LT3169475T - Būdas ir įrenginys dviejų dimensijų kristalinių padėklų, ypatingai puslaidininkinių padėklų, lazeriniu pagrindu veikiančiam apdirbimui - Google Patents

Būdas ir įrenginys dviejų dimensijų kristalinių padėklų, ypatingai puslaidininkinių padėklų, lazeriniu pagrindu veikiančiam apdirbimui

Info

Publication number
LT3169475T
LT3169475T LTEP15739207.7T LT15739207T LT3169475T LT 3169475 T LT3169475 T LT 3169475T LT 15739207 T LT15739207 T LT 15739207T LT 3169475 T LT3169475 T LT 3169475T
Authority
LT
Lithuania
Prior art keywords
substrates
laser
dimensional
particular semiconductor
based working
Prior art date
Application number
LTEP15739207.7T
Other languages
English (en)
Lithuanian (lt)
Inventor
Rico Böhme
Daniel Weber
Original Assignee
Innolas Solutions Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolas Solutions Gmbh filed Critical Innolas Solutions Gmbh
Publication of LT3169475T publication Critical patent/LT3169475T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
LTEP15739207.7T 2014-07-15 2015-07-07 Būdas ir įrenginys dviejų dimensijų kristalinių padėklų, ypatingai puslaidininkinių padėklų, lazeriniu pagrindu veikiančiam apdirbimui LT3169475T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
PCT/EP2015/065476 WO2016008768A1 (de) 2014-07-15 2015-07-07 Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten

Publications (1)

Publication Number Publication Date
LT3169475T true LT3169475T (lt) 2020-03-10

Family

ID=53682658

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP15739207.7T LT3169475T (lt) 2014-07-15 2015-07-07 Būdas ir įrenginys dviejų dimensijų kristalinių padėklų, ypatingai puslaidininkinių padėklų, lazeriniu pagrindu veikiančiam apdirbimui

Country Status (11)

Country Link
US (1) US10821555B2 (enExample)
EP (1) EP3169475B1 (enExample)
JP (1) JP6804441B2 (enExample)
KR (1) KR102318041B1 (enExample)
CN (1) CN107073655B (enExample)
DE (1) DE102014213775B4 (enExample)
ES (1) ES2774377T3 (enExample)
LT (1) LT3169475T (enExample)
PT (1) PT3169475T (enExample)
TW (1) TWI688444B (enExample)
WO (1) WO2016008768A1 (enExample)

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EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
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CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
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US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102017206461B4 (de) 2017-04-13 2019-05-02 Schott Ag Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks
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WO2022185096A1 (en) 2021-03-03 2022-09-09 Uab Altechna R&B Laser beam transforming element
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CN113866992B (zh) * 2021-09-10 2022-07-12 华中科技大学 一种在太赫兹波段产生无衍射光束的球谐锥透镜
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DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
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Also Published As

Publication number Publication date
KR102318041B1 (ko) 2021-10-27
TWI688444B (zh) 2020-03-21
KR20170028426A (ko) 2017-03-13
EP3169475A1 (de) 2017-05-24
TW201613710A (en) 2016-04-16
CN107073655B (zh) 2020-01-14
ES2774377T3 (es) 2020-07-20
WO2016008768A1 (de) 2016-01-21
DE102014213775A1 (de) 2016-01-21
EP3169475B1 (de) 2019-12-04
JP6804441B2 (ja) 2020-12-23
US20170157700A1 (en) 2017-06-08
CN107073655A (zh) 2017-08-18
PT3169475T (pt) 2020-03-13
JP2017521877A (ja) 2017-08-03
US10821555B2 (en) 2020-11-03
DE102014213775B4 (de) 2018-02-15

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