TWI689406B - 研磨墊及製造其之方法 - Google Patents

研磨墊及製造其之方法 Download PDF

Info

Publication number
TWI689406B
TWI689406B TW104131878A TW104131878A TWI689406B TW I689406 B TWI689406 B TW I689406B TW 104131878 A TW104131878 A TW 104131878A TW 104131878 A TW104131878 A TW 104131878A TW I689406 B TWI689406 B TW I689406B
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
layer
additive
concentration
Prior art date
Application number
TW104131878A
Other languages
English (en)
Chinese (zh)
Other versions
TW201615389A (zh
Inventor
奧利拉馬韓卓Ｃ
麥克森堤摩西
克利許南卡錫拉曼
巴札拉吉菲
帕逖邦德拉納格Ｂ
瑞特法德丹尼爾
瑞德可佛瑞德Ｃ
敏克葛利格瑞Ｅ
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201615389A publication Critical patent/TW201615389A/zh
Application granted granted Critical
Publication of TWI689406B publication Critical patent/TWI689406B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW104131878A 2014-10-17 2015-09-25 研磨墊及製造其之方法 TWI689406B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462065190P 2014-10-17 2014-10-17
US62/065,190 2014-10-17
US201462066291P 2014-10-20 2014-10-20
US62/066,291 2014-10-20

Publications (2)

Publication Number Publication Date
TW201615389A TW201615389A (zh) 2016-05-01
TWI689406B true TWI689406B (zh) 2020-04-01

Family

ID=55747430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131878A TWI689406B (zh) 2014-10-17 2015-09-25 研磨墊及製造其之方法

Country Status (6)

Country Link
US (2) US10322491B2 (enExample)
JP (1) JP6703985B2 (enExample)
KR (2) KR102426444B1 (enExample)
CN (1) CN107073677B (enExample)
TW (1) TWI689406B (enExample)
WO (1) WO2016061506A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN108698206B (zh) 2016-01-19 2021-04-02 应用材料公司 多孔化学机械抛光垫
US11072053B2 (en) * 2016-01-21 2021-07-27 3M Innovative Properties Company Methods of making metal bond and vitreous bond abrasive articles, and abrasive article precursors
EP3257660A1 (en) * 2016-06-13 2017-12-20 Siemens Aktiengesellschaft Method of providing an abrasive means and of additively manufacturing a component
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR101897659B1 (ko) * 2017-01-16 2018-09-13 원광대학교산학협력단 이중기공 세포지지체 제조시스템 및 제조방법, 그리고 세포지지체
IT201700038586A1 (it) * 2017-04-07 2018-10-07 Aros Srl Metodo per la realizzazione di un utensile.
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11826876B2 (en) * 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
WO2020106526A1 (en) * 2018-11-19 2020-05-28 Applied Materials, Inc. Low viscosity uv-curable formulation for 3d printing
CN109483418B (zh) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11731231B2 (en) * 2019-01-28 2023-08-22 Micron Technology, Inc. Polishing system, polishing pad, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN110076339A (zh) * 2019-03-06 2019-08-02 上海工程技术大学 一种复杂空腔增材制件内外表面的抛光方法
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
JP2022531478A (ja) * 2019-05-07 2022-07-06 シーエムシー マテリアルズ，インコーポレイティド バットベースの生成を介する化学機械平坦化パッド
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN110977801A (zh) * 2019-12-20 2020-04-10 中国科学院长春光学精密机械与物理研究所 一种沥青抛光盘制备装置
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US11738517B2 (en) 2020-06-18 2023-08-29 Applied Materials, Inc. Multi dispense head alignment using image processing
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
EP4408615A4 (en) * 2021-09-29 2025-11-12 Entegris Inc BUFFER CONDITIONER WITH POLYMER SUPPORT PLATE
KR102700222B1 (ko) * 2021-10-12 2024-08-29 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
US20230405765A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Dual-cure resin for preparing chemical mechanical polishing pads
WO2023244740A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Uv-curable resins for chemical mechanical polishing pads
US20250121472A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Polishing articles for hybrid bonding applications
CN120839671A (zh) * 2025-09-22 2025-10-28 华侨大学 一种增材制造铣磨头及其一体化成型的批量制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101124067A (zh) * 2005-02-22 2008-02-13 圣戈本磨料股份有限公司 用来制造研磨制品的快速加工系统和方法
TW200924907A (en) * 2007-09-03 2009-06-16 Semiquest Inc Polishing pad
TW201350265A (zh) * 2012-04-25 2013-12-16 應用材料股份有限公司 印刷式化學機械研磨墊

