TWI688444B - 平面晶體基板特別是半導體基板之以雷射為主之機器加工方法與裝置 - Google Patents

平面晶體基板特別是半導體基板之以雷射為主之機器加工方法與裝置 Download PDF

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Publication number
TWI688444B
TWI688444B TW104122499A TW104122499A TWI688444B TW I688444 B TWI688444 B TW I688444B TW 104122499 A TW104122499 A TW 104122499A TW 104122499 A TW104122499 A TW 104122499A TW I688444 B TWI688444 B TW I688444B
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TW
Taiwan
Prior art keywords
substrate
laser
light
laser light
focusing surface
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TW104122499A
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English (en)
Chinese (zh)
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TW201613710A (en
Inventor
瑞可 波麻
丹尼爾 偉柏
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德商英諾拉斯解決方案有限公司
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Publication of TW201613710A publication Critical patent/TW201613710A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW104122499A 2014-07-15 2015-07-13 平面晶體基板特別是半導體基板之以雷射為主之機器加工方法與裝置 TWI688444B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
DEDE102014213775.6 2014-07-15

Publications (2)

Publication Number Publication Date
TW201613710A TW201613710A (en) 2016-04-16
TWI688444B true TWI688444B (zh) 2020-03-21

Family

ID=53682658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122499A TWI688444B (zh) 2014-07-15 2015-07-13 平面晶體基板特別是半導體基板之以雷射為主之機器加工方法與裝置

Country Status (11)

Country Link
US (1) US10821555B2 (enExample)
EP (1) EP3169475B1 (enExample)
JP (1) JP6804441B2 (enExample)
KR (1) KR102318041B1 (enExample)
CN (1) CN107073655B (enExample)
DE (1) DE102014213775B4 (enExample)
ES (1) ES2774377T3 (enExample)
LT (1) LT3169475T (enExample)
PT (1) PT3169475T (enExample)
TW (1) TWI688444B (enExample)
WO (1) WO2016008768A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6755707B2 (ja) * 2016-05-12 2020-09-16 株式会社ディスコ レーザー加工装置
LT3311947T (lt) 2016-09-30 2019-12-27 Corning Incorporated Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102017206461B4 (de) 2017-04-13 2019-05-02 Schott Ag Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks
DE102018201596A1 (de) * 2018-02-02 2019-08-08 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zur direkten Strukturierung mittels Laserstrahlung
KR102797419B1 (ko) 2019-11-25 2025-04-21 삼성전자주식회사 기판 다이싱 방법, 반도체 소자의 제조 방법 및 그들에 의해 제조되는 반도체 칩
JP7564719B2 (ja) * 2021-01-28 2024-10-09 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2022185096A1 (en) 2021-03-03 2022-09-09 Uab Altechna R&B Laser beam transforming element
KR20240007769A (ko) * 2021-06-02 2024-01-16 트룸프 레이저-운트 시스템테크닉 게엠베하 공작물의 레이저 가공을 위한 방법 및 장치
CN113866992B (zh) * 2021-09-10 2022-07-12 华中科技大学 一种在太赫兹波段产生无衍射光束的球谐锥透镜
US20240402507A1 (en) * 2021-10-01 2024-12-05 Tekjp, Inc. Narrow beam generation device
CN114678431B (zh) * 2022-03-21 2024-11-26 上海集成电路制造创新中心有限公司 一种光电探测器的制备方法
DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
KR20250091186A (ko) * 2022-08-17 2025-06-20 닐슨 싸이언티픽, 엘엘씨 병렬화된 3차원 반도체 제조

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
TW200914185A (en) * 2002-03-12 2009-04-01 Hamamatsu Photonics Kk Laser processing method

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3531199B2 (ja) * 1994-02-22 2004-05-24 三菱電機株式会社 光伝送装置
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
JP3338927B2 (ja) * 1998-05-22 2002-10-28 住友重機械工業株式会社 レーザ穴あけ加工装置用のデスミア装置及びデスミア方法
JP2000015467A (ja) * 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置
JP2000288766A (ja) * 1999-04-07 2000-10-17 Kubota Corp レーザ加工装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
US6720522B2 (en) * 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びｔｆｔ基板のレーザアニール方法
FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
JP4440036B2 (ja) * 2004-08-11 2010-03-24 株式会社ディスコ レーザー加工方法
JP4692717B2 (ja) * 2004-11-02 2011-06-01 澁谷工業株式会社 脆性材料の割断装置
JP4222296B2 (ja) * 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
JP5013699B2 (ja) * 2005-10-21 2012-08-29 株式会社キーエンス ３次元加工データ設定装置、３次元加工データ設定方法、３次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置
DE102007018400B4 (de) * 2007-04-17 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches System für einen Lasermaterialbearbeitungskopf
JP5328209B2 (ja) * 2007-06-15 2013-10-30 三菱電機株式会社 基板加工方法
DE102007044298B3 (de) * 2007-09-17 2009-02-26 Coherent Gmbh Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt
JP5098665B2 (ja) * 2008-01-23 2012-12-12 株式会社東京精密 レーザー加工装置およびレーザー加工方法
JP5074272B2 (ja) * 2008-04-15 2012-11-14 株式会社リンクスタージャパン 脆性材料基板の加工装置および切断方法
DE102010016628A1 (de) * 2010-02-26 2011-09-29 Reis Group Holding Gmbh & Co. Kg Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien
JP4948629B2 (ja) * 2010-07-20 2012-06-06 ウシオ電機株式会社 レーザリフトオフ方法
GB201014778D0 (en) * 2010-09-06 2010-10-20 Baird Brian W Picosecond laser beam shaping assembly and a method of shaping a picosecond laser beam
KR101298019B1 (ko) * 2010-12-28 2013-08-26 (주)큐엠씨 레이저 가공 장치
DE102011000768B4 (de) 2011-02-16 2016-08-18 Ewag Ag Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung
US8871613B2 (en) * 2012-06-18 2014-10-28 Semiconductor Components Industries, Llc Semiconductor die singulation method
JP5832412B2 (ja) * 2012-11-12 2015-12-16 三菱重工業株式会社 光学系及びレーザ加工装置
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9676167B2 (en) * 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9517963B2 (en) * 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
TW200914185A (en) * 2002-03-12 2009-04-01 Hamamatsu Photonics Kk Laser processing method

Also Published As

Publication number Publication date
KR102318041B1 (ko) 2021-10-27
KR20170028426A (ko) 2017-03-13
EP3169475A1 (de) 2017-05-24
TW201613710A (en) 2016-04-16
CN107073655B (zh) 2020-01-14
LT3169475T (lt) 2020-03-10
ES2774377T3 (es) 2020-07-20
WO2016008768A1 (de) 2016-01-21
DE102014213775A1 (de) 2016-01-21
EP3169475B1 (de) 2019-12-04
JP6804441B2 (ja) 2020-12-23
US20170157700A1 (en) 2017-06-08
CN107073655A (zh) 2017-08-18
PT3169475T (pt) 2020-03-13
JP2017521877A (ja) 2017-08-03
US10821555B2 (en) 2020-11-03
DE102014213775B4 (de) 2018-02-15

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