JP2017521877A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017521877A5 JP2017521877A5 JP2017522729A JP2017522729A JP2017521877A5 JP 2017521877 A5 JP2017521877 A5 JP 2017521877A5 JP 2017522729 A JP2017522729 A JP 2017522729A JP 2017522729 A JP2017522729 A JP 2017522729A JP 2017521877 A5 JP2017521877 A5 JP 2017521877A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- laser
- laser beam
- focal plane
- optical arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 74
- 230000003287 optical effect Effects 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims 25
- 230000001939 inductive effect Effects 0.000 claims 6
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000003672 processing method Methods 0.000 claims 3
- 239000003575 carbonaceous material Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 230000003993 interaction Effects 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 claims 1
- 230000006698 induction Effects 0.000 description 3
- MSWZFWKMSRAUBD-CBPJZXOFSA-N 2-amino-2-deoxy-D-mannopyranose Chemical compound N[C@@H]1C(O)O[C@H](CO)[C@@H](O)[C@@H]1O MSWZFWKMSRAUBD-CBPJZXOFSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014213775.6 | 2014-07-15 | ||
| DE102014213775.6A DE102014213775B4 (de) | 2014-07-15 | 2014-07-15 | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
| PCT/EP2015/065476 WO2016008768A1 (de) | 2014-07-15 | 2015-07-07 | Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017521877A JP2017521877A (ja) | 2017-08-03 |
| JP2017521877A5 true JP2017521877A5 (enExample) | 2019-11-14 |
| JP6804441B2 JP6804441B2 (ja) | 2020-12-23 |
Family
ID=53682658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017522729A Active JP6804441B2 (ja) | 2014-07-15 | 2015-07-07 | 平面結晶性基板、特に半導体基板のレーザ加工方法及び装置 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US10821555B2 (enExample) |
| EP (1) | EP3169475B1 (enExample) |
| JP (1) | JP6804441B2 (enExample) |
| KR (1) | KR102318041B1 (enExample) |
| CN (1) | CN107073655B (enExample) |
| DE (1) | DE102014213775B4 (enExample) |
| ES (1) | ES2774377T3 (enExample) |
| LT (1) | LT3169475T (enExample) |
| PT (1) | PT3169475T (enExample) |
| TW (1) | TWI688444B (enExample) |
| WO (1) | WO2016008768A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| CN106687419A (zh) | 2014-07-08 | 2017-05-17 | 康宁股份有限公司 | 用于激光处理材料的方法和设备 |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| JP6755707B2 (ja) * | 2016-05-12 | 2020-09-16 | 株式会社ディスコ | レーザー加工装置 |
| LT3311947T (lt) | 2016-09-30 | 2019-12-27 | Corning Incorporated | Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| DE102017206461B4 (de) | 2017-04-13 | 2019-05-02 | Schott Ag | Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks |
| DE102018201596A1 (de) * | 2018-02-02 | 2019-08-08 | Forschungsverbund Berlin E.V. | Verfahren und Vorrichtung zur direkten Strukturierung mittels Laserstrahlung |
| KR102797419B1 (ko) | 2019-11-25 | 2025-04-21 | 삼성전자주식회사 | 기판 다이싱 방법, 반도체 소자의 제조 방법 및 그들에 의해 제조되는 반도체 칩 |
