TWI599448B - 具有液態填料之致孔劑之拋光墊 - Google Patents
具有液態填料之致孔劑之拋光墊 Download PDFInfo
- Publication number
- TWI599448B TWI599448B TW104119621A TW104119621A TWI599448B TW I599448 B TWI599448 B TW I599448B TW 104119621 A TW104119621 A TW 104119621A TW 104119621 A TW104119621 A TW 104119621A TW I599448 B TWI599448 B TW I599448B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- polishing
- porogens
- polymer matrix
- pad
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 358
- 239000003361 porogen Substances 0.000 title claims description 191
- 239000007788 liquid Substances 0.000 title claims description 113
- 239000000945 filler Substances 0.000 title claims description 68
- 239000000463 material Substances 0.000 claims description 50
- 239000011159 matrix material Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 39
- 229920000642 polymer Polymers 0.000 claims description 39
- 239000000203 mixture Substances 0.000 claims description 34
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- 238000009826 distribution Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 30
- 229920002635 polyurethane Polymers 0.000 claims description 25
- 239000004814 polyurethane Substances 0.000 claims description 25
- 239000002002 slurry Substances 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 9
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical group CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- -1 aromatic diamine compound Chemical class 0.000 claims description 6
- 230000003750 conditioning effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 150000002430 hydrocarbons Chemical group 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 claims description 4
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001400 block copolymer Polymers 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 239000001273 butane Substances 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims description 2
- 239000001282 iso-butane Substances 0.000 claims description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 claims description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims 2
- 239000005033 polyvinylidene chloride Substances 0.000 claims 2
- 229920000307 polymer substrate Polymers 0.000 claims 1
- 238000009827 uniform distribution Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 230000002902 bimodal effect Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000001000 micrograph Methods 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 2
- 229910001632 barium fluoride Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000002195 soluble material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004984 aromatic diamines Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/307,846 US9238294B2 (en) | 2014-06-18 | 2014-06-18 | Polishing pad having porogens with liquid filler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201609315A TW201609315A (zh) | 2016-03-16 |
| TWI599448B true TWI599448B (zh) | 2017-09-21 |
Family
ID=53487453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104119621A TWI599448B (zh) | 2014-06-18 | 2015-06-17 | 具有液態填料之致孔劑之拋光墊 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9238294B2 (enExample) |
| EP (1) | EP3157710B1 (enExample) |
| JP (2) | JP6810992B2 (enExample) |
| KR (1) | KR102391135B1 (enExample) |
| CN (2) | CN113276016A (enExample) |
| SG (1) | SG11201610140TA (enExample) |
| TW (1) | TWI599448B (enExample) |
| WO (1) | WO2015195488A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015185815A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社東芝 | 研磨パッド、研磨方法、及び半導体装置の製造方法 |
| JP2016087770A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社東芝 | 研磨布および研磨方法 |
| US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
| US10722999B2 (en) * | 2016-06-17 | 2020-07-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads and methods of making |
| US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
| US11964920B2 (en) | 2016-08-19 | 2024-04-23 | University Of Massachusetts | Nanoporous structures and assemblies incorporating the same |
| US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
| KR102059647B1 (ko) * | 2018-06-21 | 2019-12-26 | 에스케이씨 주식회사 | 슬러리 유동성이 향상된 연마패드 및 이의 제조방법 |
| DE102018121626A1 (de) * | 2018-09-05 | 2020-03-05 | Rud. Starcke Gmbh & Co. Kg | Poliervorrichtung |
| CN114589620B (zh) * | 2020-12-03 | 2023-05-23 | 中国科学院微电子研究所 | 半导体研磨垫及制备方法 |
| EP4267342A4 (en) * | 2020-12-22 | 2024-10-30 | CMC Materials LLC | Chemical-mechanical polishing subpad having porogens with polymeric shells |
| KR102518222B1 (ko) * | 2020-12-24 | 2023-04-05 | 주식회사 에스엠티 | 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치 |
| CN117999150A (zh) | 2021-09-02 | 2024-05-07 | Cmc材料有限责任公司 | 包含聚合物颗粒的纹理化cmp垫 |
| KR102721631B1 (ko) * | 2021-09-17 | 2024-10-23 | 에스케이엔펄스 주식회사 | 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치 |
| KR102764254B1 (ko) * | 2022-02-25 | 2025-02-05 | 서울대학교산학협력단 | 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지 |
| US12447581B2 (en) * | 2022-07-11 | 2025-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features |
