CN104285281B - 印刷式化学机械研磨垫 - Google Patents

印刷式化学机械研磨垫 Download PDF

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CN104285281B
CN104285281B CN201380023299.6A CN201380023299A CN104285281B CN 104285281 B CN104285281 B CN 104285281B CN 201380023299 A CN201380023299 A CN 201380023299A CN 104285281 B CN104285281 B CN 104285281B
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CN104285281A (zh
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R·巴贾杰
B·L·钦
T·Y·李
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Applied Materials Inc
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Abstract

一种制造研磨垫的研磨层的方法，包括使用3D印刷机相继地沉积多个层，藉由从喷头喷出垫材料前驱物、并固化该垫材料前驱物以形成固化的垫材料的方式来沉积该多个研磨层的每一层。

Description

印刷式化学机械研磨垫
技术领域
本发明关于化学机械研磨期间所使用的研磨垫。
背景
通常藉由在硅晶圆上循序沉积导体层、半导体层或绝缘层而在基板上形成集成电路。许多不同制造工艺皆需要对基板上的层进行平坦化。举例言之，就某些应用而言，例如欲研磨金属材料以在图案化层的沟槽中形成通孔、插销和线路时，会对上层进行平坦化直到暴露出图案化层的顶表面。在其它应用上，例如介电层平坦化以用于光微影技术中，则会研磨上层，直到在下层上保留期望厚度的上层。
化学机械研磨(CMP)是公认的平坦化方法之一。此平坦化方法通常要求将基板安装在承载头上。通常使基板的暴露表面抵靠着旋转中的研磨垫放置。承载头在基板上提供可控制的负载(load)以推挤基板使该基板抵靠着研磨垫。通常会供应研磨液(例如，含有研磨粒的浆料)至研磨垫的表面。
化学机械研磨工艺的一个目标是使研磨均匀一致。若以不同速率研磨基板的不同区域，则基板的某些区域可能被去除过多材料(“过度研磨”)或去除太少材料(“研磨不足”)。
习知的研磨垫包括“标准”垫和固定研磨粒垫。标准垫具有聚胺甲酸乙酯(polyurethane)研磨层，且该聚胺甲酸乙酯研磨层具有耐磨的粗糙表面，且该标准垫亦可包含可压缩背托层(compressible backing layer)。相较之下，固定研磨粒垫具有固定在固定介质(containment media)中的研磨粒，且该固定研磨粒垫通常可支撑在不可压缩背托层(incompressible backing layer)上。
一般利用模塑(molding)、浇铸(casting)或烧结(sintering)聚胺甲酸乙酯材料制成研磨垫。对于模塑的情形，例如利用射出成形法一次可生产一个研磨垫。在浇铸法的例子中，使液体前驱物注模并硬化成块，随后将该硬块切割成个别垫片。随后此等垫片可加工至最终厚度。可在研磨表面中加工形成沟槽，或作为射出成形工艺的一部分在研磨表面中形成沟槽。
除了平坦化之外，研磨垫亦可用于完成作业，例如用于抛光。
概要
为提供研磨的均匀一致性，研磨垫需与正进行研磨的基板形成均匀接触，从而能够在整个基板表面上施加均匀的压力。垫的厚度差异可能在整个基板表面上产生不均匀的压力。即使是厚度上的小差异也会导致所施加压力的变化，且从而造成不均匀的去除作用以及较多的缺陷，例如在基板表面上造成微细刮痕。此种效应对于硬研磨垫而言更加严重，并且在低压力研磨制程中亦较为严重。尽管软研磨垫可容适较大的厚度差异，但在垫中形成沟槽的工艺对于软研磨垫而言更容易产生不均匀性。
能改善厚度均匀性的研磨垫制造技术是使用3D印刷工艺。在3D印刷工艺中，以渐进方式沉积垫前驱物(例如，粉末)的薄层，并使垫前驱物薄层融合(fused)成完整的三维(3D)研磨垫。
在一方面中，制造研磨垫的研磨层的方法包括使用三维(3D)印刷机相继地沉积多个层，藉由从喷嘴喷出垫材料前驱物、且固化该垫材料前驱物以形成固化的垫材料的方式来沉积该多个研磨层的每一层。
本发明的实施方案可包括以下特征的其中一个或多个特征。该多个层的每一层的厚度可小于研磨垫的总厚度的50％。该多个层的每一层的厚度可小于研磨垫的总厚度的1％。可藉由在计算机上执行的三维(3D)绘图程序控制垫材料前驱物的射出以在该多个层的至少一些层中形成图案而在该研磨层中形成凹槽。该等凹槽可为研磨垫的总水平表面积的10％至75％。介于该等凹槽之间的台地部分(plateaus)可具有0.1毫米(mm)至2.5毫米的横向尺寸。该等凹槽可具有0.25毫米至1.5毫米的深度。该等凹槽可具有0.1毫米至2毫米的最宽横向(lateral)尺寸。该等凹槽的形状可塑造成圆柱形、平头角锥形或棱柱形中的一者或多者。该等凹槽可以是沟槽。固化(solidifying)该垫材料前驱物的步骤可包括硬化(curing)该垫材料前驱物。硬化该垫材料前驱物的步骤可包括紫外线(UV)硬化。垫材料前驱物可包括胺甲酸乙酯单体(urethane monomer)。该固化的垫材料可包括聚胺甲酸乙酯(polyurethane)。可于该固化的垫材料内提供研磨粒。研磨粒可为金属氧化物颗粒。可使用3D印刷机相继地沉积多个层以形成研磨垫的背托层。形成背托层的步骤可包括硬化该背托层的多个层，且用于硬化该背托层的该多个层的硬化量与硬化该研磨层的该多个层的硬化量不同。形成该背托层的步骤可包括喷出与该垫前驱物材料不同的材料。该固化的研磨材料所具有的硬度可介于约40萧氏D型硬度(Shore D)至80萧氏D型硬度之间。该垫材料前驱物可为熔化的垫材料，且固化该垫材料前驱物的步骤可包括冷却该熔化的垫材料。
