CN104285281A - 印刷式化学机械研磨垫 - Google Patents

印刷式化学机械研磨垫 Download PDF

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CN104285281A
CN104285281A CN201380023299.6A CN201380023299A CN104285281A CN 104285281 A CN104285281 A CN 104285281A CN 201380023299 A CN201380023299 A CN 201380023299A CN 104285281 A CN104285281 A CN 104285281A
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CN104285281B (zh
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R·巴贾杰
B·L·钦
T·Y·李
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Applied Materials Inc
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Abstract

一种制造研磨垫的研磨层的方法，包括使用3D印刷机相继地沉积多个层，藉由从喷头喷出垫材料前驱物、并固化该垫材料前驱物以形成固化的垫材料的方式来沉积该多个研磨层的每一层。

Description

印刷式化学机械研磨垫
技术领域
本发明关于化学机械研磨期间所使用的研磨垫。
背景
通常藉由在硅晶圆上循序沉积导体层、半导体层或绝缘层而在基板上形成集成电路。许多不同制造工艺皆需要对基板上的层进行平坦化。举例言之，就某些应用而言，例如欲研磨金属材料以在图案化层的沟槽中形成通孔、插销和线路时，会对上层进行平坦化直到暴露出图案化层的顶表面。在其它应用上，例如介电层平坦化以用于光微影技术中，则会研磨上层，直到在下层上保留期望厚度的上层。
化学机械研磨(CMP)是公认的平坦化方法之一。此平坦化方法通常要求将基板安装在承载头上。通常使基板的暴露表面抵靠着旋转中的研磨垫放置。承载头在基板上提供可控制的负载(load)以推挤基板使该基板抵靠着研磨垫。通常会供应研磨液(例如，含有研磨粒的浆料)至研磨垫的表面。
化学机械研磨工艺的一个目标是使研磨均匀一致。若以不同速率研磨基板的不同区域，则基板的某些区域可能被去除过多材料(“过度研磨”)或去除太少材料(“研磨不足”)。
习知的研磨垫包括“标准”垫和固定研磨粒垫。标准垫具有聚胺甲酸乙酯(polyurethane)研磨层，且该聚胺甲酸乙酯研磨层具有耐磨的粗糙表面，且该标准垫亦可包含可压缩背托层(compressible backing layer)。相较之下，固定研磨粒垫具有固定在固定介质(containment media)中的研磨粒，且该固定研磨粒垫通常可支撑在不可压缩背托层(incompressible backing layer)上。
一般利用模塑(molding)、浇铸(casting)或烧结(sintering)聚胺甲酸乙酯材料制成研磨垫。对于模塑的情形，例如利用射出成形法一次可生产一个研磨垫。在浇铸法的例子中，使液体前驱物注模并硬化成块，随后将该硬块切割成个别垫片。随后此等垫片可加工至最终厚度。可在研磨表面中加工形成沟槽，或作为射出成形工艺的一部分在研磨表面中形成沟槽。
除了平坦化之外，研磨垫亦可用于完成作业，例如用于抛光。
概要
为提供研磨的均匀一致性，研磨垫需与正进行研磨的基板形成均匀接触，从而能够在整个基板表面上施加均匀的压力。垫的厚度差异可能在整个基板表面上产生不均匀的压力。即使是厚度上的小差异也会导致所施加压力的变化，且从而造成不均匀的去除作用以及较多的缺陷，例如在基板表面上造成微细刮痕。此种效应对于硬研磨垫而言更加严重，并且在低压力研磨制程中亦较为严重。尽管软研磨垫可容适较大的厚度差异，但在垫中形成沟槽的工艺对于软研磨垫而言更容易产生不均匀性。
能改善厚度均匀性的研磨垫制造技术是使用3D印刷工艺。在3D印刷工艺中，以渐进方式沉积垫前驱物(例如，粉末)的薄层，并使垫前驱物薄层融合(fused)成完整的三维(3D)研磨垫。
在一方面中，制造研磨垫的研磨层的方法包括使用三维(3D)印刷机相继地沉积多个层，藉由从喷嘴喷出垫材料前驱物、且固化该垫材料前驱物以形成固化的垫材料的方式来沉积该多个研磨层的每一层。