| JP7564719B2 (ja) * | 2021-01-28 | 2024-10-09 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| WO2022185096A1 (en) | 2021-03-03 | 2022-09-09 | Uab Altechna R&B | Laser beam transforming element |
| KR20240007769A (ko) * | 2021-06-02 | 2024-01-16 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | 공작물의 레이저 가공을 위한 방법 및 장치 |
| CN113866992B (zh) * | 2021-09-10 | 2022-07-12 | 华中科技大学 | 一种在太赫兹波段产生无衍射光束的球谐锥透镜 |
| US20240402507A1 (en) * | 2021-10-01 | 2024-12-05 | Tekjp, Inc. | Narrow beam generation device |
| CN114678431B (zh) * | 2022-03-21 | 2024-11-26 | 上海集成电路制造创新中心有限公司 | 一种光电探测器的制备方法 |
| DE102022115711A1 (de) | 2022-06-23 | 2023-12-28 | Schott Ag | Verfahren und Vorrichtung zum Bearbeiten von Werkstücken |
| KR20250091186A (ko) * | 2022-08-17 | 2025-06-20 | 닐슨 싸이언티픽, 엘엘씨 | 병렬화된 3차원 반도체 제조 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3531199B2 (ja) * | 1994-02-22 | 2004-05-24 | 三菱電機株式会社 | 光伝送装置 |
| US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| JP3338927B2 (ja) * | 1998-05-22 | 2002-10-28 | 住友重機械工業株式会社 | レーザ穴あけ加工装置用のデスミア装置及びデスミア方法 |
| JP2000015467A (ja) * | 1998-07-01 | 2000-01-18 | Shin Meiwa Ind Co Ltd | 光による被加工材の加工方法および加工装置 |
| JP2000288766A (ja) * | 1999-04-07 | 2000-10-17 | Kubota Corp | レーザ加工装置 |
| US6472295B1 (en) * | 1999-08-27 | 2002-10-29 | Jmar Research, Inc. | Method and apparatus for laser ablation of a target material |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| KR100673073B1 (ko) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
| US6720522B2 (en) * | 2000-10-26 | 2004-04-13 | Kabushiki Kaisha Toshiba | Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining |
| JP3624909B2 (ja) * | 2002-03-12 | 2005-03-02 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP2004103628A (ja) * | 2002-09-05 | 2004-04-02 | Hitachi Ltd | レーザアニール装置及びtft基板のレーザアニール方法 |
| FR2855084A1 (fr) * | 2003-05-22 | 2004-11-26 | Air Liquide | Optique de focalisation pour le coupage laser |
| JP4418282B2 (ja) * | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
| JP4440036B2 (ja) * | 2004-08-11 | 2010-03-24 | 株式会社ディスコ | レーザー加工方法 |
| JP4692717B2 (ja) * | 2004-11-02 | 2011-06-01 | 澁谷工業株式会社 | 脆性材料の割断装置 |
| JP4222296B2 (ja) * | 2004-11-22 | 2009-02-12 | 住友電気工業株式会社 | レーザ加工方法とレーザ加工装置 |
| JP2006319198A (ja) * | 2005-05-13 | 2006-11-24 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法およびレーザー加工装置 |
| DE102006042280A1 (de) * | 2005-09-08 | 2007-06-06 | IMRA America, Inc., Ann Arbor | Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser |
| JP5013699B2 (ja) * | 2005-10-21 | 2012-08-29 | 株式会社キーエンス | 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置 |
| DE102007018400B4 (de) * | 2007-04-17 | 2009-04-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Optisches System für einen Lasermaterialbearbeitungskopf |
| JP5328209B2 (ja) * | 2007-06-15 | 2013-10-30 | 三菱電機株式会社 | 基板加工方法 |
| DE102007044298B3 (de) * | 2007-09-17 | 2009-02-26 | Coherent Gmbh | Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt |
| JP5098665B2 (ja) * | 2008-01-23 | 2012-12-12 | 株式会社東京精密 | レーザー加工装置およびレーザー加工方法 |
| JP5074272B2 (ja) * | 2008-04-15 | 2012-11-14 | 株式会社リンクスタージャパン | 脆性材料基板の加工装置および切断方法 |
