CN113276016A - 具有带有液体填充物的致孔剂的抛光垫 - Google Patents

具有带有液体填充物的致孔剂的抛光垫 Download PDF

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Publication number
CN113276016A
CN113276016A CN202110193495.4A CN202110193495A CN113276016A CN 113276016 A CN113276016 A CN 113276016A CN 202110193495 A CN202110193495 A CN 202110193495A CN 113276016 A CN113276016 A CN 113276016A
Authority
CN
China
Prior art keywords
porogens
polishing pad
polishing
liquid
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110193495.4A
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English (en)
Chinese (zh)
Inventor
P.A.勒费夫尔
W.C.阿利森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of CN113276016A publication Critical patent/CN113276016A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202110193495.4A 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫 Pending CN113276016A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
US14/307,846 2014-06-18
CN201580032943.5A CN106470799A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580032943.5A Division CN106470799A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Publications (1)

Publication Number Publication Date
CN113276016A true CN113276016A (zh) 2021-08-20

Family

ID=53487453

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110193495.4A Pending CN113276016A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫
CN201580032943.5A Pending CN106470799A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580032943.5A Pending CN106470799A (zh) 2014-06-18 2015-06-12 具有带有液体填充物的致孔剂的抛光垫

Country Status (8)

Country Link
US (1) US9238294B2 (enExample)
EP (1) EP3157710B1 (enExample)
JP (2) JP6810992B2 (enExample)
KR (1) KR102391135B1 (enExample)
CN (2) CN113276016A (enExample)
SG (1) SG11201610140TA (enExample)
TW (1) TWI599448B (enExample)
WO (1) WO2015195488A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115816304A (zh) * 2021-09-17 2023-03-21 Skc索密思株式会社 抛光垫的翻新方法、半导体元件的制造方法及制造装置

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JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US11964920B2 (en) 2016-08-19 2024-04-23 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
EP4267342A4 (en) * 2020-12-22 2024-10-30 CMC Materials LLC Chemical-mechanical polishing subpad having porogens with polymeric shells
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
US12447581B2 (en) * 2022-07-11 2025-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫

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CN104209874A (zh) * 2013-05-31 2014-12-17 罗门哈斯电子材料Cmp控股股份有限公司 具有柔软且可修整的抛光层的多层化学机械抛光垫层叠体

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TW440495B (en) * 1999-04-13 2001-06-16 Freudenberg Nonwovens Ltd Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US20040053007A1 (en) * 2002-09-17 2004-03-18 Hyun Huh Polishing pad containing embedded liquid microelements and method of manufacturing the same
CN101495272A (zh) * 2006-07-24 2009-07-29 Skc株式会社 包含封装在聚合物外壳中的液体有机材料芯体的化学机械抛光垫及其制造方法
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CN104209874A (zh) * 2013-05-31 2014-12-17 罗门哈斯电子材料Cmp控股股份有限公司 具有柔软且可修整的抛光层的多层化学机械抛光垫层叠体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115816304A (zh) * 2021-09-17 2023-03-21 Skc索密思株式会社 抛光垫的翻新方法、半导体元件的制造方法及制造装置

Also Published As

Publication number Publication date
US9238294B2 (en) 2016-01-19
SG11201610140TA (en) 2017-01-27
KR102391135B1 (ko) 2022-04-28
JP2020055103A (ja) 2020-04-09
US20150367478A1 (en) 2015-12-24
JP2017520422A (ja) 2017-07-27
JP6810992B2 (ja) 2021-01-13
CN106470799A (zh) 2017-03-01
TW201609315A (zh) 2016-03-16
TWI599448B (zh) 2017-09-21
EP3157710A1 (en) 2017-04-26
KR20170020446A (ko) 2017-02-22
EP3157710B1 (en) 2021-11-10
WO2015195488A1 (en) 2015-12-23

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SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Illinois, America

Applicant after: CMC Materials Co.,Ltd.

Address before: Illinois, America

Applicant before: Cabot Microelectronics Corp.

CB02 Change of applicant information
CB02 Change of applicant information

Address after: Illinois, America

Applicant after: CMC Materials Co.,Ltd.

Address before: Illinois, America

Applicant before: CMC Materials Co.,Ltd.

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RJ01 Rejection of invention patent application after publication

Application publication date: 20210820

RJ01 Rejection of invention patent application after publication