TWI687280B - 具有磨蝕粒於其中的印刷化學機械研磨墊 - Google Patents

具有磨蝕粒於其中的印刷化學機械研磨墊 Download PDF

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TWI687280B
TWI687280B TW108114664A TW108114664A TWI687280B TW I687280 B TWI687280 B TW I687280B TW 108114664 A TW108114664 A TW 108114664A TW 108114664 A TW108114664 A TW 108114664A TW I687280 B TWI687280 B TW I687280B
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卡錫拉曼 克利許南
納格Ｂ 帕逖邦德拉
皮瑞亞 高帕藍
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美商應用材料股份有限公司
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Abstract

一種製造研磨墊的研磨層的方法包括決定欲被內嵌在該研磨層的聚合物母體內的顆粒的期望分佈。利用3D列印機而依次地沉積該聚合物母體的複數個層，該聚合物母體的該複數個層的各個層是藉由從噴嘴噴出聚合物母體前驅物來沉積。該等顆粒的該複數個層是根據該期望分佈而利用該3D列印機來沉積。該聚合物母體前驅物被固化成具有以該期望分佈而內嵌的顆粒的聚合物母體。

Description

具有磨蝕粒於其中的印刷化學機械研磨墊
本發明關於用在化學機械研磨的研磨墊。
通常藉由將導體、半導體、或絕緣層相繼沉積在矽晶圓上以將積體電路形成在基材上。各種製造過程需要基材上的層的平坦化。例如，對於特定應用（例如金屬層的研磨以在經圖案化的層的溝渠中形成介層洞、插塞與線），覆蓋層被平坦化直到經圖案化的層的頂表面被暴露為止。在其他應用（例如介電層的平坦化以為了進行光微影）中，覆蓋層被研磨直到期望的厚度維持在下置層的上方。
化學機械研磨（CMP）是一種可令人接受的平坦化的方法。此平坦化方法通常需要使基材裝設在載具頭上。基材的暴露表面通常被放置成抵靠旋轉的研磨墊。載具頭提供可控制的負載在基材上，以將基材推擠抵靠研磨墊。研磨液（諸如具有磨蝕顆粒的漿料）通常被供應到研磨墊的表面。
化學機械研磨製程的一目標是研磨均勻性。若基材上不同的區域以不同的速率來研磨，則基材的一些區域具有太多材料被移除（過度研磨（overpolishing））或太少材料被移除（不足研磨（underpolishing））是有可能的。
傳統的研磨墊包括「標準」的墊與固定磨蝕粒的墊。標準的墊具有聚氨基甲酸酯（polyurethane）研磨層且亦可包括一可壓縮的背托層，該聚氨基甲酸酯研磨層具有耐久的粗糙化表面。相對地，固定磨蝕粒的墊具有被固持在內含媒介中的磨蝕顆粒且可被支撐在大致上不可壓縮的背托層上。然而，商業上可取得之固定磨蝕粒的墊通常被限制在特定材料，例如氧化鈰。
通常藉由將聚氨基甲酸酯材料予以模鑄、澆鑄、或燒結來製作研磨墊。在模鑄的情況中，可（例如藉由射出模鑄）一次製造一個研磨墊。在澆鑄的情況中，液體前驅物被澆鑄且被硬化成餅，接著餅被切割成個別的墊片。該等墊片可接著被機械加工至最終的厚度。可藉由機械加工將溝槽形成在研磨表面內或形成為射出模鑄過程的一部分。
