JP2017520422A5 - - Google Patents

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Publication number
JP2017520422A5
JP2017520422A5 JP2017519211A JP2017519211A JP2017520422A5 JP 2017520422 A5 JP2017520422 A5 JP 2017520422A5 JP 2017519211 A JP2017519211 A JP 2017519211A JP 2017519211 A JP2017519211 A JP 2017519211A JP 2017520422 A5 JP2017520422 A5 JP 2017520422A5
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JP
Japan
Prior art keywords
porogens
polishing
polishing pad
polymer matrix
liquid filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017519211A
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English (en)
Japanese (ja)
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JP6810992B2 (ja
JP2017520422A (ja
Filing date
Publication date
Priority claimed from US14/307,846 external-priority patent/US9238294B2/en
Application filed filed Critical
Publication of JP2017520422A publication Critical patent/JP2017520422A/ja
Publication of JP2017520422A5 publication Critical patent/JP2017520422A5/ja
Application granted granted Critical
Publication of JP6810992B2 publication Critical patent/JP6810992B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017519211A 2014-06-18 2015-06-12 液状充填材を含むポロゲンを有する研磨パッド Active JP6810992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/307,846 2014-06-18
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019211478A Division JP2020055103A (ja) 2014-06-18 2019-11-22 液状充填材を含むポロゲンを有する研磨パッド

Publications (3)

Publication Number Publication Date
JP2017520422A JP2017520422A (ja) 2017-07-27
JP2017520422A5 true JP2017520422A5 (enExample) 2018-07-05
JP6810992B2 JP6810992B2 (ja) 2021-01-13

Family

ID=53487453

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017519211A Active JP6810992B2 (ja) 2014-06-18 2015-06-12 液状充填材を含むポロゲンを有する研磨パッド
JP2019211478A Withdrawn JP2020055103A (ja) 2014-06-18 2019-11-22 液状充填材を含むポロゲンを有する研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019211478A Withdrawn JP2020055103A (ja) 2014-06-18 2019-11-22 液状充填材を含むポロゲンを有する研磨パッド

Country Status (8)

Country Link
US (1) US9238294B2 (enExample)
EP (1) EP3157710B1 (enExample)
JP (2) JP6810992B2 (enExample)
KR (1) KR102391135B1 (enExample)
CN (2) CN106470799A (enExample)
SG (1) SG11201610140TA (enExample)
TW (1) TWI599448B (enExample)
WO (1) WO2015195488A1 (enExample)

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US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
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US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
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DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
WO2022140345A1 (en) * 2020-12-22 2022-06-30 Cmc Materials, Inc. Chemical-mechanical polishing subpad having porogens with polymeric shells
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
JP2024534220A (ja) * 2021-09-02 2024-09-18 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー ポリマー粒子を含むテクスチャ加工ｃｍｐパッド
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
US12447581B2 (en) * 2022-07-11 2025-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫

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