| DE102010016628A1 (de) * | 2010-02-26 | 2011-09-29 | Reis Group Holding Gmbh & Co. Kg | Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien |
| JP4948629B2 (ja) * | 2010-07-20 | 2012-06-06 | ウシオ電機株式会社 | レーザリフトオフ方法 |
| GB201014778D0 (en) * | 2010-09-06 | 2010-10-20 | Baird Brian W | Picosecond laser beam shaping assembly and a method of shaping a picosecond laser beam |
| KR101298019B1 (ko) * | 2010-12-28 | 2013-08-26 | (주)큐엠씨 | 레이저 가공 장치 |
| DE102011000768B4 (de) | 2011-02-16 | 2016-08-18 | Ewag Ag | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung |
| US8871613B2 (en) * | 2012-06-18 | 2014-10-28 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
| JP5832412B2 (ja) * | 2012-11-12 | 2015-12-16 | 三菱重工業株式会社 | 光学系及びレーザ加工装置 |
| EP2754524B1 (de) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| US9676167B2 (en) * | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9517963B2 (en) * | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
-
2014
- 2014-07-15 DE DE102014213775.6A patent/DE102014213775B4/de active Active
-
2015
- 2015-07-07 KR KR1020177003422A patent/KR102318041B1/ko active Active
- 2015-07-07 US US15/325,859 patent/US10821555B2/en active Active
- 2015-07-07 EP EP15739207.7A patent/EP3169475B1/de active Active
- 2015-07-07 LT LTEP15739207.7T patent/LT3169475T/lt unknown
- 2015-07-07 PT PT157392077T patent/PT3169475T/pt unknown
- 2015-07-07 ES ES15739207T patent/ES2774377T3/es active Active
- 2015-07-07 JP JP2017522729A patent/JP6804441B2/ja active Active
- 2015-07-07 CN CN201580049806.2A patent/CN107073655B/zh active Active
- 2015-07-07 WO PCT/EP2015/065476 patent/WO2016008768A1/de not_active Ceased
- 2015-07-13 TW TW104122499A patent/TWI688444B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017521877A5 (enExample) | ||
| EP2724364B1 (en) | Novel thermal processing apparatus | |
| JP7420937B2 (ja) | ワークピースのレーザ加工の方法、加工光学ユニット及びレーザ加工装置 | |
| CN107073655B (zh) | 基于激光加工平面晶体衬底的方法和设备 | |
| TWI465309B (zh) | Laser processing method and laser processing device | |
| KR102584490B1 (ko) | 투명한 재료의 레이저 가공 방법 및 장치 | |
| US9786562B2 (en) | Method and device for cutting wafers | |
| JP6782692B2 (ja) | 板状の加工物に少なくとも一つの窪み又は穴を配設する方法 | |
| WO2015173735A1 (en) | Device for mask projection of femtosecond and picosecond laser beams with a blade, a mask and lenses' systems | |
| TW201709306A (zh) | 晶圓的生成方法 | |
| TW201631228A (zh) | 晶圓的生成方法 | |
| TW201700249A (zh) | 晶圓的生成方法 | |
| US20170040194A1 (en) | Process sheet resistance uniformity improvement using multiple melt laser exposures | |
| JP2016516516A5 (enExample) | ||
| CN111065759B (zh) | 激光装置和对薄膜进行加工的方法 | |
| KR20130076440A (ko) | 레이저 절단 장치 및 절단 방법 | |
| JP6744624B2 (ja) | 管状脆性部材の分断方法並びに分断装置 | |
| TWI871422B (zh) | 晶圓加工方法以及晶圓加工裝置 | |
| KR101149594B1 (ko) | 펨토초 펄스 레이저 응용 pzt 소자를 이용한 가공면 절단 방법 | |
| JP6299438B2 (ja) | 平角線の接合方法 | |
| JP6753347B2 (ja) | ガラス基板の製造方法、ガラス基板に孔を形成する方法、およびガラス基板に孔を形成する装置 | |
| JP6134914B2 (ja) | コンフォーマルマスク材料のレーザ加工方法 | |
| JP2015062943A (ja) | レーザ加工装置、レーザ加工方法 | |
| KR20200037306A (ko) | 박막을 가공하는 레이저 장치 및 방법 | |
| KR20240123798A (ko) | 기판 절단 및 쪼개기를 위한 기판 준비 |