除了平坦化，研磨墊可用在擦光操作（finishing operations），例如研光（buffing）。
化學機械研磨設備的末端使用者通常從一或更多個販售者獲得耗材（諸如研磨墊與研磨漿料）。研磨漿料通常含有位在流體中的磨蝕顆粒的懸浮液。流體通常包括額外的化學作用以確保磨蝕顆粒適當地被懸置在流體中且不會形成不令人樂見的磨蝕顆粒的結塊，其中結塊會造成刮傷或其他缺陷且使得研磨漿料不適合用在研磨。
為了降低末端使用者的擁有成本（cost of ownership）且為了減少廢棄物處理，可藉由將磨蝕顆粒內嵌在墊本身內而將研磨墊與磨蝕顆粒結合成單一整體。然而，將顆粒內嵌到墊內會引起各種問題。因此，內嵌在研磨墊中的磨蝕材料已經被限制在諸如氧化鈰的材料。儘管已經提出可使用氧化鋁磨蝕顆粒，具有氧化鋁顆粒的研磨墊卻無法實踐而商業化。在製造具有氧化鋁磨蝕顆粒的研磨墊時的至少一問題是將氧化鋁磨蝕顆粒懸置在用以製造研磨墊的聚合物（例如熱固型聚合物）中的困難。例如，氧化鋁磨蝕顆粒在聚合物溶液中的懸置不會均勻地被分佈。此非均勻分佈會導致氧化鋁磨蝕顆粒的結塊，並且結塊會在研磨墊用在研磨基材時導致缺陷。
一種製造具有不同磨蝕顆粒內嵌在其中的研磨墊的技術是使用3D列印製程。在3D列印製程中，一薄的墊前驅物（例如粉末或液體前驅物）層逐漸地被沉積且被熔合，或被硬化，以形成完全三維的研磨墊。接著，磨蝕顆粒選擇性地被沉積在經列印的墊前驅物層內。
在一態樣中，一種製造研磨墊的研磨層的方法包括決定欲被內嵌在該研磨層的聚合物母體內的顆粒的期望分佈。該方法包括利用3D列印機而依次地沉積該聚合物母體的複數個層，該聚合物母體的該複數個層的各個層是藉由從噴嘴噴出聚合物母體前驅物來沉積，其中依次地沉積該複數個層的步驟包括根據該期望分佈而利用該3D列印機分佈該等顆粒於該複數個層中。該方法包括固化該聚合物母體前驅物以形成固化的聚合物母體，該固化的聚合物母體具有以該期望分佈而內嵌的顆粒。
實施方式可包括下述特徵的一或更多者。該方法可更包括根據該期望分佈而預混合該聚合物母體前驅物與該等顆粒，以形成由該噴嘴噴出的一混合物。該聚合物母體前驅物可以是液體熱固型聚合物。該聚合物母體前驅物可以是熔融熱塑型聚合物。該聚合物母體前驅物可以從第一列印頭的噴嘴被噴出，並且該等顆粒可以從第二列印頭的噴嘴被噴出。該等顆粒可以由選自由氧化矽、陶瓷、金屬、金屬氧化物、與聚合物所構成的群組的材料形成。氧化矽可經煙薰或膠狀的。該等顆粒可以是氧化鋁。該等顆粒可以是磨蝕顆粒。該等顆粒可以更包括在該研磨層用於研磨時會經歷化學反應的反應性顆粒。該等顆粒可以具有一中空核心。該等顆粒可以具有高達1 mm的尺寸，例如小於10 µm，例如小於1 µm。該等顆粒可以是圓的、長形的、或多面的。該研磨層可包括由該等顆粒的中空核心所形成的孔洞。固化該聚合物母體前驅物的步驟可包括硬化該聚合物母體前驅物。硬化該聚合物母體前驅物的步驟可包括紫外線（UV）硬化。硬化該聚合物母體前驅物的步驟可包括熱硬化。可利用雷射或IR燈來完成該熱硬化。該聚合物母體前驅物可包括聚氨基甲酸酯單體。該固化的聚合物母體可包括聚氨基甲酸酯、丙烯酸酯、環氧樹脂、丙烯腈-丁二烯-苯乙烯（ABS）、聚醚醯亞胺、或聚醯胺樹脂。固化該聚合物母體前驅物的步驟包括冷卻該聚合物母體前驅物。該期望分佈可以是該等顆粒在聚合物母體內的均勻分佈。該期望分佈可以是該等顆粒在該聚合物母體內的圖案化分佈。該聚合物母體前驅物與該等顆粒可以被沉積以在該研磨墊的表面上產生多個圖案化表面特徵。該圖案化表面特徵可包括長形溝槽。該圖案化表面特徵可包括類似鈕釦的升高特徵。
在另一態樣中，一種研磨墊包括研磨層，該研磨層具有聚合物母體及內嵌在該聚合物母體內的顆粒的期望分佈。該等顆粒的期望分佈包括該等顆粒在該研磨層中不同的分佈密度。