本发明的潜在优点可包括下述一或多项优点。所制造的研磨垫可具有极高的公差(tolerance)，即具有良好的厚度均匀性。可在研磨垫中形成沟槽而不会使厚度均匀性产生畸变。改善整个基板上的研磨均匀性，尤其是改善于低压力(例如，低于0.8psi，或甚至低于0.5psi或0.3psi)下整个基板上的研磨均匀性。本发明的垫制造工艺适用于不同的研磨垫构造和沟槽图案。可更快且更便宜地制造研磨垫。
附图及以下内容陈述一或多个实施方案的细节。由本案说明书、附图及权利要求范围将可理解其它特征、目标和优点。
附图描述
图1A是示例性研磨垫的概要侧视剖面图。
图1B是另一示例性研磨垫的概要侧视剖面图。
图1C是又另一示例性研磨垫的概要侧视剖面图。
图2是化学机械研磨站的概要侧视局部剖面图。
图3是图示基板与图1A的研磨垫接触的概要侧视剖面图。
图中以相同组件符号代表各图中的相同组件。
详细描述
参阅图1A～1C，研磨垫18包含研磨层22。如图1A所示，研磨垫可以是由研磨层22所组成的单层式垫，或如图1C所示般，研磨垫可为包含研磨层22和至少一背托层20的多层式垫。
研磨层22可以是在研磨工艺中呈惰性的材料。研磨层22的材料可为塑料，例如聚胺甲酸乙酯(polyurethane)。在某些实施方案中，研磨层22为相对耐用且硬的材料。例如，以萧氏D型硬度等级而言，研磨层22所具有的硬度可为约40萧氏D型硬度至80萧氏D型硬度，例如55萧氏D型硬度至65萧氏D型硬度。
如图1A所示，研磨层22可为由均质组成物所形成的层，或如图1B所示，研磨层22可含有固定在由塑料材料(例如，聚胺甲酸乙酯)所形成的基质29中的研磨粒28。研磨粒28比基质29的材料更硬。研磨粒28可占该研磨层的0.05重量％至75重量％。例如，研磨粒28可能少于该研磨层22的1重量％，例如少于0.1重量％。或者，研磨粒28可多于该研磨层22的10重量％，例如多于50重量％。研磨粒的材料可为金属氧化物，例如氧化铈(ceria)、氧化铝(alumina)、氧化硅(silica)或上述金属氧化物的组合物。
在某些实施方案中，该研磨层可包含孔洞，例如小孔隙。该等孔洞可宽达50微米至100微米。
研磨层18所具有的厚度D1可为80密耳(mils)或更薄，例如可为50密耳或更薄，例如25密耳或更薄。由于调整(conditioning)工艺通常将表层(cover layer)磨除，因此可选择该研磨层22的厚度，以为该研磨垫18提供可用的寿命，例如3000次的研磨和调整循环。
在微观尺度上，研磨层22的研磨表面24可具有粗糙的表面纹理，例如2微米至4微米的表面均方根(rms)粗糙度。例如，可使研磨层22经过研磨或调整工艺以产生粗糙的表面纹理。此外，3D印刷可提供小且均匀一致的特征，例如小至200微米的特征。
尽管研磨表面24在微观尺度上可能是粗糙的，但在研磨垫本身的宏观尺度上，研磨层22可具有良好的厚度均匀性(此均匀性是指相对于研磨层底表面而言，研磨表面24在高度上的整体变化，而不是指刻意在该研磨层中形成的任何宏观上的沟槽或孔洞)。例如，厚度的不均匀性可小于1密耳。
可任选地，该研磨表面24的至少一部分中可形成有多个沟槽26以用于输送浆料。该等沟槽26可几乎是任何图案，例如同心圆、直线状、格纹状、螺旋状及诸如此类的形状。假若具有沟槽，则介于该等沟槽26之间的研磨表面24(即，台地部分)可例如约占研磨垫22的总水平表面积的25％至90％。因此，该等沟槽26可占该研磨垫18的总水平表面积的10％至75％。介于该等沟槽26之间的台地部分可具有约0.1毫米至约2.5毫米的横向宽度。
在某些实施方案中，例如，若具有背托层20时，该等沟槽26可延伸贯穿整个研磨层22。在某些实施方案中，该等沟槽26可延伸穿透该研磨层22的厚度的约20％至80％，例如40％。该等沟槽26的深度可为0.25毫米至1毫米。例如，在具有厚度为50密耳的研磨层22的研磨垫18中，该等沟槽26的深度D2可为约20密耳。
背托层20可比研磨层22柔软且更加可压缩。以萧氏A型硬度等级而言，背托层20可具有80或更小的硬度，例如可具有约60萧氏A型硬度。背托层20可比研磨层22厚、比研磨层22薄或与研磨层22具有相同厚度。
例如，该背托层可为开放孔型泡棉(open-cell foam)或封闭孔型泡棉(closed-cell foam)，例如含有孔隙的聚胺甲酸乙酯或聚硅氧(polysilicone)，使得当处于压力下时，该等孔崩塌且该背托层压缩。背托层的合适材料为购自罗杰斯公司(RogersCoroperation，位于美国康乃迪克州罗杰斯市)的PORON 4701-30或购自罗门哈斯公司(Rohm & Haas)的SUBA-IV。可藉由选择该层的材料和孔隙度而调整背托层的硬度。或者，可使用与该研磨层相同的前驱物和相同孔隙度形成该背托层20，但使该背托层20具有不同的硬化程度从而具有不同硬度。
现回到图2，可于CMP设备的研磨站10处研磨一或多个基板14。在美国专利第5,738,574号中可找到对于适当研磨设备的描述，且该案内容以引用方式全文并入本案。
研磨站10可包含旋转台(platen)16，且研磨垫18放置在旋转台16上。研磨步骤期间，可利用浆料供应端口或复合式浆料/清洗臂(combined slurry/rinse arm)32供应研磨液30(例如，研磨浆料)至研磨垫18的表面。研磨液30可含有研磨粒、酸碱度调整剂或化学活性成分。
利用承载头34固持基板14并使基板14抵靠着研磨垫18。承载头34悬挂在支撑结构(例如，旋转架)上，并且利用承载件驱动轴36连接该承载头34与承载头旋转马达，使得该承载头可绕着轴38旋转。在研磨液30存在的情况下研磨垫18与基板14的相对运动导致研磨该基板14。
