DE102014213775B4 - Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten - Google Patents

Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten Download PDF

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Publication number
DE102014213775B4
DE102014213775B4 DE102014213775.6A DE102014213775A DE102014213775B4 DE 102014213775 B4 DE102014213775 B4 DE 102014213775B4 DE 102014213775 A DE102014213775 A DE 102014213775A DE 102014213775 B4 DE102014213775 B4 DE 102014213775B4
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Germany
Prior art keywords
substrate
laser
laser beam
extended
along
Prior art date
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Active
Application number
DE102014213775.6A
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German (de)
English (en)
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DE102014213775A1 (de
Inventor
Rico Böhme
Daniel Weber
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INNOLAS SOLUTIONS GmbH
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INNOLAS SOLUTIONS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102014213775.6A priority Critical patent/DE102014213775B4/de
Application filed by INNOLAS SOLUTIONS GmbH filed Critical INNOLAS SOLUTIONS GmbH
Priority to PT157392077T priority patent/PT3169475T/pt
Priority to CN201580049806.2A priority patent/CN107073655B/zh
Priority to EP15739207.7A priority patent/EP3169475B1/de
Priority to ES15739207T priority patent/ES2774377T3/es
Priority to US15/325,859 priority patent/US10821555B2/en
Priority to JP2017522729A priority patent/JP6804441B2/ja
Priority to PCT/EP2015/065476 priority patent/WO2016008768A1/de
Priority to KR1020177003422A priority patent/KR102318041B1/ko
Priority to LTEP15739207.7T priority patent/LT3169475T/lt
Priority to TW104122499A priority patent/TWI688444B/zh
Publication of DE102014213775A1 publication Critical patent/DE102014213775A1/de
Application granted granted Critical
Publication of DE102014213775B4 publication Critical patent/DE102014213775B4/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
DE102014213775.6A 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten Active DE102014213775B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
KR1020177003422A KR102318041B1 (ko) 2014-07-15 2015-07-07 2차원의 결정질 기판, 특히 반도체 기판의 레이저 기반 가공을 위한 방법 및 장치
EP15739207.7A EP3169475B1 (de) 2014-07-15 2015-07-07 Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten
ES15739207T ES2774377T3 (es) 2014-07-15 2015-07-07 Procedimiento y dispositivo de mecanización basada en láser de sustratos cristalinos planos, especialmente sustratos semiconductores
US15/325,859 US10821555B2 (en) 2014-07-15 2015-07-07 Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates
JP2017522729A JP6804441B2 (ja) 2014-07-15 2015-07-07 平面結晶性基板、特に半導体基板のレーザ加工方法及び装置
PT157392077T PT3169475T (pt) 2014-07-15 2015-07-07 Método e dispositivo para trabalhar à base de laser substratos cristalinos planos, em particular, substratos semicondutores
CN201580049806.2A CN107073655B (zh) 2014-07-15 2015-07-07 基于激光加工平面晶体衬底的方法和设备
LTEP15739207.7T LT3169475T (lt) 2014-07-15 2015-07-07 Būdas ir įrenginys dviejų dimensijų kristalinių padėklų, ypatingai puslaidininkinių padėklų, lazeriniu pagrindu veikiančiam apdirbimui
PCT/EP2015/065476 WO2016008768A1 (de) 2014-07-15 2015-07-07 Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten
TW104122499A TWI688444B (zh) 2014-07-15 2015-07-13 平面晶體基板特別是半導體基板之以雷射為主之機器加工方法與裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten

Publications (2)

Publication Number Publication Date
DE102014213775A1 DE102014213775A1 (de) 2016-01-21
DE102014213775B4 true DE102014213775B4 (de) 2018-02-15

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Country Status (11)

Country Link
US (1) US10821555B2 (enExample)
EP (1) EP3169475B1 (enExample)
JP (1) JP6804441B2 (enExample)
KR (1) KR102318041B1 (enExample)
CN (1) CN107073655B (enExample)
DE (1) DE102014213775B4 (enExample)
ES (1) ES2774377T3 (enExample)
LT (1) LT3169475T (enExample)
PT (1) PT3169475T (enExample)
TW (1) TWI688444B (enExample)
WO (1) WO2016008768A1 (enExample)

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EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6755707B2 (ja) * 2016-05-12 2020-09-16 株式会社ディスコ レーザー加工装置
LT3311947T (lt) 2016-09-30 2019-12-27 Corning Incorporated Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
DE102017206461B4 (de) 2017-04-13 2019-05-02 Schott Ag Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks
DE102018201596A1 (de) * 2018-02-02 2019-08-08 Forschungsverbund Berlin E.V. Verfahren und Vorrichtung zur direkten Strukturierung mittels Laserstrahlung
KR102797419B1 (ko) 2019-11-25 2025-04-21 삼성전자주식회사 기판 다이싱 방법, 반도체 소자의 제조 방법 및 그들에 의해 제조되는 반도체 칩
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CN113866992B (zh) * 2021-09-10 2022-07-12 华中科技大学 一种在太赫兹波段产生无衍射光束的球谐锥透镜
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CN114678431B (zh) * 2022-03-21 2024-11-26 上海集成电路制造创新中心有限公司 一种光电探测器的制备方法
DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
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Also Published As

Publication number Publication date
KR102318041B1 (ko) 2021-10-27
TWI688444B (zh) 2020-03-21
KR20170028426A (ko) 2017-03-13
EP3169475A1 (de) 2017-05-24
TW201613710A (en) 2016-04-16
CN107073655B (zh) 2020-01-14
LT3169475T (lt) 2020-03-10
ES2774377T3 (es) 2020-07-20
WO2016008768A1 (de) 2016-01-21
DE102014213775A1 (de) 2016-01-21
EP3169475B1 (de) 2019-12-04
JP6804441B2 (ja) 2020-12-23
US20170157700A1 (en) 2017-06-08
CN107073655A (zh) 2017-08-18
PT3169475T (pt) 2020-03-13
JP2017521877A (ja) 2017-08-03
US10821555B2 (en) 2020-11-03

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