實施方式可包括下述特徵的一或更多者。該研磨墊可包括位在該研磨墊的表面上的長形溝槽。該等顆粒可具有高達1 mm的尺寸，例如小於10 µm，例如小於1 µm。該等顆粒可以是圓的、長形的、或多面的。該聚合物母體可包括聚氨基甲酸酯、丙烯酸酯、環氧樹脂、丙烯腈-丁二烯-苯乙烯（ABS）、聚醚醯亞胺、或聚醯胺樹脂。
在另一態樣中，一種製造研磨墊的研磨層的方法包括預混合聚合物母體前驅物與多個顆粒以形成一混合物。該聚合物母體前驅物用以製造該研磨層的聚合物母體。該方法包括在將該混合物從3D列印機的噴嘴噴出前，攪拌該混合物；及利用該3D列印機而依次地沉積該聚合物母體的複數個層。該聚合物母體的該複數個層的各個層是藉由從該噴嘴噴出該聚合物母體前驅物來沉積。依次地沉積該複數個層的步驟包括利用該3D列印機沉積該等顆粒於該複數個層中。該方法包括固化該聚合物母體前驅物以形成固化的聚合物母體，該固化的聚合物母體具有內嵌在其中的該等顆粒。
本發明的一或更多個實施例的細節揭示在隨附的圖式與以下的說明中。從說明與圖式且從申請專利範圍可瞭解本發明的其他特徵、目的、與優點。
參照第1A圖至第1C圖，研磨墊18包括研磨層22。如第1A圖所示，研磨墊可以是由研磨層22構成的單層墊，或如第1C圖所示，研磨墊可以是包括研磨層22與至少一背托層20的多層墊。
研磨層22可以是被插入到研磨製程中的材料。研磨層22的材料可以是塑膠，例如聚氨基甲酸酯、丙烯酸酯、環氧樹脂、丙烯腈-丁二烯-苯乙烯（ABS）、聚醚醯亞胺、或聚醯胺樹脂。在一些實施方式中，研磨層22是相當耐久且硬的材料。例如，研磨層22可具有約40至80（例如50至65）的Shore D度量的硬度。
如第1A圖所示，研磨層22可以是均質組成的層，或如第1B圖所示，研磨層22可包括被固持在塑膠材料（例如聚氨基甲酸酯、丙烯酸酯、環氧樹脂、丙烯腈-丁二烯-苯乙烯（ABS）、聚醚醯亞胺、或聚醯胺樹脂）的母體29中的磨蝕顆粒28。磨蝕顆粒28比母體29的材料更硬。磨蝕顆粒28可佔據研磨層的0.05 wt%至75 wt%。例如，磨蝕顆粒28可以是研磨層22的小於1 wt%，例如小於0.1 wt%。或者，磨蝕顆粒28可以是研磨層22的大於10 wt%，例如大於50 wt%。磨蝕顆粒的材料可以是金屬氧化物（諸如氧化鈰、氧化鋁、氧化矽、或它們的組合）、聚合物、介金屬、或陶瓷。
在一些實施方式中，研磨層包括孔洞（例如小孔隙）。孔洞的寬度可以是50~100微米。
研磨層22可具有80 mils或更小（例如50 mils或更小，例如25 mils或更小）的厚度D1。由於調節製程傾向於磨除覆蓋層，研磨層22的厚度可經選擇以提供研磨墊18有用的壽命，例如3000次研磨與調節循環。
在微觀尺度上，研磨層22的研磨表面24可具有粗糙的表面紋理，例如2~4微米rms。例如，研磨層22可經受磨碾或調節製程以產生此粗糙的表面紋理。此外，3D列印可提供小的均勻特徵結構，例如下達200微米。
儘管研磨表面24可以在微觀尺度上是粗糙的，研磨層22可在研磨墊本身的巨觀尺度上具有良好的厚度均勻性（此均勻性是指研磨表面24相對於研磨層的底表面之總體高度變化，且沒有計算任何故意形成在研磨層中的巨觀溝槽或穿孔）。例如，厚度非均勻性可以小於1 mil。
可選地，研磨表面24的至少一部分可包括形成在其中以為了攜載漿料的複數個溝槽26。溝槽26可近似任何圖案，諸如同心圓、直線、交叉陰影線、螺旋形與諸如此類者。假設溝槽存在，則研磨表面24（亦即溝槽26之間的高臺）可佔據研磨墊18的總水平表面積的約25~90%。因此，溝槽26可佔據研磨墊18的總水平表面積的約10~75%。溝槽26之間的高臺可具有約0.1至2.5 mm的橫向寬度。