参阅图3，使用3D印刷工艺制造至少该研磨垫18的研磨层22。制造工艺期间，以渐进方式沉积和融合(fused)薄材料层。例如，可从液滴喷出式印刷机55的喷嘴54喷出垫前驱物材料的液滴52以形成层50。液滴喷出式印刷机55类似于喷墨印刷机，但使用垫前驱物材料，而非使用墨水。喷嘴54(如箭头A所示地)平移而横越支座51。
就所沉积的第一层50a而言，喷嘴54可喷射在支座51上。就后续沉积层50b而言，喷嘴54可喷射在已固化的材料56上。待每一层50固化之后，接着在先前沉积的层上沉积新的层，直到完整的三维(3D)研磨层22制造完成。利用喷嘴54依据计算机60上执行的3D绘图计算机程序中所储存的图案喷涂每一层。每一层50皆小于研磨层22的总厚度的50％，例如小于10％，例如小于5％，例如小于1％。
支座51可为刚性底座或为挠性膜，例如，聚四氟乙烯层(polytetrafluoroethylene，PTFE)。若支座51为膜，则该支座51可成为研磨垫18的一部分。例如，支座51可为背托层20或为介于背托层20和研磨层22之间的层。或者，可从支座51上卸除研磨层22。
可利用聚合反应达成固化作用。例如，垫前驱物材料层50可为单体，并可利用紫外线(UV)硬化法使该单体于原位上进行聚合反应。该垫前驱物材料可一旦沉积，便立即使该垫前驱物材料有效硬化，或可先沉积整个垫前驱物材料层50，且随后使整个垫前驱物材料层50同时硬化。
然而，有数种不同技术可达成3D印刷。例如，液滴52可为熔化的聚合物，并当冷却时该聚合物会固化。或者，该印刷机通过喷涂粉末层并将黏合剂材料液滴喷在该粉末层上来构造该研磨层22。在此情况下，该粉末可含有添加剂，例如含有研磨粒22。
3D印刷方法消除对于制造昂贵且耗时的模具的需求。3D印刷方法亦免于使用数个习知的垫制造步骤(例如，模塑、浇铸及机械加工)。此外，由于逐层印刷的方式能够达成紧密公差(tight tolerance)。此外，藉由简单改变储存在3D绘图计算机程序中的图案，便可使用一个印刷系统(包含印刷机55和计算机60)制造各种不同研磨垫。
在某些实施方案中，亦可使用3D印刷工艺制造该背托层20。例如，可利用印刷机55以不间断的操作方式制造背托层20和研磨层22。藉由使用不同的硬化量(例如不同的UV辐射强度)可为背托层20提供与研磨层22的硬度不同的硬度。
在其它实施方案中，使用习知工艺制造该背托层20，且随后将该背托层固定于研磨层22。例如，可利用薄黏着层28(例如，压敏式黏着剂)将研磨层22固定于背托层20。
现已描述诸多实施方案。然而，应理解尚可做出各种修改。例如，研磨垫或承载头或两者皆能移动以提供研磨表面和基板之间的相对运动。研磨垫可为圆形或某些其它形状。可于研磨垫的底表面上施用黏着层以将该垫固定于转盘上，并且将该研磨垫放置于该转盘上之前，可利用可去除的衬层覆盖该黏着层。此外，尽管文中使用诸多垂直定位用语，但需理解，该研磨表面和基板可在垂直方向或某些其它方向上颠倒设置。
因此，其它实施方案亦落入所附权利要求的范围中。

Claims (16)

1.一种制造研磨垫的研磨层的方法，所述方法包括以下步骤：
使用3D液滴喷出式印刷机相继地沉积多个层以形成所述研磨层，藉由从所述液滴喷出式印刷机的喷嘴喷出垫材料前驱物的液滴、且固化所述垫材料前驱物以形成固化的垫材料的方式来沉积所述多个研磨层的每一层，其中固化所述垫材料前驱物的步骤包括硬化所述垫材料前驱物，且其中藉由所述喷嘴将所述垫材料前驱物的液滴喷射在支座上来沉积第一层以及藉由所述喷嘴将所述垫材料前驱物的液滴喷射在已固化的垫材料上来沉积每一后续沉积层。
2.如权利要求1所述的方法，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的50％。
3.如权利要求2所述的方法，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的1％。
4.如权利要求1所述的方法，其特征在于，包括藉由在计算机上执行的3D绘图程序控制所述垫材料前驱物的射出以在所述多个层的至少一些层中形成图案的方式来在所述研磨层中形成凹槽。
5.如权利要求1所述的方法，其特征在于，硬化所述垫材料前驱物的步骤包括紫外线(UV)硬化。
6.如权利要求1所述的方法，其特征在于，所述垫材料前驱物包括胺甲酸乙酯单体。
7.如权利要求1所述的方法，其特征在于，包括通过使用所述3D印刷机相继地沉积多个层以形成所述研磨垫的背托层。
8.如权利要求7所述的方法，其特征在于，形成所述背托层的步骤包括硬化所述背托层的所述多个层，且用于硬化所述背托层的所述多个层的硬化量与硬化所述研磨层的所述多个层的硬化量不同以提供不同的硬度。
9.如权利要求8所述的方法，其特征在于，使用与所述研磨层相同的前驱物和相同的孔隙度形成所述背托层。
10.如权利要求7所述的方法，其特征在于，形成所述背托层的步骤包括喷出与所述垫前驱物材料不同的材料。
11.一种制造研磨垫的研磨层的设备，包括：
支座，用于支持所述研磨层；
3D液滴喷出式印刷机，配置成相继地沉积多个层以形成所述研磨层，所述3D液滴喷出式印刷机包括喷嘴并且配置成藉由从所述喷嘴喷出垫材料前驱物的液滴、且固化所述垫材料前驱物以形成固化的垫材料的方式来沉积所述多个层的每一层，其中藉由所述喷嘴将所述垫材料前驱物的液滴喷射在支座上来沉积第一层以及藉由所述喷嘴将所述垫材料前驱物的液滴喷射在已固化的垫材料上来沉积每一后续沉积层；以及
UV辐射，用于硬化所述垫材料前驱物以固化所述垫材料前驱物。
12.如权利要求11所述的设备，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的50％。
13.如权利要求12所述的设备，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的1％。
14.如权利要求11所述的设备，其特征在于，包括具有3D绘图程序的计算机，所述3D绘图程序配置成控制所述3D印刷机藉由控制所述垫材料前驱物的射出以在所述多个层的至少一些层中形成图案的方式来在所述研磨层中形成凹槽。