| CN120051356A (zh) * | 2022-09-22 | 2025-05-27 | Cmc材料有限责任公司 | 具有二硫键的化学机械抛光垫 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2375263A (en) * | 1944-06-27 | 1945-05-08 | Carborundum Co | Method of making abrasive articles |
| US3962154A (en) * | 1971-06-01 | 1976-06-08 | Standard Oil Company | Method for producing an improved molded thermoplastic article |
| US3922801A (en) * | 1973-07-16 | 1975-12-02 | Patrick Thomas Zente | Liquid filled orthopedic apparatus |
| US5147937A (en) * | 1990-03-22 | 1992-09-15 | Rohm And Haas Company | Process for making controlled, uniform-sized particles in the 1 to 50 micrometer range |
| US5534023A (en) * | 1992-12-29 | 1996-07-09 | Henley; Julian L. | Fluid filled prosthesis excluding gas-filled beads |
| US5976000A (en) * | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
| US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| US6231942B1 (en) * | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
| JPH11322877A (ja) | 1998-05-12 | 1999-11-26 | Dainippon Ink & Chem Inc | 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物 |
| US6656018B1 (en) * | 1999-04-13 | 2003-12-02 | Freudenberg Nonwovens Limited Partnership | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| JP2000344902A (ja) | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
| US6718703B2 (en) * | 2000-10-03 | 2004-04-13 | Lukley Holdings Pty Ltd. | Roofing tile assembly |
| AU2001291143A1 (en) * | 2000-10-06 | 2002-04-22 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
| US6531523B1 (en) * | 2000-10-10 | 2003-03-11 | Renal Tech International, Llc | Method of making biocompatible polymeric adsorbing material for purification of physiological fluids of organism |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7579071B2 (en) * | 2002-09-17 | 2009-08-25 | Korea Polyol Co., Ltd. | Polishing pad containing embedded liquid microelements and method of manufacturing the same |
| US7704125B2 (en) * | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20050042976A1 (en) * | 2003-08-22 | 2005-02-24 | International Business Machines Corporation | Low friction planarizing/polishing pads and use thereof |
| DE10348876B4 (de) * | 2003-10-21 | 2014-04-03 | Jnc Corporation | Poröse Polyolefinmembran |
| JP4555559B2 (ja) * | 2003-11-25 | 2010-10-06 | 富士紡ホールディングス株式会社 | 研磨布及び研磨布の製造方法 |
| US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
| US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
| US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
| TWI378844B (en) | 2005-08-18 | 2012-12-11 | Rohm & Haas Elect Mat | Polishing pad and method of manufacture |
| US20080057844A1 (en) * | 2006-02-01 | 2008-03-06 | Fred Miekka | Discontinuous Abrasive Surfaces Having Controlled Wear Properties |
| US20070212985A1 (en) * | 2006-03-07 | 2007-09-13 | Boler Lewyn B Jr | Wet sanding sponge; system and method for storing and using same |
| KR100804275B1 (ko) * | 2006-07-24 | 2008-02-18 | 에스케이씨 주식회사 | 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법 |
| US8257153B2 (en) | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| JP4986129B2 (ja) | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
| KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
| US9017140B2 (en) * | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| JP2013526932A (ja) * | 2010-05-10 | 2013-06-27 | アラーガン、インコーポレイテッド | 多孔質材料、作製方法および使用 |
| US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| WO2012044683A2 (en) | 2010-09-30 | 2012-04-05 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
| US8702479B2 (en) * | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
| US8920219B2 (en) * | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
| JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
| US9597769B2 (en) * | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
| US9238296B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
-
2014
- 2014-06-18 US US14/307,846 patent/US9238294B2/en active Active
-
2015
- 2015-06-12 CN CN202110193495.4A patent/CN113276016A/zh active Pending
- 2015-06-12 CN CN201580032943.5A patent/CN106470799A/zh active Pending
- 2015-06-12 WO PCT/US2015/035662 patent/WO2015195488A1/en not_active Ceased
- 2015-06-12 KR KR1020177001076A patent/KR102391135B1/ko active Active
- 2015-06-12 EP EP15731467.5A patent/EP3157710B1/en active Active
- 2015-06-12 SG SG11201610140TA patent/SG11201610140TA/en unknown
- 2015-06-12 JP JP2017519211A patent/JP6810992B2/ja active Active
- 2015-06-17 TW TW104119621A patent/TWI599448B/zh active
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2019
- 2019-11-22 JP JP2019211478A patent/JP2020055103A/ja not_active Withdrawn
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|---|---|
| US9238294B2 (en) | 2016-01-19 |
| SG11201610140TA (en) | 2017-01-27 |
| CN113276016A (zh) | 2021-08-20 |
| KR102391135B1 (ko) | 2022-04-28 |
| JP2020055103A (ja) | 2020-04-09 |
| US20150367478A1 (en) | 2015-12-24 |
| JP2017520422A (ja) | 2017-07-27 |
| JP6810992B2 (ja) | 2021-01-13 |
| CN106470799A (zh) | 2017-03-01 |
| TW201609315A (zh) | 2016-03-16 |
| EP3157710A1 (en) | 2017-04-26 |
| KR20170020446A (ko) | 2017-02-22 |
| EP3157710B1 (en) | 2021-11-10 |
| WO2015195488A1 (en) | 2015-12-23 |
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