KR102426444B1 - 프린팅된 화학적 기계적 연마 패드 - Google Patents
프린팅된 화학적 기계적 연마 패드 Download PDFInfo
- Publication number
- KR102426444B1 KR102426444B1 KR1020177013087A KR20177013087A KR102426444B1 KR 102426444 B1 KR102426444 B1 KR 102426444B1 KR 1020177013087 A KR1020177013087 A KR 1020177013087A KR 20177013087 A KR20177013087 A KR 20177013087A KR 102426444 B1 KR102426444 B1 KR 102426444B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing pad
- additive material
- additive
- droplets
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020227025793A KR102638128B1 (ko) | 2014-10-17 | 2015-10-16 | 프린팅된 화학적 기계적 연마 패드 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462065190P | 2014-10-17 | 2014-10-17 | |
| US62/065,190 | 2014-10-17 | ||
| US201462066291P | 2014-10-20 | 2014-10-20 | |
| US62/066,291 | 2014-10-20 | ||
| PCT/US2015/056021 WO2016061506A1 (en) | 2014-10-17 | 2015-10-16 | Printed chemical mechanical polishing pad |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227025793A Division KR102638128B1 (ko) | 2014-10-17 | 2015-10-16 | 프린팅된 화학적 기계적 연마 패드 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170070177A KR20170070177A (ko) | 2017-06-21 |
| KR102426444B1 true KR102426444B1 (ko) | 2022-07-29 |
Family
ID=55747430
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177013087A Active KR102426444B1 (ko) | 2014-10-17 | 2015-10-16 | 프린팅된 화학적 기계적 연마 패드 |
| KR1020227025793A Active KR102638128B1 (ko) | 2014-10-17 | 2015-10-16 | 프린팅된 화학적 기계적 연마 패드 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227025793A Active KR102638128B1 (ko) | 2014-10-17 | 2015-10-16 | 프린팅된 화학적 기계적 연마 패드 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10322491B2 (enExample) |
| JP (1) | JP6703985B2 (enExample) |
| KR (2) | KR102426444B1 (enExample) |
| CN (1) | CN107073677B (enExample) |
| TW (1) | TWI689406B (enExample) |
| WO (1) | WO2016061506A1 (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| TWI689406B (zh) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| CN113146464A (zh) | 2016-01-19 | 2021-07-23 | 应用材料公司 | 多孔化学机械抛光垫 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| EP4011923B1 (en) * | 2016-01-21 | 2024-08-28 | 3M Innovative Properties Company | Methods of making metal bond and vitreous bond abrasive articles |
| EP3257660A1 (en) | 2016-06-13 | 2017-12-20 | Siemens Aktiengesellschaft | Method of providing an abrasive means and of additively manufacturing a component |
| KR102202909B1 (ko) * | 2016-11-21 | 2021-01-14 | 주식회사 엘지화학 | 3d 프린팅용 조성물 |
| US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
| KR101897659B1 (ko) * | 2017-01-16 | 2018-09-13 | 원광대학교산학협력단 | 이중기공 세포지지체 제조시스템 및 제조방법, 그리고 세포지지체 |
| IT201700038586A1 (it) * | 2017-04-07 | 2018-10-07 | Aros Srl | Metodo per la realizzazione di un utensile. |
| US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| WO2019152222A1 (en) | 2018-02-05 | 2019-08-08 | Applied Materials, Inc. | Piezo-electric end-pointing for 3d printed cmp pads |
| JP7373503B2 (ja) * | 2018-05-07 | 2023-11-02 | アプライド マテリアルズ インコーポレイテッド | 親水性及びゼータ電位の調節可能な化学機械研磨パッド |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| CN113056496B (zh) * | 2018-11-19 | 2023-09-08 | 应用材料公司 | 用于3d打印的低粘度uv可固化配方 |
| CN109483418B (zh) * | 2018-12-28 | 2023-11-17 | 西安增材制造国家研究院有限公司 | 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法 |