15.如权利要求11所述的设备，其特征在于，所述喷嘴配置成平移而横越所述支座。
16.如权利要求11所述的设备，其特征在于，所述垫材料前驱物包括胺甲酸乙酯单体。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021076986A1 (en) * 2019-10-16 2021-04-22 Saint-Gobain Abrasives, Inc. Abrasive articles and methods of forming

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US20160354896A1 (en) * 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
US9738032B2 (en) * 2014-06-06 2017-08-22 Xerox Corporation System for controlling operation of a printer during three-dimensional object printing with reference to a distance from the surface of object
JP6329437B2 (ja) * 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP2017530251A (ja) * 2014-07-09 2017-10-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造における、層別加熱、ライン別加熱、プラズマ加熱、及び複数の供給材料
TWI652735B (zh) 2014-10-09 2019-03-01 美商應用材料股份有限公司 具有內部通道的化學機械研磨墊
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR20170068534A (ko) * 2014-10-09 2017-06-19 어플라이드 머티어리얼스, 인코포레이티드 내부 채널들을 갖는 화학 기계적 폴리싱 패드
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) * 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
WO2016061585A1 (en) * 2014-10-17 2016-04-21 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107548346B (zh) * 2015-02-10 2021-01-05 奥普托美克公司 通过气溶胶的飞行中固化制造三维结构
JP6046865B1 (ja) * 2015-05-13 2016-12-21 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
CN107896491B (zh) 2015-06-25 2020-12-29 3M创新有限公司 制造金属粘结磨料制品的方法和金属粘结磨料制品
US9969049B2 (en) 2015-06-29 2018-05-15 Iv Technologies Co., Ltd. Polishing layer of polishing pad and method of forming the same and polishing method
CN112059937B (zh) * 2015-10-16 2022-11-01 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
WO2017074773A1 (en) * 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) * 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR102629800B1 (ko) * 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
SG11201806820UA (en) * 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
US20210276244A1 (en) * 2016-07-22 2021-09-09 Virginia Tech Intellectual Properties, Inc. Corrugated three dimensional (3d) additive manufacturing
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
US11002530B2 (en) * 2016-09-20 2021-05-11 Applied Materials, Inc. Tiltable platform for additive manufacturing of a polishing pad
CN106239943B (zh) * 2016-09-26 2018-10-16 华侨大学 一种针对熔融沉积制造fdm成型件的抛光机及其使用方法
TWI647070B (zh) * 2017-02-20 2019-01-11 詠巨科技有限公司 組合式修整器及其製造方法
US11383350B2 (en) 2017-02-28 2022-07-12 3M Innovative Properties Company Metal bond abrasive articles and methods of making metal bond abrasive articles
