SG11201610140TA - Polishing pad having porogens with liquid filler - Google Patents

Polishing pad having porogens with liquid filler

Info

Publication number
SG11201610140TA
SG11201610140TA SG11201610140TA SG11201610140TA SG11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA
Authority
SG
Singapore
Prior art keywords
porogens
polishing pad
liquid filler
filler
liquid
Prior art date
Application number
SG11201610140TA
Other languages
English (en)
Inventor
Paul Andre Lefevre
William C Allison
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201610140TA publication Critical patent/SG11201610140TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • B24D3/32Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11201610140TA 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler SG11201610140TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Publications (1)

Publication Number Publication Date
SG11201610140TA true SG11201610140TA (en) 2017-01-27

Family

ID=53487453

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610140TA SG11201610140TA (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Country Status (8)

Country Link
US (1) US9238294B2 (ja)
EP (1) EP3157710B1 (ja)
JP (2) JP6810992B2 (ja)
KR (1) KR102391135B1 (ja)
CN (2) CN106470799A (ja)
SG (1) SG11201610140TA (ja)
TW (1) TWI599448B (ja)
WO (1) WO2015195488A1 (ja)

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JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
WO2018035481A1 (en) * 2016-08-19 2018-02-22 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
US20220193860A1 (en) * 2020-12-22 2022-06-23 Cmc Materials, Inc. Chemical-mechanical polishing subpad having porogens with polymeric shells
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
TW202319455A (zh) * 2021-09-02 2023-05-16 美商Cmc材料股份有限公司 包含聚合物顆粒之紋理化cmp墊
WO2024064259A1 (en) * 2022-09-22 2024-03-28 Cmc Materials Llc Chemical mechanical polishing pads with a disulfide bridge

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US5147937A (en) * 1990-03-22 1992-09-15 Rohm And Haas Company Process for making controlled, uniform-sized particles in the 1 to 50 micrometer range
US5534023A (en) * 1992-12-29 1996-07-09 Henley; Julian L. Fluid filled prosthesis excluding gas-filled beads
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
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US6231942B1 (en) * 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
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US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
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WO2012044683A2 (en) * 2010-09-30 2012-04-05 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8702479B2 (en) * 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
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US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer

Also Published As

Publication number Publication date
US20150367478A1 (en) 2015-12-24
CN106470799A (zh) 2017-03-01
US9238294B2 (en) 2016-01-19
KR20170020446A (ko) 2017-02-22
JP6810992B2 (ja) 2021-01-13
JP2020055103A (ja) 2020-04-09
EP3157710B1 (en) 2021-11-10
TWI599448B (zh) 2017-09-21
JP2017520422A (ja) 2017-07-27
CN113276016A (zh) 2021-08-20
KR102391135B1 (ko) 2022-04-28
TW201609315A (zh) 2016-03-16
EP3157710A1 (en) 2017-04-26
WO2015195488A1 (en) 2015-12-23

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