JP6810992B2 - 液状充填材を含むポロゲンを有する研磨パッド - Google Patents
液状充填材を含むポロゲンを有する研磨パッド Download PDFInfo
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
Claims (16)
- ポリマーマトリックスと、前記ポリマーマトリックスの全体に分散した複数のポロゲンとを含む研磨体であって、前記複数のポロゲンのそれぞれが液状充填材を含むシェルを含み、前記液状充填材が、1atmの圧力で100℃未満の沸点を有し、前記複数のポロゲンの少なくとも一部が、三日月形状を有する、研磨体
を含み、前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ0.8g/cm3超の合計密度を有する、基材を研磨するための研磨パッド。 - 前記複数のポロゲンのそれぞれの前記シェルがポリマーシェルであり、前記液状充填材が、n−ペンタン、イソ−ペンタン、ブタン、及びイソ−ブタンからなる群より選択される、請求項1に記載の研磨パッド。
- 前記ポリマーシェルが、ブロックコポリマー、ポリ塩化ビニリデン、アクリル材料、及びアクリロニトリルからなる群より選択される材料を含む、請求項2に記載の研磨パッド。
- ポリマーマトリックスと、前記ポリマーマトリックスの全体に分散した複数のポロゲンとを含む研磨体であって、前記複数のポロゲンのそれぞれが液状充填材を含むシェルを含み、前記液状充填材が水より低い密度を有する、研磨体
を含み、前記複数のポロゲンの少なくとも一部が、三日月形状を有し、前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ0.8g/cm3超の合計密度を有する、基材を研磨するための研磨パッド。 - 前記液状充填材が、およそ0.7g/cm3未満の密度を有する、請求項4に記載の研磨パッド。
- 前記複数のポロゲンのそれぞれの前記シェルがポリマーシェルであり、前記液状充填材が、7個以上の炭素原子を有する炭化水素分子である、請求項4に記載の研磨パッド。
- 前記ポリマーシェルが、ブロックコポリマー、ポリ塩化ビニリデン、アクリル材料、及びアクリロニトリルからなる群より選択される材料を含む、請求項6に記載の研磨パッド。
- a)前記研磨体の前記ポリマーマトリックスが熱硬化性ポリウレタン材料を含む;
b)前記複数のポロゲンの少なくとも一部が、三日月形状を有し、任意選択で前記三日月形状が、およそ6〜40ミクロンの範囲の平均径を有する;
c)前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体がある合計体積を有し、前記複数のポロゲンが前記合計体積のおよそ20%〜およそ50%を含む;
e)前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ1g/cm3超の合計密度を有する;
h)前記ポリマーマトリックスの全体に分散した第2の複数のポロゲンをさらに含み、前記第2の複数のポロゲンのそれぞれがガス充填材を含むシェル無しポロゲンである;
i)前記複数のポロゲンのそれぞれの前記液状充填材が、1atmの圧力で40℃未満の沸点を有する;
j)前記研磨体が、溝付きの第1面と、前記第1面と反対側の平らな第2面とをさらに含む;
k)前記研磨体が成形研磨体である;
l)前記研磨体の全体におよそ一様に分散した隠蔽性充填材をさらに含む;
m)前記研磨体の裏面上に配置された下地層をさらに含む;
n)前記研磨体の裏面に配置された検出領域をさらに含む;
o)前記研磨体の裏面上に配置されたサブパッドをさらに含む;
p)前記研磨体の裏面に配置された局所透明(LAT)領域をさらに含む
のうち1つ又は複数が適用される、請求項1に記載の研磨パッド。 - a)前記研磨体の前記ポリマーマトリックスが熱硬化性ポリウレタン材料を含む;
b)前記三日月形状が、およそ6〜40ミクロンの範囲の平均径を有する;
c)前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体がある合計体積を有し、前記複数のポロゲンが前記合計体積のおよそ20%〜およそ50%を含む;
e)前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ1g/cm3超の合計密度を有する;
h)前記ポリマーマトリックスの全体に分散した第2の複数のポロゲンをさらに含み、前記第2の複数のポロゲンのそれぞれがガス充填材を含むシェル無しポロゲンである;
i)前記複数のポロゲンのそれぞれの前記液状充填材が、1atmの圧力で40℃未満の沸点を有する;
j)前記研磨体が、溝付きの第1面と、前記第1面と反対側の平らな第2面とをさらに含む;
k)前記研磨体が成形研磨体である;
l)前記研磨体の全体におよそ一様に分散した隠蔽性充填材をさらに含む;
m)前記研磨体の裏面上に配置された下地層をさらに含む;
n)前記研磨体の裏面に配置された検出領域をさらに含む;
o)前記研磨体の裏面上に配置されたサブパッドをさらに含む;
p)前記研磨体の裏面に配置された局所透明(LAT)領域をさらに含む
のうち1つ又は複数が適用される、請求項4に記載の研磨パッド。 - プレポリマーと硬化剤とを複数のポロゲンと共に混合して混合物を形成する工程であって、前記複数のポロゲンのそれぞれが液状充填材を含むシェルを含み、前記液状充填材が、1atmの圧力で100℃未満の沸点を有し、前記複数のポロゲンの少なくとも一部が、三日月形状を有する工程と、
前記混合物を硬化して、研磨体のポリマーマトリックスの全体に分散した前記複数のポロゲンを有する前記研磨体を含む研磨パッドを提供する工程であって、硬化が、前記複数のポロゲンのそれぞれを実質的に膨張させない工程と
を含み、前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ0.8g/cm3超の合計密度を有する、研磨パッドの製造方法。 - 前記混合物を硬化して前記研磨パッドを提供する工程が、成形型中で前記混合物を硬化して成形研磨パッドを提供することを含み、随意選択的に、前記成形型中で硬化することが、前記研磨体の研磨表面に溝パターンを形成することを含む、請求項10に記載の方法。