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
DE202018104180U1 (de) 2017-07-20 2018-10-25 DIT Diamanttechnik GmbH & Co. KG Generativ gefertigtes Schleifwerkzeug zur Bearbeitung von Hartstoffen und Composites
US11471999B2 (en) * 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US20200247932A1 (en) 2017-10-02 2020-08-06 Basf Se Uv curable compositions with controlled mechanical and chemical properties, methods, and articles therefrom
SG11202002484XA (en) * 2017-10-10 2020-04-29 Applied Materials Inc Selective powder delivery for additive manufacturing
WO2019094979A1 (en) 2017-11-13 2019-05-16 Optomec, Inc. Shuttering of aerosol streams
JP2019107839A (ja) * 2017-12-20 2019-07-04 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
CN108274123B (zh) * 2017-12-28 2020-07-07 北京航空航天大学 一种用于激光增材构件内壁的增材-抛光一体化加工方法
KR20200108098A (ko) 2018-02-05 2020-09-16 어플라이드 머티어리얼스, 인코포레이티드 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅
WO2019217012A1 (en) 2018-05-07 2019-11-14 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
CN113056496B (zh) * 2018-11-19 2023-09-08 应用材料公司 用于3d打印的低粘度uv可固化配方
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11367643B2 (en) * 2019-06-28 2022-06-21 Applied Materials, Inc. Method for substrate registration and anchoring in inkjet printing
US11965103B2 (en) 2019-08-21 2024-04-23 Applied Materials, Inc. Additive manufacturing of polishing pads
US12006442B2 (en) * 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN113070810A (zh) * 2020-01-03 2021-07-06 铨科光电材料股份有限公司 晶圆抛光垫
JP7479668B2 (ja) 2020-01-28 2024-05-09 株式会社東邦鋼機製作所 触媒パッド、その製造方法および製造装置
JP2023523022A (ja) * 2020-04-21 2023-06-01 スマート パッド エルエルシー 突出構造を有する化学的機械研磨パッド
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11612978B2 (en) 2020-06-09 2023-03-28 Applied Materials, Inc. Additive manufacturing of polishing pads
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
JP2023540738A (ja) 2020-09-03 2023-09-26 ビーエーエスエフ ソシエタス・ヨーロピア 反応性ポリウレタンエラストマー
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
WO2023107567A1 (en) 2021-12-08 2023-06-15 Basf Se Photocurable resins with high heat deflection temperatures

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5906863A (en) * 1994-08-08 1999-05-25 Lombardi; John Methods for the preparation of reinforced three-dimensional bodies
DE19834559A1 (de) * 1998-07-31 2000-02-03 Friedrich Schiller Uni Jena Bu Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen
WO2002024415A1 (en) * 2000-09-19 2002-03-28 Rodel Holdings, Inc. Polishing pad having an advantageous micro-texture