| US20200230781A1 (en) * | 2019-01-23 | 2020-07-23 | Applied Materials, Inc. | Polishing pads formed using an additive manufacturing process and methods related thereto |
| US11731231B2 (en) * | 2019-01-28 | 2023-08-22 | Micron Technology, Inc. | Polishing system, polishing pad, and related methods |
| TWI850338B (zh) * | 2019-02-28 | 2024-08-01 | 美商應用材料股份有限公司 | 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法 |
| CN110076339A (zh) * | 2019-03-06 | 2019-08-02 | 上海工程技术大学 | 一种复杂空腔增材制件内外表面的抛光方法 |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| CN114126803B (zh) * | 2019-05-07 | 2024-07-16 | Cmc材料有限责任公司 | 具有固定沟槽体积的化学机械平坦化垫 |
| US12006442B2 (en) | 2019-09-11 | 2024-06-11 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
| CN110977801A (zh) * | 2019-12-20 | 2020-04-10 | 中国科学院长春光学精密机械与物理研究所 | 一种沥青抛光盘制备装置 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US20210323114A1 (en) * | 2020-04-21 | 2021-10-21 | Smart Pad LLC | Chemical-mechanical polishing pad with protruded structures |
| US11738517B2 (en) | 2020-06-18 | 2023-08-29 | Applied Materials, Inc. | Multi dispense head alignment using image processing |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| US11951590B2 (en) | 2021-06-14 | 2024-04-09 | Applied Materials, Inc. | Polishing pads with interconnected pores |
| US20230094483A1 (en) * | 2021-09-29 | 2023-03-30 | Entegris, Inc. | Pad conditioner with polymer backing plate |
| KR102700222B1 (ko) * | 2021-10-12 | 2024-08-29 | 에스케이엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| TW202419495A (zh) * | 2022-06-15 | 2024-05-16 | 美商Cmc材料有限責任公司 | 用於化學機械拋光墊之uv可固化樹脂 |
| US20230405765A1 (en) * | 2022-06-15 | 2023-12-21 | Cmc Materials Llc | Dual-cure resin for preparing chemical mechanical polishing pads |
| US20250121472A1 (en) * | 2023-10-12 | 2025-04-17 | Applied Materials, Inc. | Polishing articles for hybrid bonding applications |
| CN120839671A (zh) * | 2025-09-22 | 2025-10-28 | 华侨大学 | 一种增材制造铣磨头及其一体化成型的批量制造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067171A (ja) * | 2000-08-25 | 2002-03-05 | Canon Inc | 目的物生成装置、目的物生成方法、及び記憶媒体 |
| JP2004281685A (ja) * | 2003-03-14 | 2004-10-07 | Mitsubishi Electric Corp | 半導体基板の研磨用パッドおよび半導体基板の研磨方法 |
| JP2008546167A (ja) * | 2005-02-18 | 2008-12-18 | ネオパッド テクノロジーズ コーポレイション | Cmp用のカスタマイズされた研磨パッド、ならびにその製造方法および使用 |
| US20130283700A1 (en) * | 2012-04-25 | 2013-10-31 | Rajeev Bajaj | Printed Chemical Mechanical Polishing Pad |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5919082A (en) * | 1997-08-22 | 1999-07-06 | Micron Technology, Inc. | Fixed abrasive polishing pad |
| JP2000061817A (ja) * | 1998-08-24 | 2000-02-29 | Nikon Corp | 研磨パッド |
| WO2001091975A1 (en) * | 2000-05-31 | 2001-12-06 | Jsr Corporation | Abrasive material |
| JP2002028849A (ja) * | 2000-07-17 | 2002-01-29 | Jsr Corp | 研磨パッド |
| US6592443B1 (en) * | 2000-08-30 | 2003-07-15 | Micron Technology, Inc. | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| GB0103754D0 (en) * | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-dimensional structured printing |
| US20060189269A1 (en) | 2005-02-18 | 2006-08-24 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| WO2005000529A1 (en) * | 2003-06-03 | 2005-01-06 | Neopad Technologies Corporation | Synthesis of a functionally graded pad for chemical mechanical planarization |
| US7435161B2 (en) | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
