TWI720639B - 切割半導體材料的方法及鐳射切割裝置 - Google Patents
切割半導體材料的方法及鐳射切割裝置 Download PDFInfo
- Publication number
- TWI720639B TWI720639B TW108136049A TW108136049A TWI720639B TW I720639 B TWI720639 B TW I720639B TW 108136049 A TW108136049 A TW 108136049A TW 108136049 A TW108136049 A TW 108136049A TW I720639 B TWI720639 B TW I720639B
- Authority
- TW
- Taiwan
- Prior art keywords
- pulse
- laser beam
- laser
- pulses
- semiconductor material
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 238000003698 laser cutting Methods 0.000 title claims description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 230000010287 polarization Effects 0.000 claims description 14
- 235000012431 wafers Nutrition 0.000 description 42
- 238000012545 processing Methods 0.000 description 10
- 238000002679 ablation Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000011218 segmentation Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 206010068150 Acoustic shock Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0007—Applications not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
一種通過使用鐳射能量照射半導體材料來切割所述半導體材料的方法,包括:提供鐳射源,所述鐳射源被適配為發射連續雷射光束脈衝,每個雷射光束脈衝的脈衝寬度為100皮秒或更小;從所述鐳射源發射雷射光束脈衝,引導所發射的雷射光束脈衝照射待切割的半導體材料;以及相對於照射雷射光束脈衝移動所述半導體材料,以便沿切割線切割所述半導體材料。由脈衝重複頻率在0.1GHz至5000GHz的範圍內的多個雷射光束脈衝照射所述半導體材料。
Description
本發明涉及一種切割半導體材料的方法和鐳射切割裝置。
分割和劃片是半導體行業中眾所周知的技術,在半導體行業中,切割機用於加工工件或襯底(如半導體晶片),所述工件或襯底例如可以包括矽,但不限於此。貫穿本說明書,術語“晶片”用於包含所有這些產品。在分割(例如也被稱為切片、切斷、劈開)技術中,完全切穿晶片,如將晶片分割成單獨晶片。在劃片(例如也被稱為開槽、刻痕、刨削或開溝)技術中,將溝道或溝槽切割成晶片。接著,可以應用其他技術,例如,通過沿著切割溝道使用機械鋸來進行的完整分割。可替代地或附加地,可以使用鑽孔技術在晶片上形成孔。貫穿本說明書,術語“切割”將用於包含分割、劃片和鑽孔。
然而,半導體技術小型化的總體趨勢是減小晶片的厚度,並且隨著晶片厚度的減小,已經表明,與使用機械鋸相比,雷射技術在分割方面變得更加有利。與機械對應技術(如鑽孔和鋸切)相比,將大功率鐳射用於此類材料加工具有顯著優勢,並且鐳射加工在應對小巧而精緻的工件方面具有良好的通用性。
半導體材料的鐳射去除由於雷射光束聚焦的較小區域的溫度快速增加而發生,從而使局部材料熔化、劇烈沸騰、蒸發和燒蝕。鐳射分割面臨挑戰包括加工產量和工件(晶片)品質之間的微妙平衡。鐳射參數(如能量密度、脈衝寬度、重複率、偏振以及偏振分佈、波前形狀以及其相位修正和波長)決定了加工品質和產量。例如在WO 1997/029509 A1中,已經提出了使用多光束鐳射切割方法,其中聚焦雷射光束(其可以以線性鐳射光斑陣列排列)的線性簇用於沿著劃片線對襯底材料進行燒蝕,從而沿著燒蝕線對襯底進行照射刻痕。以這種方式使用多光束而不是單個(功率更大)光束可以提供各種優點,特別是降低了在切割過程中產生的缺陷密度。
鐳射加工品質的定量評估之一是晶片或晶片斷裂強度,其決定晶片斷裂時的拉應力。單軸撓曲測試通常用於測定脆性材料的斷裂強度並且已被用於測量晶片強度。這些測試包括通常用於測量斷裂強度的三點彎曲測試和四點彎曲測試。
據信,通過鐳射分離的晶片的斷裂強度取決於在晶片中進行鐳射分割技術後出現的鐳射誘發缺陷(如微裂紋和切屑)的程度。這些缺陷由主體半導體材料和局部鐳射加工區之間的介面處的高應力產生。所述高應力是由於在晶片的加工側的壁的技術和化學轉變期間出現的聲衝擊波引起的主體和受加工區之間的高的溫度梯度而產生的。包含此類缺陷的半導體材料區域通常被稱為“熱影響區”。晶片的前側和後側的斷裂強度通常不同,並且事實上,存在可以使後側和上側強度顯著不同的技術、技術和晶片佈局。
