SG11201610140TA - Polishing pad having porogens with liquid filler - Google Patents

Polishing pad having porogens with liquid filler

Info

Publication number
SG11201610140TA
SG11201610140TA SG11201610140TA SG11201610140TA SG11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA SG 11201610140T A SG11201610140T A SG 11201610140TA
Authority
SG
Singapore
Prior art keywords
porogens
polishing pad
liquid filler
filler
liquid
Prior art date
Application number
SG11201610140TA
Other languages
English (en)
Inventor
Paul Andre Lefevre
William C Allison
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201610140TA publication Critical patent/SG11201610140TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11201610140TA 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler SG11201610140TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Publications (1)

Publication Number Publication Date
SG11201610140TA true SG11201610140TA (en) 2017-01-27

Family

ID=53487453

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610140TA SG11201610140TA (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Country Status (8)

Country Link
US (1) US9238294B2 (enExample)
EP (1) EP3157710B1 (enExample)
JP (2) JP6810992B2 (enExample)
KR (1) KR102391135B1 (enExample)
CN (2) CN113276016A (enExample)
SG (1) SG11201610140TA (enExample)
TW (1) TWI599448B (enExample)
WO (1) WO2015195488A1 (enExample)

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JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US11964920B2 (en) 2016-08-19 2024-04-23 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
EP4267342A4 (en) * 2020-12-22 2024-10-30 CMC Materials LLC Chemical-mechanical polishing subpad having porogens with polymeric shells
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
US12447581B2 (en) * 2022-07-11 2025-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫

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US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
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US6231942B1 (en) * 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
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US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
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DE10348876B4 (de) * 2003-10-21 2014-04-03 Jnc Corporation Poröse Polyolefinmembran
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US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
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US20080057844A1 (en) * 2006-02-01 2008-03-06 Fred Miekka Discontinuous Abrasive Surfaces Having Controlled Wear Properties
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US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP2013526932A (ja) * 2010-05-10 2013-06-27 アラーガン、インコーポレイテッド 多孔質材料、作製方法および使用
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
WO2012044683A2 (en) 2010-09-30 2012-04-05 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8702479B2 (en) * 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
JP5945874B2 (ja) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US9067298B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer

Also Published As

Publication number Publication date
US9238294B2 (en) 2016-01-19
CN113276016A (zh) 2021-08-20
KR102391135B1 (ko) 2022-04-28
JP2020055103A (ja) 2020-04-09
US20150367478A1 (en) 2015-12-24
JP2017520422A (ja) 2017-07-27
JP6810992B2 (ja) 2021-01-13
CN106470799A (zh) 2017-03-01
TW201609315A (zh) 2016-03-16
TWI599448B (zh) 2017-09-21
EP3157710A1 (en) 2017-04-26
KR20170020446A (ko) 2017-02-22
EP3157710B1 (en) 2021-11-10
WO2015195488A1 (en) 2015-12-23

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