| KR100640998B1 (ko) | 2003-09-19 | 2006-11-02 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 브라켓 구조 |
| US20060079159A1 (en) * | 2004-10-08 | 2006-04-13 | Markus Naujok | Chemical mechanical polish with multi-zone abrasive-containing matrix |
| WO2006057720A1 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
| US7815778B2 (en) | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
| US7846008B2 (en) | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
| WO2006057713A2 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
| KR101616535B1 (ko) * | 2005-02-18 | 2016-04-29 | 넥스플래너 코퍼레이션 | 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법 |
| US7875091B2 (en) * | 2005-02-22 | 2011-01-25 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
| JP2006231464A (ja) * | 2005-02-24 | 2006-09-07 | Nitta Haas Inc | 研磨パッド |
| US7829000B2 (en) * | 2005-02-25 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Core-shell solid freeform fabrication |
| WO2009032768A2 (en) * | 2007-09-03 | 2009-03-12 | Semiquest, Inc. | Polishing pad |
| US8177603B2 (en) | 2008-04-29 | 2012-05-15 | Semiquest, Inc. | Polishing pad composition |
| CN102131618A (zh) | 2008-06-26 | 2011-07-20 | 3M创新有限公司 | 具有多孔单元的抛光垫以及制造和使用该抛光垫的方法 |
| US8292692B2 (en) | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
| CN102686362A (zh) | 2009-12-30 | 2012-09-19 | 3M创新有限公司 | 包括分相共混聚合物的抛光垫及其制备和使用方法 |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| KR20130095430A (ko) * | 2012-02-20 | 2013-08-28 | 케이피엑스케미칼 주식회사 | 연마패드 및 그 제조방법 |
| KR102252673B1 (ko) | 2013-09-25 | 2021-05-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 다층화된 폴리싱 패드 |
| US9421666B2 (en) * | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| TWI689406B (zh) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
-
2015
- 2015-09-25 TW TW104131878A patent/TWI689406B/zh active
- 2015-10-16 WO PCT/US2015/056021 patent/WO2016061506A1/en not_active Ceased
- 2015-10-16 JP JP2017520355A patent/JP6703985B2/ja active Active
- 2015-10-16 CN CN201580056353.6A patent/CN107073677B/zh active Active
- 2015-10-16 KR KR1020177013087A patent/KR102426444B1/ko active Active
- 2015-10-16 KR KR1020227025793A patent/KR102638128B1/ko active Active
- 2015-10-16 US US14/885,955 patent/US10322491B2/en active Active
-
2019
- 2019-06-17 US US16/442,687 patent/US20190299357A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067171A (ja) * | 2000-08-25 | 2002-03-05 | Canon Inc | 目的物生成装置、目的物生成方法、及び記憶媒体 |
| JP2004281685A (ja) * | 2003-03-14 | 2004-10-07 | Mitsubishi Electric Corp | 半導体基板の研磨用パッドおよび半導体基板の研磨方法 |
| JP2008546167A (ja) * | 2005-02-18 | 2008-12-18 | ネオパッド テクノロジーズ コーポレイション | Cmp用のカスタマイズされた研磨パッド、ならびにその製造方法および使用 |
| US20130283700A1 (en) * | 2012-04-25 | 2013-10-31 | Rajeev Bajaj | Printed Chemical Mechanical Polishing Pad |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220110333A (ko) | 2022-08-05 |
| CN107073677B (zh) | 2020-05-15 |
| TW201615389A (zh) | 2016-05-01 |
| US10322491B2 (en) | 2019-06-18 |
| TWI689406B (zh) | 2020-04-01 |
| US20190299357A1 (en) | 2019-10-03 |
| KR102638128B1 (ko) | 2024-02-20 |
| KR20170070177A (ko) | 2017-06-21 |
| CN107073677A (zh) | 2017-08-18 |
| WO2016061506A1 (en) | 2016-04-21 |
| JP2017533831A (ja) | 2017-11-16 |
| US20160107288A1 (en) | 2016-04-21 |
| JP6703985B2 (ja) | 2020-06-03 |
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