- a)前記混合物を硬化する工程が、前記混合物を、前記複数のポロゲンの膨張温度未満の温度に加熱することを含む;
b)混合する工程が、前記プレポリマー及び前記硬化剤に、又は形成された生産物にガスを注入することをさらに含む;
c)前記プレポリマーがイソシアネートであり、混合する工程が水を前記プレポリマーに加えることをさらに含む;
d)混合する工程が、前記プレポリマー、前記硬化剤及び前記複数のポロゲンを、前記ポリマーマトリックスの全体に分散した第2の複数のポロゲンと混合することをさらに含み、前記第2の複数のポロゲンが、ガス充填材を含むシェルを含む;
e)前記複数のポロゲンのそれぞれが三日月形状を有し、硬化する工程が、前記複数のポロゲンのそれぞれの三日月形状を実質的に変更しない;
f)前記複数のポロゲンのそれぞれが、およそ6〜40ミクロンの範囲の平均径を有し、硬化する工程が、前記複数のポロゲンのそれぞれの平均径を実質的に増加させない;
g)混合する工程が、前記プレポリマー及び前記硬化剤に隠蔽性充填材を加えることをさらに含む;
h)硬化する工程の後に、オーブン中で前記研磨パッドを加熱する工程をさらに含み、加熱する工程が前記複数のポロゲンのそれぞれを実質的に膨張させない
のうち1つ又は複数が適用される、請求項10に記載の方法。 - 前記混合物を硬化する工程が、前記研磨体の熱硬化性ポリウレタンのポリマーマトリックスを形成し、任意選択で前記プレポリマーと前記硬化剤とを混合する工程が、それぞれ、イソシアネートと芳香族ジアミン化合物とを混合することを含む、請求項10に記載の方法。
- プラテン上に研磨パッドを提供する工程であって、前記研磨パッドが、前記研磨パッドの研磨体のポリマーマトリックスの全体に分散した複数のポロゲンを含み、前記複数のポロゲンのそれぞれが液状充填材を含むシェルを含み、前記液状充填材が、1atmの圧力で100℃未満の沸点を有し、前記複数のポロゲンの少なくとも一部が、三日月形状を有し、前記ポリマーマトリックスと前記複数のポロゲンとを含む前記研磨体が、およそ0.8g/cm3超の合計密度を有する工程と、
前記研磨パッドをコンディショニングする工程であって、コンディショニングする工程が、前記研磨パッドの前記研磨体の前記複数のポロゲンの最上部を破壊して、前記研磨パッドの研磨表面を提供することを含む工程と、
前記研磨パッドの前記研磨表面上にスラリーを適用する工程と、
前記研磨パッドの前記研磨表面のスラリーで基材を研磨する工程と
を含む、基材の研磨方法。 - a)前記複数のポロゲンの最上部を破壊する工程が、前記液状充填材の揮発によって、前記複数のポロゲンの最上部のそれぞれの前記液状充填材の少なくとも一部を取り除くことを含む;
b)前記研磨パッドの前記研磨表面上に前記スラリーを適用する工程が、前記複数のポロゲンの最上部のそれぞれから、前記液状充填材の少なくとも一部を前記スラリーで置き換えることを含む;
c)前記複数のポロゲンの最上部を破壊する工程が、前記研磨パッドの前記研磨体の残りの下層部よりも低い密度及び低い硬度を有する前記研磨表面を提供する;
d)前記複数のポロゲンの最上部を破壊する工程が、パッドコンディショニングツールで前記研磨パッドの最上部を切断することを含む
のうち1つ又は複数が適用される、請求項14に記載の方法。 - 前記複数のポロゲンの最上部を破壊する工程が、前記研磨パッドの前記研磨表面で複数の孔を提供することを含み、随意選択的に、前記研磨パッドの前記研磨表面で前記複数の孔を提供することが、前記研磨パッドのスラリーを輸送する固有の能力を提供する、請求項14に記載の方法。
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US14/307,846 US9238294B2 (en) | 2014-06-18 | 2014-06-18 | Polishing pad having porogens with liquid filler |
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2014
- 2014-06-18 US US14/307,846 patent/US9238294B2/en active Active
-
2015
- 2015-06-12 CN CN201580032943.5A patent/CN106470799A/zh active Pending
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- 2015-06-12 JP JP2017519211A patent/JP6810992B2/ja active Active
- 2015-06-12 SG SG11201610140TA patent/SG11201610140TA/en unknown
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- 2015-06-12 KR KR1020177001076A patent/KR102391135B1/ko active IP Right Grant
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US20150367478A1 (en) | 2015-12-24 |
CN106470799A (zh) | 2017-03-01 |
US9238294B2 (en) | 2016-01-19 |
KR20170020446A (ko) | 2017-02-22 |
JP2020055103A (ja) | 2020-04-09 |
EP3157710B1 (en) | 2021-11-10 |
TWI599448B (zh) | 2017-09-21 |
JP2017520422A (ja) | 2017-07-27 |
CN113276016A (zh) | 2021-08-20 |
SG11201610140TA (en) | 2017-01-27 |
KR102391135B1 (ko) | 2022-04-28 |
TW201609315A (zh) | 2016-03-16 |
EP3157710A1 (en) | 2017-04-26 |
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