本发明的实施方案可包括以下特征的其中一个或多个特征。该多个层的每一层的厚度可小于研磨垫的总厚度的50％。该多个层的每一层的厚度可小于研磨垫的总厚度的1％。可藉由在计算机上执行的三维(3D)绘图程序控制垫材料前驱物的射出以在该多个层的至少一些层中形成图案而在该研磨层中形成凹槽。该等凹槽可为研磨垫的总水平表面积的10％至75％。介于该等凹槽之间的台地部分(plateaus)可具有0.1毫米(mm)至2.5毫米的横向尺寸。该等凹槽可具有0.25毫米至1.5毫米的深度。该等凹槽可具有0.1毫米至2毫米的最宽横向(lateral)尺寸。该等凹槽的形状可塑造成圆柱形、平头角锥形或棱柱形中的一者或多者。该等凹槽可以是沟槽。固化(solidifying)该垫材料前驱物的步骤可包括硬化(curing)该垫材料前驱物。硬化该垫材料前驱物的步骤可包括紫外线(UV)硬化。垫材料前驱物可包括胺甲酸乙酯单体(urethane monomer)。该固化的垫材料可包括聚胺甲酸乙酯(polyurethane)。可于该固化的垫材料内提供研磨粒。研磨粒可为金属氧化物颗粒。可使用3D印刷机相继地沉积多个层以形成研磨垫的背托层。形成背托层的步骤可包括硬化该背托层的多个层，且用于硬化该背托层的该多个层的硬化量与硬化该研磨层的该多个层的硬化量不同。形成该背托层的步骤可包括喷出与该垫前驱物材料不同的材料。该固化的研磨材料所具有的硬度可介于约40萧氏D型硬度(Shore D)至80萧氏D型硬度之间。该垫材料前驱物可为熔化的垫材料，且固化该垫材料前驱物的步骤可包括冷却该熔化的垫材料。
本发明的潜在优点可包括下述一或多项优点。所制造的研磨垫可具有极高的公差(tolerance)，即具有良好的厚度均匀性。可在研磨垫中形成沟槽而不会使厚度均匀性产生畸变。改善整个基板上的研磨均匀性，尤其是改善于低压力(例如，低于0.8psi，或甚至低于0.5psi或0.3psi)下整个基板上的研磨均匀性。本发明的垫制造工艺适用于不同的研磨垫构造和沟槽图案。可更快且更便宜地制造研磨垫。
附图及以下内容陈述一或多个实施方案的细节。由本案说明书、附图及权利要求范围将可理解其它特征、目标和优点。
附图描述
图1A是示例性研磨垫的概要侧视剖面图。
图1B是另一示例性研磨垫的概要侧视剖面图。
图1C是又另一示例性研磨垫的概要侧视剖面图。
图2是化学机械研磨站的概要侧视局部剖面图。
图3是图示基板与图1A的研磨垫接触的概要侧视剖面图。
图中以相同组件符号代表各图中的相同组件。
详细描述
参阅图1A～1C，研磨垫18包含研磨层22。如图1A所示，研磨垫可以是由研磨层22所组成的单层式垫，或如图1C所示般，研磨垫可为包含研磨层22和至少一背托层20的多层式垫。
研磨层22可以是在研磨工艺中呈惰性的材料。研磨层22的材料可为塑料，例如聚胺甲酸乙酯(polyurethane)。在某些实施方案中，研磨层22为相对耐用且硬的材料。例如，以萧氏D型硬度等级而言，研磨层22所具有的硬度可为约40萧氏D型硬度至80萧氏D型硬度，例如55萧氏D型硬度至65萧氏D型硬度。
如图1A所示，研磨层22可为由均质组成物所形成的层，或如图1B所示，研磨层22可含有固定在由塑料材料(例如，聚胺甲酸乙酯)所形成的基质29中的研磨粒28。研磨粒28比基质29的材料更硬。研磨粒28可占该研磨层的0.05重量％至75重量％。例如，研磨粒28可能少于该研磨层22的1重量％，例如少于0.1重量％。或者，研磨粒28可多于该研磨层22的10重量％，例如多于50重量％。研磨粒的材料可为金属氧化物，例如氧化铈(ceria)、氧化铝(alumina)、氧化硅(silica)或上述金属氧化物的组合物。
在某些实施方案中，该研磨层可包含孔洞，例如小孔隙。该等孔洞可宽达50微米至100微米。
研磨层18所具有的厚度D1可为80密耳(mils)或更薄，例如可为50密耳或更薄，例如25密耳或更薄。由于调整(conditioning)工艺通常将表层(cover layer)磨除，因此可选择该研磨层22的厚度，以为该研磨垫18提供可用的寿命，例如3000次的研磨和调整循环。
在微观尺度上，研磨层22的研磨表面24可具有粗糙的表面纹理，例如2微米至4微米的表面均方根(rms)粗糙度。例如，可使研磨层22经过研磨或调整工艺以产生粗糙的表面纹理。此外，3D印刷可提供小且均匀一致的特征，例如小至200微米的特征。
尽管研磨表面24在微观尺度上可能是粗糙的，但在研磨垫本身的宏观尺度上，研磨层22可具有良好的厚度均匀性(此均匀性是指相对于研磨层底表面而言，研磨表面24在高度上的整体变化，而不是指刻意在该研磨层中形成的任何宏观上的沟槽或孔洞)。例如，厚度的不均匀性可小于1密耳。
可任选地，该研磨表面24的至少一部分中可形成有多个沟槽26以用于输送浆料。该等沟槽26可几乎是任何图案，例如同心圆、直线状、格纹状、螺旋状及诸如此类的形状。假若具有沟槽，则介于该等沟槽26之间的研磨表面24(即，台地部分)可例如约占研磨垫22的总水平表面积的25％至90％。因此，该等沟槽26可占该研磨垫18的总水平表面积的10％至75％。介于该等沟槽26之间的台地部分可具有约0.1毫米至约2.5毫米的横向宽度。