在一些實施方式中（例如若存在有背托層20），溝槽26可完全延伸穿過研磨層22。在一些實施方式中，溝槽26可延伸穿過研磨層22的厚度的約20~80%（例如40%）。溝槽26的深度可以是0.25至1 mm。例如，在研磨墊18具有50 mils厚的研磨層22的情況中，溝槽26可具有約20 mils的深度D2。
背托層20可比研磨層22更柔軟且更可壓縮。背托層20可具有80或更小的Shore A度量的硬度，例如約60的Shore A度量的硬度。背托層20可比研磨層22更厚或更薄或可具有和研磨層22相同的厚度。
例如，背托層可以是開放室或密閉室的泡棉（諸如具有孔隙的聚氨基甲酸酯或聚矽氧烷），以致在處於壓力下時，室會崩潰且背托層會壓縮。適合用作為背托層的材料是可從美國康乃迪克州之Rogers城市的Rogers Corporation獲得的PORON 4701-30，或是可從Rohm & Haas獲得的SUBA-IV。可藉由選擇層材料與孔隙度來調整背托層的硬度。背托層亦可由天然橡膠、乙烯丙烯二烯單體橡膠（EPDM rubber）、腈橡膠或聚氯丁二烯（氯丁橡膠）形成。或者，背托層20可由和研磨層相同的前驅物所形成且具有和研磨層相同的孔隙度，但具有不同的硬化程度以致具有不同的硬度。
現參照第2圖，一或更多個基材14可在CMP設備的研磨站10處被研磨。適當的研磨設備的描述可見於美國專利案第5,738,574號中，該美國專利案之整個內容以引用之方式被併入到此。
研磨站10可包括可旋轉的平台16，研磨墊18被放置在可旋轉的平台16上。在研磨步驟期間，可藉由漿料供應埠或結合的漿料/潤濕臂32將研磨液30（例如磨蝕漿料）供應到研磨墊18的表面。研磨液30可含有磨蝕顆粒、PH調整劑、或化學活性成份。
基材14藉由載具頭34被固持成抵靠研磨墊18。載具頭34從支撐結構（諸如轉盤）懸置，並且藉由載具驅動桿36連接到載具頭旋轉馬達，以致載具頭可繞著軸38旋轉。研磨墊18與基材14的相對運動在研磨液30存在時會造成基材14的研磨。
3D列印提供用以製造具有磨蝕粒內嵌在研磨層內特定位置中的研磨墊之方便且高度可控制的製程。參照第3A圖，至少研磨墊18的研磨層22是使用3D列印製程來製造。在此製造過程中，薄材料層逐漸地被沉積且被熔合。例如，墊前驅物材料的液滴52可從液滴噴射列印機55的噴嘴54被噴出，以形成層50。液滴噴射列印機類似噴墨印表機，但使用墊前驅物材料而非使用墨水。噴嘴54平移（如箭頭A所示）越過支撐件51。
對於沉積的第一層50a，噴嘴54可噴出到支撐件51上。對於依序沉積的層50b，噴嘴54可噴出到已經固化的材料56上。在各層50被固化後，一新的層接著被沉積在先前沉積的層上方，直到已經製造了完全三維的研磨層22。各層是藉由噴嘴54以被儲存在於電腦60上執行的3D繪圖電腦程式中的圖案來施加。各層50小於研磨層22的總厚度的50%，例如小於10%，例如小於5%，例如小於1%。
支撐件51可以是一堅硬的基底或一可撓的膜（例如聚四氟乙烯（PTFE）層）。若支撐件51是膜，則支撐件51可形成研磨墊18的一部分。例如，支撐件51可以是背托層20或介於背托層20和研磨層22之間的層。或者，可將研磨層22從支撐件51移除。
大致上，在研磨層22一層接著一層被列印的同時，磨蝕顆粒23局部地被分配到研磨層內。磨蝕顆粒的局部分配有助於避免結塊。
