형태의 표면도장방법
US9304415B2 (en) Coating liquid dispensers
JP2008528335A5 (enExample)
CN102848769B (zh) 凝胶墨整平的方法、具有整平组件的设备和系统
JP2021500243A5 (enExample)