JP6804441B2 - 平面結晶性基板、特に半導体基板のレーザ加工方法及び装置 - Google Patents

平面結晶性基板、特に半導体基板のレーザ加工方法及び装置 Download PDF

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Publication number
JP6804441B2
JP6804441B2 JP2017522729A JP2017522729A JP6804441B2 JP 6804441 B2 JP6804441 B2 JP 6804441B2 JP 2017522729 A JP2017522729 A JP 2017522729A JP 2017522729 A JP2017522729 A JP 2017522729A JP 6804441 B2 JP6804441 B2 JP 6804441B2
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Prior art keywords
substrate
laser
laser beam
focal plane
optical arrangement
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Japanese (ja)
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JP2017521877A5 (enExample
JP2017521877A (ja
Inventor
リコ ベーメ
リコ ベーメ
ダニエル ヴェーバー
ダニエル ヴェーバー
Original Assignee
イノラス ソリューションズ ゲーエムベーハー
イノラス ソリューションズ ゲーエムベーハー
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2017522729A 2014-07-15 2015-07-07 平面結晶性基板、特に半導体基板のレーザ加工方法及び装置 Active JP6804441B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014213775.6 2014-07-15
DE102014213775.6A DE102014213775B4 (de) 2014-07-15 2014-07-15 Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
PCT/EP2015/065476 WO2016008768A1 (de) 2014-07-15 2015-07-07 Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen, kristallinen substraten, insbesondere von halbleitersubstraten

Publications (3)

Publication Number Publication Date
JP2017521877A JP2017521877A (ja) 2017-08-03
JP2017521877A5 JP2017521877A5 (enExample) 2019-11-14
JP6804441B2 true JP6804441B2 (ja) 2020-12-23

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JP2017522729A Active JP6804441B2 (ja) 2014-07-15 2015-07-07 平面結晶性基板、特に半導体基板のレーザ加工方法及び装置

Country Status (11)

Country Link
US (1) US10821555B2 (enExample)
EP (1) EP3169475B1 (enExample)
JP (1) JP6804441B2 (enExample)
KR (1) KR102318041B1 (enExample)
CN (1) CN107073655B (enExample)
DE (1) DE102014213775B4 (enExample)
ES (1) ES2774377T3 (enExample)
LT (1) LT3169475T (enExample)
PT (1) PT3169475T (enExample)
TW (1) TWI688444B (enExample)
WO (1) WO2016008768A1 (enExample)

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EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
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US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
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EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
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Also Published As

Publication number Publication date
KR102318041B1 (ko) 2021-10-27
TWI688444B (zh) 2020-03-21
KR20170028426A (ko) 2017-03-13
EP3169475A1 (de) 2017-05-24
TW201613710A (en) 2016-04-16
CN107073655B (zh) 2020-01-14
LT3169475T (lt) 2020-03-10
ES2774377T3 (es) 2020-07-20
WO2016008768A1 (de) 2016-01-21
DE102014213775A1 (de) 2016-01-21
EP3169475B1 (de) 2019-12-04
US20170157700A1 (en) 2017-06-08
CN107073655A (zh) 2017-08-18
PT3169475T (pt) 2020-03-13
JP2017521877A (ja) 2017-08-03
US10821555B2 (en) 2020-11-03
DE102014213775B4 (de) 2018-02-15

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