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919082A (en) * 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP2000061817A (ja) * 1998-08-24 2000-02-29 Nikon Corp 研磨パッド
WO2001091975A1 (en) * 2000-05-31 2001-12-06 Jsr Corporation Abrasive material
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
JP2002067171A (ja) * 2000-08-25 2002-03-05 Canon Inc 目的物生成装置、目的物生成方法、及び記憶媒体
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
GB0103754D0 (en) * 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
JP2004281685A (ja) * 2003-03-14 2004-10-07 Mitsubishi Electric Corp 半導体基板の研磨用パッドおよび半導体基板の研磨方法
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
KR101108024B1 (ko) * 2003-06-03 2012-01-25 넥스플래너 코퍼레이션 화학 기계적 평탄화를 위한 기능적으로 그레이딩된 패드의합성
US7435161B2 (en) 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100640998B1 (ko) 2003-09-19 2006-11-02 엘지.필립스 엘시디 주식회사 액정표시장치용 브라켓 구조
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
WO2006057720A1 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US8075745B2 (en) 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7815778B2 (en) 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR101616535B1 (ko) * 2005-02-18 2016-04-29 넥스플래너 코퍼레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법
JP2006231464A (ja) * 2005-02-24 2006-09-07 Nitta Haas Inc 研磨パッド
US7829000B2 (en) * 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
US8177603B2 (en) 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
US8292692B2 (en) 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
US9162340B2 (en) 2009-12-30 2015-10-20 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
KR20130095430A (ko) * 2012-02-20 2013-08-28 케이피엑스케미칼 주식회사 연마패드 및 그 제조방법
SG11201602207QA (en) 2013-09-25 2016-04-28 3M Innovative Properties Co Multi-layered polishing pads
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101124067A (zh) * 2005-02-22 2008-02-13 圣戈本磨料股份有限公司 用来制造研磨制品的快速加工系统和方法
CN101124067B (zh) 2005-02-22 2011-04-13 圣戈本磨料股份有限公司 快速结构化介质料筒以及固体自由成形制造系统
TW200924907A (en) * 2007-09-03 2009-06-16 Semiquest Inc Polishing pad
TW201350265A (zh) * 2012-04-25 2013-12-16 應用材料股份有限公司 印刷式化學機械研磨墊

Also Published As

Publication number Publication date
US20160107288A1 (en) 2016-04-21
WO2016061506A1 (en) 2016-04-21
CN107073677A (zh) 2017-08-18
CN107073677B (zh) 2020-05-15
US20190299357A1 (en) 2019-10-03
KR102426444B1 (ko) 2022-07-29
KR102638128B1 (ko) 2024-02-20
TW201615389A (zh) 2016-05-01
KR20220110333A (ko) 2022-08-05
US10322491B2 (en) 2019-06-18
JP6703985B2 (ja) 2020-06-03
KR20170070177A (ko) 2017-06-21
JP2017533831A (ja) 2017-11-16

Similar Documents

Publication Publication Date Title
TWI689406B (zh) 研磨墊及製造其之方法
JP7309812B2 (ja) 制御された孔隙率を有する印刷された化学機械研磨パッド
TWI687280B (zh) 具有磨蝕粒於其中的印刷化學機械研磨墊
CN112088069B (zh) 亲水性和z电位可调谐的化学机械抛光垫
JP6898379B2 (ja) 印刷による化学機械研磨パッド