在某些实施方案中，例如，若具有背托层20时，该等沟槽26可延伸贯穿整个研磨层22。在某些实施方案中，该等沟槽26可延伸穿透该研磨层22的厚度的约20％至80％，例如40％。该等沟槽26的深度可为0.25毫米至1毫米。例如，在具有厚度为50密耳的研磨层22的研磨垫18中，该等沟槽26的深度D2可为约20密耳。
背托层20可比研磨层22柔软且更加可压缩。以萧氏A型硬度等级而言，背托层20可具有80或更小的硬度，例如可具有约60萧氏A型硬度。背托层20可比研磨层22厚、比研磨层22薄或与研磨层22具有相同厚度。
例如，该背托层可为开放孔型泡棉(open-cell foam)或封闭孔型泡棉(closed-cell foam)，例如含有孔隙的聚胺甲酸乙酯或聚硅氧(polysilicone)，使得当处于压力下时，该等孔崩塌且该背托层压缩。背托层的合适材料为购自罗杰斯公司(Rogers Coroperation，位于美国康乃迪克州罗杰斯市)的PORON 4701-30或购自罗门哈斯公司(Rohm & Haas)的SUBA-IV。可藉由选择该层的材料和孔隙度而调整背托层的硬度。或者，可使用与该研磨层相同的前驱物和相同孔隙度形成该背托层20，但使该背托层20具有不同的硬化程度从而具有不同硬度。
现回到图2，可于CMP设备的研磨站10处研磨一或多个基板14。在美国专利第5,738,574号中可找到对于适当研磨设备的描述，且该案内容以引用方式全文并入本案。
研磨站10可包含旋转台(platen)16，且研磨垫18放置在旋转台16上。研磨步骤期间，可利用浆料供应端口或复合式浆料/清洗臂(combined slurry/rinsearm)32供应研磨液30(例如，研磨浆料)至研磨垫18的表面。研磨液30可含有研磨粒、酸碱度调整剂或化学活性成分。
利用承载头34固持基板14并使基板14抵靠着研磨垫18。承载头34悬挂在支撑结构(例如，旋转架)上，并且利用承载件驱动轴36连接该承载头34与承载头旋转马达，使得该承载头可绕着轴38旋转。在研磨液30存在的情况下研磨垫18与基板14的相对运动导致研磨该基板14。
参阅图3，使用3D印刷工艺制造至少该研磨垫18的研磨层22。制造工艺期间，以渐进方式沉积和融合(fused)薄材料层。例如，可从液滴喷出式印刷机55的喷嘴54喷出垫前驱物材料的液滴52以形成层50。液滴喷出式印刷机55类似于喷墨印刷机，但使用垫前驱物材料，而非使用墨水。喷嘴54(如箭头A所示地)平移而横越支座51。
就所沉积的第一层50a而言，喷嘴54可喷射在支座51上。就后续沉积层50b而言，喷嘴54可喷射在已固化的材料56上。待每一层50固化之后，接着在先前沉积的层上沉积新的层，直到完整的三维(3D)研磨层22制造完成。利用喷嘴54依据计算机60上执行的3D绘图计算机程序中所储存的图案喷涂每一层。每一层50皆小于研磨层22的总厚度的50％，例如小于10％，例如小于5％，例如小于1％。
支座51可为刚性底座或为挠性膜，例如，聚四氟乙烯层(polytetrafluoroethylene，PTFE)。若支座51为膜，则该支座51可成为研磨垫18的一部分。例如，支座51可为背托层20或为介于背托层20和研磨层22之间的层。或者，可从支座51上卸除研磨层22。
可利用聚合反应达成固化作用。例如，垫前驱物材料层50可为单体，并可利用紫外线(UV)硬化法使该单体于原位上进行聚合反应。该垫前驱物材料可一旦沉积，便立即使该垫前驱物材料有效硬化，或可先沉积整个垫前驱物材料层50，且随后使整个垫前驱物材料层50同时硬化。
然而，有数种不同技术可达成3D印刷。例如，液滴52可为熔化的聚合物，并当冷却时该聚合物会固化。或者，该印刷机通过喷涂粉末层并将黏合剂材料液滴喷在该粉末层上来构造该研磨层22。在此情况下，该粉末可含有添加剂，例如含有研磨粒22。
3D印刷方法消除对于制造昂贵且耗时的模具的需求。3D印刷方法亦免于使用数个习知的垫制造步骤(例如，模塑、浇铸及机械加工)。此外，由于逐层印刷的方式能够达成紧密公差(tight tolerance)。此外，藉由简单改变储存在3D绘图计算机程序中的图案，便可使用一个印刷系统(包含印刷机55和计算机60)制造各种不同研磨垫。
在某些实施方案中，亦可使用3D印刷工艺制造该背托层20。例如，可利用印刷机55以不间断的操作方式制造背托层20和研磨层22。藉由使用不同的硬化量(例如不同的UV辐射强度)可为背托层20提供与研磨层22的硬度不同的硬度。
在其它实施方案中，使用习知工艺制造该背托层20，且随后将该背托层固定于研磨层22。例如，可利用薄黏着层28(例如，压敏式黏着剂)将研磨层22固定于背托层20。
现已描述诸多实施方案。然而，应理解尚可做出各种修改。例如，研磨垫或承载头或两者皆能移动以提供研磨表面和基板之间的相对运动。研磨垫可为圆形或某些其它形状。可于研磨垫的底表面上施用黏着层以将该垫固定于转盘上，并且将该研磨垫放置于该转盘上之前，可利用可去除的衬层覆盖该黏着层。此外，尽管文中使用诸多垂直定位用语，但需理解，该研磨表面和基板可在垂直方向或某些其它方向上颠倒设置。
因此，其它实施方案亦落入所附权利要求的范围中。