EP1661690A1 (en) * 2003-08-27 2006-05-31 Fuji Photo Film Co., Ltd. Method of producing three-dimensional model
EP1512519A3 (en) * 2003-08-25 2008-07-16 Hewlett-Packard Development Company, L.P. A method and a system for solid freeform fabrication using non-reactive powder

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387380A (en) * 1989-12-08 1995-02-07 Massachusetts Institute Of Technology Three-dimensional printing techniques
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
US6036579A (en) 1997-01-13 2000-03-14 Rodel Inc. Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto
US5940674A (en) * 1997-04-09 1999-08-17 Massachusetts Institute Of Technology Three-dimensional product manufacture using masks
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
WO2001064396A1 (en) * 2000-02-28 2001-09-07 Rodel Holdings, Inc. Polishing pad surface texture formed by solid phase droplets
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
EP1268165B1 (en) * 2000-03-24 2004-10-06 GENERIS GmbH Method and apparatus for manufacturing a structural part by a multi-layer deposition technique, and mold or core as manufactured by the method
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
CN100379522C (zh) 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
US20020111707A1 (en) * 2000-12-20 2002-08-15 Zhimin Li Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
GB0127252D0 (en) * 2001-11-13 2002-01-02 Vantico Ag Production of composite articles composed of thin layers
DE10224981B4 (de) * 2002-06-05 2004-08-19 Generis Gmbh Verfahren zum schichtweisen Aufbau von Modellen
US20060111807A1 (en) * 2002-09-12 2006-05-25 Hanan Gothait Device, system and method for calibration in three-dimensional model printing
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
US20050012247A1 (en) * 2003-07-18 2005-01-20 Laura Kramer Systems and methods for using multi-part curable materials
GB0323462D0 (en) * 2003-10-07 2003-11-05 Fujifilm Electronic Imaging Providing a surface layer or structure on a substrate
KR20050038835A (ko) * 2003-10-23 2005-04-29 동부아남반도체 주식회사 패드 그루브 구조
KR100576465B1 (ko) 2003-12-01 2006-05-08 주식회사 하이닉스반도체 연마입자 함침 조성물을 이용한 연마 패드
US7216009B2 (en) * 2004-06-14 2007-05-08 Micron Technology, Inc. Machine vision systems for use with programmable material consolidation system and associated methods and structures
JP2006095680A (ja) * 2004-09-14 2006-04-13 Zhiguo Long 切割研磨シートとその製造方法
KR100606457B1 (ko) * 2004-11-11 2006-11-23 한국기계연구원 3차원 프린팅 조형시스템
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7524345B2 (en) * 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
