KR102391135B1 - 액체 충전제를 갖는 포로겐을 갖는 연마 패드 - Google Patents

액체 충전제를 갖는 포로겐을 갖는 연마 패드 Download PDF

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KR102391135B1
KR102391135B1 KR1020177001076A KR20177001076A KR102391135B1 KR 102391135 B1 KR102391135 B1 KR 102391135B1 KR 1020177001076 A KR1020177001076 A KR 1020177001076A KR 20177001076 A KR20177001076 A KR 20177001076A KR 102391135 B1 KR102391135 B1 KR 102391135B1
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South Korea
Prior art keywords
porogens
polishing pad
polishing
abandoned
registration fee
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KR1020177001076A
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Korean (ko)
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KR20170020446A (ko
Inventor
폴 안드레 레페브레
윌리엄 씨. 앨리슨
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씨엠씨 머티리얼즈, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177001076A 2014-06-18 2015-06-12 액체 충전제를 갖는 포로겐을 갖는 연마 패드 Active KR102391135B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
US14/307,846 2014-06-18
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Publications (2)

Publication Number Publication Date
KR20170020446A KR20170020446A (ko) 2017-02-22
KR102391135B1 true KR102391135B1 (ko) 2022-04-28

Family

ID=53487453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177001076A Active KR102391135B1 (ko) 2014-06-18 2015-06-12 액체 충전제를 갖는 포로겐을 갖는 연마 패드

Country Status (8)

Country Link
US (1) US9238294B2 (enExample)
EP (1) EP3157710B1 (enExample)
JP (2) JP6810992B2 (enExample)
KR (1) KR102391135B1 (enExample)
CN (2) CN113276016A (enExample)
SG (1) SG11201610140TA (enExample)
TW (1) TWI599448B (enExample)
WO (1) WO2015195488A1 (enExample)

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JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US11964920B2 (en) 2016-08-19 2024-04-23 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
EP4267342A4 (en) * 2020-12-22 2024-10-30 CMC Materials LLC Chemical-mechanical polishing subpad having porogens with polymeric shells
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
US12447581B2 (en) * 2022-07-11 2025-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫

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JP2013089767A (ja) 2011-10-18 2013-05-13 Fujibo Holdings Inc 研磨パッド及びその製造方法
JP2013539233A (ja) 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド

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JP2013539233A (ja) 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド
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JP2013539927A (ja) 2010-10-15 2013-10-28 ネクスプラナー コーポレイション 気孔直径の多峰性分布をもつ研磨パッド
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Also Published As

Publication number Publication date
US9238294B2 (en) 2016-01-19
SG11201610140TA (en) 2017-01-27
CN113276016A (zh) 2021-08-20
JP2020055103A (ja) 2020-04-09
US20150367478A1 (en) 2015-12-24
JP2017520422A (ja) 2017-07-27
JP6810992B2 (ja) 2021-01-13
CN106470799A (zh) 2017-03-01
TW201609315A (zh) 2016-03-16
TWI599448B (zh) 2017-09-21
EP3157710A1 (en) 2017-04-26
KR20170020446A (ko) 2017-02-22
EP3157710B1 (en) 2021-11-10
WO2015195488A1 (en) 2015-12-23

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