Claims (15)

1.一种制造研磨垫的研磨层的方法，所述方法包括以下步骤：
使用3D印刷机相继地沉积多个层，藉由从喷嘴喷出垫材料前驱物、且固化所述垫材料前驱物以形成固化的垫材料的方式来沉积多个研磨层的每一层。
2.如权利要求1所述的方法，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的50％。
3.如权利要求2所述的方法，其特征在于，所述多个层的每一层的厚度小于所述研磨层的总厚度的1％。
4.如权利要求1所述的方法，其特征在于，包括藉由在计算机上执行的3D绘图程序控制所述垫材料前驱物的射出以在所述多个层的至少一些层中形成图案的方式来在所述研磨层中形成凹槽。
5.如权利要求4所述的方法，其特征在于，所述凹槽的形状塑造成圆柱形、平头角锥形或棱柱形中的一者或多者。
6.如权利要求1所述的方法，其特征在于，固化所述垫材料前驱物的步骤包括硬化所述垫材料前驱物。
7.如权利要求6所述的方法，其特征在于，硬化所述垫材料前驱物的步骤包括紫外线(UV)硬化。
8.如权利要求6所述的方法，其特征在于，所述垫材料前驱物包括胺甲酸乙酯单体。
9.如权利要求1所述的方法，其特征在于，包括于所述固化的垫材料内提供研磨粒。
10.如权利要求9所述的方法，其特征在于，所述研磨粒包括金属氧化物颗粒。
11.如权利要求9所述的方法，其特征在于，所述研磨粒包括氧化硅、氧化铝、氧化铈或上述各项的组合物。
12.如权利要求1所述的方法，其特征在于，包括通过使用所述3D印刷机相继地沉积多个层以形成所述研磨垫的背托层。
13.如权利要求12所述的方法，其特征在于，形成所述背托层的步骤包括硬化所述背托层的所述多个层，且用于硬化所述背托层的所述多个层的硬化量与硬化所述研磨层的所述多个层的硬化量不同。
14.如权利要求12所述的方法，其特征在于，形成所述背托层的步骤包括喷出与所述垫前驱物材料不同的材料。
15.如权利要求1所述的方法，其特征在于，所述垫材料前驱物包括熔化的垫材料，以及固化所述垫材料前驱物的步骤包括冷却所述熔化的垫材料。
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