KR102318041B1 - 2차원의 결정질 기판, 특히 반도체 기판의 레이저 기반 가공을 위한 방법 및 장치 - Google Patents

2차원의 결정질 기판, 특히 반도체 기판의 레이저 기반 가공을 위한 방법 및 장치 Download PDF

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KR102318041B1
KR102318041B1 KR1020177003422A KR20177003422A KR102318041B1 KR 102318041 B1 KR102318041 B1 KR 102318041B1 KR 1020177003422 A KR1020177003422 A KR 1020177003422A KR 20177003422 A KR20177003422 A KR 20177003422A KR 102318041 B1 KR102318041 B1 KR 102318041B1
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substrate
laser
laser beam
focal surface
induced
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Korean (ko)
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KR20170028426A (ko
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리코 뵈메
다니엘 웨버
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이놀라스 솔루션스 게엠베하
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020177003422A 2014-07-15 2015-07-07 2차원의 결정질 기판, 특히 반도체 기판의 레이저 기반 가공을 위한 방법 및 장치 Active KR102318041B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014213775.6 2014-07-15
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
PCT/EP2015/065476 WO2016008768A1 (de) 2014-07-15 2015-07-07 Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten

Publications (2)

Publication Number Publication Date
KR20170028426A KR20170028426A (ko) 2017-03-13
KR102318041B1 true KR102318041B1 (ko) 2021-10-27

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KR1020177003422A Active KR102318041B1 (ko) 2014-07-15 2015-07-07 2차원의 결정질 기판, 특히 반도체 기판의 레이저 기반 가공을 위한 방법 및 장치

Country Status (11)

Country Link
US (1) US10821555B2 (enExample)
EP (1) EP3169475B1 (enExample)
JP (1) JP6804441B2 (enExample)
KR (1) KR102318041B1 (enExample)
CN (1) CN107073655B (enExample)
DE (1) DE102014213775B4 (enExample)
ES (1) ES2774377T3 (enExample)
LT (1) LT3169475T (enExample)
PT (1) PT3169475T (enExample)
TW (1) TWI688444B (enExample)
WO (1) WO2016008768A1 (enExample)

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EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6755707B2 (ja) * 2016-05-12 2020-09-16 株式会社ディスコ レーザー加工装置
LT3311947T (lt) 2016-09-30 2019-12-27 Corning Incorporated Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102017206461B4 (de) 2017-04-13 2019-05-02 Schott Ag Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks
DE102018201596A1 (de) * 2018-02-02 2019-08-08 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zur direkten Strukturierung mittels Laserstrahlung
KR102797419B1 (ko) 2019-11-25 2025-04-21 삼성전자주식회사 기판 다이싱 방법, 반도체 소자의 제조 방법 및 그들에 의해 제조되는 반도체 칩
JP7564719B2 (ja) * 2021-01-28 2024-10-09 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2022185096A1 (en) 2021-03-03 2022-09-09 Uab Altechna R&B Laser beam transforming element
KR20240007769A (ko) * 2021-06-02 2024-01-16 트룸프 레이저-운트 시스템테크닉 게엠베하 공작물의 레이저 가공을 위한 방법 및 장치
CN113866992B (zh) * 2021-09-10 2022-07-12 华中科技大学 一种在太赫兹波段产生无衍射光束的球谐锥透镜
US20240402507A1 (en) * 2021-10-01 2024-12-05 Tekjp, Inc. Narrow beam generation device
CN114678431B (zh) * 2022-03-21 2024-11-26 上海集成电路制造创新中心有限公司 一种光电探测器的制备方法
DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
KR20250091186A (ko) * 2022-08-17 2025-06-20 닐슨 싸이언티픽, 엘엘씨 병렬화된 3차원 반도체 제조

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Also Published As

Publication number Publication date
TWI688444B (zh) 2020-03-21
KR20170028426A (ko) 2017-03-13
EP3169475A1 (de) 2017-05-24
TW201613710A (en) 2016-04-16
CN107073655B (zh) 2020-01-14
LT3169475T (lt) 2020-03-10
ES2774377T3 (es) 2020-07-20
WO2016008768A1 (de) 2016-01-21
DE102014213775A1 (de) 2016-01-21
EP3169475B1 (de) 2019-12-04
JP6804441B2 (ja) 2020-12-23
US20170157700A1 (en) 2017-06-08
CN107073655A (zh) 2017-08-18
PT3169475T (pt) 2020-03-13
JP2017521877A (ja) 2017-08-03
US10821555B2 (en) 2020-11-03
DE102014213775B4 (de) 2018-02-15

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