特別地，磨蝕顆粒23可與液體熱固型聚合物前驅物預混合。熱固型聚合物前驅物與磨蝕顆粒的混合物的持續攪拌可避免顆粒的結塊，類似用以將用在噴墨印表機的墨水顏料予以均質化的設備。此外，混合物的持續攪拌確保非常均勻的磨蝕顆粒在前驅物中的分佈。此可造成更均勻的顆粒在研磨層中的分佈，此會導致改善的研磨均勻性且亦有助於避免結塊。
預混合的混合物從單一噴嘴（例如噴嘴54）根據特定圖案被分配。例如，預混合的混合物可均勻地被分配，以產生均質的研磨層22，該均質的研磨層22具有均勻的內嵌磨蝕顆粒在研磨層22中的分佈。
或者，具有噴嘴58的分離的列印頭57（如第3B圖所示）可用以分配純液體熱固型聚合物前驅物（亦即不含有任何磨蝕顆粒），而預混合的混合物僅被分配在經選擇的位置處。該等經選擇的位置共同地形成期望的磨蝕顆粒的列印圖案，且可被儲存成CAD相容的檔案並接著被控制列印機的電子控制器（例如電腦60）讀取。電子控制訊號接著被送到列印機55，以僅在噴嘴54平移到CAD相容的檔案所指定的位置時，分配預混合的混合物。
或者，不使用液體熱固型聚合物前驅物，磨蝕顆粒可與熔融熱塑型塑料預混合。在此情況中，含有磨蝕顆粒的混合物亦在被分配前持續地被攪拌。在混合物從3D列印機根據期望的列印圖案被分配後，混合物的熔融部分會冷卻與固化，並且磨蝕顆粒被固定住。混合物的持續攪拌確保非常均勻的磨蝕顆粒在前驅物中的分佈。此可造成更均勻的顆粒在研磨層中的分佈，此會導致改善的研磨均勻性且亦有助於避免結塊。
類似在使用液體熱固型聚合物前驅物時的情況，熱塑型塑料混合物可均勻地被分配，以產生均勻的磨蝕顆粒在整個研磨層22中的分佈。或者，根據被儲存成CAD相容檔案的且被用以驅動列印機55的電子控制器讀取的磨蝕顆粒的期望列印圖案，含有磨蝕顆粒的熱塑型塑料混合物可僅被分配到研磨層中的經選擇的位置處。
不將磨蝕顆粒以懸浮方式從噴嘴54分配，可直接地以粉末形式將磨蝕顆粒從噴嘴54分配，同時一不同的列印頭57用以分配墊聚合物前驅物。聚合物前驅物在將磨蝕顆粒分配到沉積的聚合物材料內之前先被分配，並且混合物接著被硬化。
儘管3D列印對於建構使用易於結塊的磨蝕顆粒(例如氧化鋁)的研磨墊是特別有用的，此方法可被用在其他研磨顆粒。因此，磨蝕顆粒可包括氧化矽、陶瓷氧化物、金屬與硬聚合物。
列印頭可列印實心的顆粒或具有中空核心的顆粒。列印頭亦可分配不同類型顆粒，一些類型可在CMP處理期間經歷化學反應以產生期望的被研磨的基材的層上的改變。用在研磨墊的CMP處理的化學反應的實例包括10~14的鹼性pH範圍內發生的化學過程，該化學過程涉及氫氧化鉀、氫氧化銨、與漿料製造使用的其他專有化學過程的一或更多者。在涉及有機酸（諸如醋酸、檸檬酸）的2~5的酸性pH範圍內發生的化學過程亦被用在CMP處理中。涉及過氧化氫的氧化反應也是用在CMP處理中的化學反應的實例。磨蝕顆粒亦可僅被用來提供機械磨蝕功用。顆粒可具有高達1 mm（例如小於10 µm，例如小於1 µm）的尺寸，並且顆粒可具有不同的形態（例如顆粒可以是圓的、長形的、或多面的）。
研磨墊內的孔洞已經傳統上用來將漿料局部地保持在研磨墊內。由於母體將磨蝕顆粒固持住，研磨墊不再需要含有孔洞。藉由沉積中空球體於期望有孔洞的位置處，孔洞仍可選擇性地被分佈在被列印的研磨墊內。
固化可伴隨有聚合。例如，墊前驅物材料的層50可以是單體，並且單體可原位地藉由紫外線（UV）硬化來聚合。墊前驅物材料可在沉積時立即有效地被硬化，或整個墊前驅物材料的層50可被沉積且接著整個層50同時地被硬化。
然而，有替代的技術來達到3D列印。替代地，列印機藉由散佈一包括磨蝕顆粒23作為添加劑的粉末層並噴出黏結材料的液滴到粉末層上來產生研磨層22。
由於一層接著一層的列印方式，3D列印方法可允許欲達到的內嵌在研磨層中的磨蝕顆粒的分佈之緊密容限。又，一列印系統（具有列印機55與電腦60）可僅藉由改變被儲存在3D繪圖電腦程式中的圖案用以製造各種不同的研磨墊。