US20080306022A1 (en) 2005-10-12 2008-12-11 Kenji Miyamoto Agent for Applying to Mucosa and Method for the Production Thereof
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
KR100761847B1 (ko) * 2005-12-07 2007-09-28 삼성전자주식회사 연마 입자가 내재된 연마 패드, 이의 제조 방법, 및 이를포함하는 화학적 기계적 연마 장치
US20070212979A1 (en) 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
US20070235904A1 (en) * 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
KR100842486B1 (ko) 2006-10-30 2008-07-01 동부일렉트로닉스 주식회사 Ｃｍｐ 장비의 폴리싱패드와 이의 제조장치
US7862320B2 (en) * 2007-07-17 2011-01-04 Seiko Epson Corporation Three-dimensional object forming apparatus and method for forming three dimensional object
EP2664444B1 (en) * 2007-07-25 2018-03-28 Stratasys Ltd. Solid freeform fabrication using a plurality of modeling materials
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
EP2305454B1 (en) * 2008-05-26 2017-03-22 Sony Corporation Shaping apparatus and shaping method
US8282866B2 (en) * 2008-06-30 2012-10-09 Seiko Epson Corporation Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device
KR20100073095A (ko) * 2008-12-22 2010-07-01 주식회사 하이닉스반도체 화학기계적 연마용 연마 패드
CN102281990A (zh) 2009-01-16 2011-12-14 应用材料股份有限公司 具有窗口支撑件的研磨垫与系统
JP2012094559A (ja) * 2010-10-22 2012-05-17 Sumco Corp 硬脆性ウェーハの平坦化加工方法および平坦化加工用パッド
US20120316458A1 (en) 2011-06-11 2012-12-13 Aliphcom, Inc. Data-capable band for medical diagnosis, monitoring, and treatment
WO2013128452A1 (en) 2012-03-01 2013-09-06 Stratasys Ltd. Cationic polymerizable compositions and methods of use thereof
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5906863A (en) * 1994-08-08 1999-05-25 Lombardi; John Methods for the preparation of reinforced three-dimensional bodies
DE19834559A1 (de) * 1998-07-31 2000-02-03 Friedrich Schiller Uni Jena Bu Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen
WO2002024415A1 (en) * 2000-09-19 2002-03-28 Rodel Holdings, Inc. Polishing pad having an advantageous micro-texture
EP1512519A3 (en) * 2003-08-25 2008-07-16 Hewlett-Packard Development Company, L.P. A method and a system for solid freeform fabrication using non-reactive powder
EP1661690A1 (en) * 2003-08-27 2006-05-31 Fuji Photo Film Co., Ltd. Method of producing three-dimensional model

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021076986A1 (en) * 2019-10-16 2021-04-22 Saint-Gobain Abrasives, Inc. Abrasive articles and methods of forming
CN114650897A (zh) * 2019-10-16 2022-06-21 圣戈班磨料磨具有限公司 磨料制品及其形成方法

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