CN108673332A - 多孔聚氨酯抛光垫及通过采用该抛光垫制备半导体器件的方法 - Google Patents
多孔聚氨酯抛光垫及通过采用该抛光垫制备半导体器件的方法 Download PDFInfo
- Publication number
- CN108673332A CN108673332A CN201810493335.XA CN201810493335A CN108673332A CN 108673332 A CN108673332 A CN 108673332A CN 201810493335 A CN201810493335 A CN 201810493335A CN 108673332 A CN108673332 A CN 108673332A
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- Prior art keywords
- polishing pad
- polished
- cellular polyurethane
- afm
- polished surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- Polyurethanes Or Polyureas (AREA)
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Abstract
Description
Claims (11)
Applications Claiming Priority (2)
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KR10-2017-0066076 | 2017-05-29 | ||
KR1020170066076A KR101835090B1 (ko) | 2017-05-29 | 2017-05-29 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
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CN108673332A true CN108673332A (zh) | 2018-10-19 |
CN108673332B CN108673332B (zh) | 2021-04-27 |
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CN201810493335.XA Active CN108673332B (zh) | 2017-05-29 | 2018-05-22 | 多孔聚氨酯抛光垫及通过采用该抛光垫制备半导体器件的方法 |
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US (1) | US10518383B2 (zh) |
JP (1) | JP6636568B2 (zh) |
KR (1) | KR101835090B1 (zh) |
CN (1) | CN108673332B (zh) |
TW (1) | TWI728246B (zh) |
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CN110003668A (zh) * | 2019-03-06 | 2019-07-12 | 中国科学院上海光学精密机械研究所 | 多微孔结构的沥青抛光盘及其制备方法 |
CN112423935A (zh) * | 2018-06-29 | 2021-02-26 | 圣戈班磨料磨具有限公司 | 磨料制品及其形成方法 |
CN112571303A (zh) * | 2019-09-29 | 2021-03-30 | Skc株式会社 | 抛光垫、该抛光垫的制造方法及使用该抛光垫的抛光方法 |
CN114434318A (zh) * | 2020-11-06 | 2022-05-06 | Skc索密思株式会社 | 抛光垫及其制备方法以及使用其的半导体器件的制造方法 |
CN114762953A (zh) * | 2020-12-30 | 2022-07-19 | Skc索密思株式会社 | 抛光垫、抛光垫的制备方法及半导体器件的制造方法 |
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KR101853021B1 (ko) * | 2017-01-12 | 2018-04-30 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
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TWI741753B (zh) * | 2019-10-29 | 2021-10-01 | 南韓商Skc索密思股份有限公司 | 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法 |
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KR102502516B1 (ko) * | 2021-03-12 | 2023-02-23 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
KR102488101B1 (ko) * | 2021-05-04 | 2023-01-12 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
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- 2018-05-25 US US15/989,403 patent/US10518383B2/en active Active
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US20180339394A1 (en) | 2018-11-29 |
CN108673332B (zh) | 2021-04-27 |
JP2019024078A (ja) | 2019-02-14 |
TWI728246B (zh) | 2021-05-21 |
JP6636568B2 (ja) | 2020-01-29 |
TW201900335A (zh) | 2019-01-01 |
US10518383B2 (en) | 2019-12-31 |
KR101835090B1 (ko) | 2018-03-06 |
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