在一些實施方式中，背托層20亦可藉由3D列印過程來製造。例如，可藉由列印機55以不中斷的操作來製造背托層20與研磨層22。可藉由使用不同量的硬化（例如不同的UV輻射強度）來提供具有和研磨層22不同硬度的背托層20。
在其他實施方式中，背托層20是藉由傳統過程來製造且接著被固定到研磨層22。例如，可藉由薄黏附層28（例如作為壓力敏感黏附劑）將研磨層22固定到背托層20。
已經描述了許多實施方式。然而，可瞭解的是可進行各種修改。例如，研磨墊或載具頭或此兩者可移動以提供研磨表面與基材之間的相對運動。研磨墊可具有圓形或一些其他形狀。黏附層可被施加到研磨墊的底表面以將墊固定到平台，並且可在研磨墊被放置在平台上之前藉由一可移除的內襯來覆蓋黏附層。此外，儘管使用了垂直定位的用語，應當瞭解的是研磨表面與基材可在垂直方位或一些其他方位中被固持成上下顛倒。
因此，其他實施方式落入隨附的申請專利範圍的範疇內。
10‧‧‧研磨站14‧‧‧基材16‧‧‧平台18‧‧‧研磨墊20‧‧‧背托層22‧‧‧研磨層24‧‧‧研磨表面26‧‧‧溝槽28‧‧‧磨蝕顆粒29‧‧‧母體30‧‧‧研磨液32‧‧‧漿料/潤濕臂34‧‧‧載具頭36‧‧‧載具驅動桿38‧‧‧軸50‧‧‧層50a‧‧‧層50b‧‧‧層51‧‧‧支撐件52‧‧‧液滴54‧‧‧噴嘴55‧‧‧液滴噴射列印機56‧‧‧固化的材料57‧‧‧列印頭58‧‧‧噴嘴60‧‧‧電腦
第1A圖是一示範性研磨墊的示意截面側視圖。
第1B圖是另一示範性研磨墊的示意截面側視圖。
第1C圖是又另一示範性研磨墊的示意截面側視圖。
第2圖是一化學機械研磨站的示意側視(部分截面)圖。
第3A圖示出用以製造研磨墊的一示範性3D列印機的示意截面側視圖。
第3B圖示出用以製造研磨墊的一示範性3D列印機的示意截面側視圖。
在各種圖式中相同的元件符號代表相同的元件。
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無
50‧‧‧層
50a‧‧‧層
50b‧‧‧層
51‧‧‧支撐件
52‧‧‧液滴
54‧‧‧噴嘴
55‧‧‧液滴噴射列印機
56‧‧‧固化的材料
60‧‧‧電腦

Claims (10)

  1. 一種研磨墊，包括： 一研磨層，適用於在積體電路製造期間化學機械研磨一基板，該研磨層具有一聚合物母體與一內嵌在該聚合物母體內的中空聚合物顆粒的一期望分佈，其中該等中空聚合物顆粒的該期望分佈包含該等顆粒橫跨該研磨層不同的分佈密度。
  2. 如請求項1所述之研磨墊，其中該等中空聚合物顆粒具有高達1 mm的尺寸。
  3. 如請求項2所述之研磨墊，其中該等中空聚合物顆粒具有小於10微米的尺寸。
  4. 如請求項3所述之研磨墊，其中該等中空聚合物顆粒具有小於1微米的尺寸。
  5. 如請求項1所述之研磨墊，其中該聚合物母體包含聚氨基甲酸酯、丙烯酸酯、環氧樹脂、丙烯腈-丁二烯-苯乙烯(ABS)、聚醚醯亞胺、或聚醯胺樹脂。
  6. 如請求項1所述之研磨墊，其中該等顆粒的該不同的分佈密度在該研磨層中形成一圖案。
  7. 如請求項1所述之研磨墊，進一步包含在該研磨墊的一表面上的多個表面特徵。
  8. 如請求項5所述之研磨墊，其中該等表面特徵包含多個溝槽。
  9. 如請求項5所述之研磨墊，其中該等表面特徵包含多個升高的鈕扣。
  10. 如請求項1所述之研磨墊，進一步包含一背托層，該背托層比該研磨層更可壓縮。
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