超短脈衝(“USP”)鐳射的最新進展使晶片加工能夠進行的更加精確,由於那些鐳射的時間脈衝寬度比固體中電子
-聲子弛豫的典型時間短,造成光激發電子到晶格的熱傳遞,所以小於1-10ps的脈衝寬度取決於被加工的特定材料。USP鐳射雖然可以提高材料的晶片強度,但使用這類USP鐳射的晶片加工系統的生產率由於各種原因(例如包括熱擴散誘發交互體積較小)而降低了。
為了提高鐳射加工速度並且由此提高生產率,提出了對雷射脈衝裝置,在此裝置中,存在由鐳射源發射的雷射脈衝的兩個重複週期或“脈衝串”,使得連續脈衝之間的時間t1短於連續脈衝串之間的時間t2(即連續脈衝串的第一脈衝p1之間的時間),但是長於雷射脈衝寬度△τ。脈衝串是在週期t2內分組的整數(n)個雷射脈衝pn。
已經表明,與使用單獨雷射脈衝的技術相比,使用重複頻率(即1/t1)為大約數十兆赫(約10000至90000kHz)的超短雷射脈衝串進行的切片能更有效地去除材料。然而,與使用單個脈衝相比,具有這些重複頻率的脈衝產生的熱負荷使晶片強度降低。
已經表明,脈衝串模式裝置可以提高生產率。然而,該提高導致分割的半導體晶片的晶片強度減小到以下程度:使用此方法生產的晶片可能不符合當前市場需求。已經表明,晶片強度由於累積效應(材料中損傷和溫度累積的累積效應)而大幅降低。
本發明旨在提供一種改進的鐳射切割方法,其提高了晶片或晶片強度並且還提高了生產率。
根據本發明,該目的通過實施具有相當高的脈衝重複頻率的雷射脈衝的脈衝串序列實現。
使用脈衝重複頻率在0.1GHz(100MHz)至5000GHz(5THz)的範圍內的脈衝串模式連同所謂的“燒蝕冷卻”效應進一步有利於提高材料去除效率,在“燒蝕冷卻”效應中,在開始通過熱擴散將熱量從熔化材料區域有效傳遞到本體之前燒蝕較熱材料,使材料的淨溫度降低或至少使材料的淨溫度不會大幅增加。已經發現,使用脈衝重複頻率在此範圍內的雷射脈衝的脈衝串對半導體晶片進行劃片,提高了生產率(即材料去除效率更高)和晶片強度。晶片強度取決於兩個因素。
i)必須按比例縮小每個脈衝串中的單脈衝的能量,使得脈衝串中的單獨脈衝的總能量等於某個最優單脈衝能量,因此,顯著地抑制雷射脈衝撞擊目標時產生的鐳射誘發衝擊波的強度。衝擊波是缺陷形成的原因之一並且因此降低了晶片強度。
ii)通過燒蝕冷卻機制抑制了熱擴散,使得熱影響區(影響晶片強度的關鍵因素之一)的尺寸減小。更詳細地,通過有效地將脈衝串期間的一系列雷射脈衝的能量轉換成材料燒蝕,而不是產生衝擊波和不希望的到材料主體的熱傳輸而減小了目標的熱負荷。熱負荷的減小反過來減小了再固化的鐳射照射區,從而使材料結構缺陷的產生和裂縫的形成最小化。
此外,這種方法具有靈活性,例如在使用偏振和多光束裝置、波束成形以及各個單脈衝的能量調整(脈衝串成形)方面具有靈活性。這種靈活性允許對工藝進行優化調整以實現特定目的。
因此,與使用脈衝重複頻率為MHz和kHz的脈衝串模式相比,使用脈衝重複頻率在100MHz至5THz的脈衝串模式可以提高半導體器件的鐳射劃片工藝的生產率和晶片強度。
根據本發明的第一態樣,提供了一種通過使用鐳射
能量照射半導體材料來切割所述半導體材料的方法,包括以下步驟:i)提供鐳射源,所述鐳射源被適配為發射連續雷射光束脈衝;ii)從所述鐳射源發射雷射光束脈衝;iii)引導所發射的雷射光束脈衝照射待切割的半導體材料;以及iv)相對於照射雷射光束脈衝移動所述半導體材料,以便沿切割線切割所述半導體材料;其中,所述鐳射源被適配為發射脈衝寬度為100皮秒或更小的雷射光束脈衝,並且在步驟iii)中,由脈衝重複頻率在0.1GHz至5000GHz的範圍內的多個雷射光束脈衝照射所述半導體材料。
有利地,所述多個雷射光束脈衝以至少兩個連續脈衝串發射,每個脈衝串包括多個雷射光束脈衝,儘管這對於本發明來說不是必須的。
根據本發明的第二態樣,提供了一種用於執行第一態樣的方法的鐳射切割裝置。
根據本發明的協力廠商面,提供了一種用於切割半導體材料的鐳射切割裝置,包括:鐳射源,所述鐳射源被適配為發射連續雷射光束脈衝,每個雷射光束脈衝的脈衝寬度為100皮秒或更小;雷射光束引導元件,所述雷射光束引導元件用於引導來自所述鐳射源的所述雷射光束脈衝照射待切割的半導體材料;以及驅動元件,所述驅動元件用於相對移動所述半導體材料以及所述照射雷射光束脈衝。
在所附申請專利範圍中闡述了本發明的其他具體
態樣和特徵。
10:鐳射切割裝置
11:晶片
13:卡盤
14:驅動器
15:超短脈衝鐳射源
16:雷射光束
17:反射鏡
18:衰減器/光閥
19:電動半波片
20:反射鏡
21:光束擴展器
22:衍射光學元件
23:透鏡
24:反射鏡
25:反射鏡
26:空間濾波器
27:透鏡
28:反射鏡
29:透鏡
圖1示意性地示出了串雷射脈衝時序安排。
圖2示意性地示出了根據本發明一種實施例的鐳射切割裝置。
現在將參照圖1描述本發明,圖1示意性地示出了輸出雷射光束輪廓(例如可以由脈衝鐳射源發射的輸出雷射光束輪廓),其包括多個雷射光束脈衝。在圖1中,在強度(y軸)對時間(x軸)的關係曲線圖中示出了兩個連續脈衝串(即脈衝串x和隨後的脈衝串x+1)。為了簡單和一般性起見,強度以任意單位(a.u.)表示。
多個雷射光束脈衝中的每個雷射光束脈衝具有相應的脈衝能量,並且雖然在圖1中沒有示出,但是可以可選地控制鐳射源,使得多個雷射光束脈衝中的第一雷射光束脈衝的脈衝能量不同於多個雷射光束脈衝中的第二雷射光束脈衝的脈衝能量。如所示出的,存在雷射光束脈衝的兩個連續重複週期或脈衝串(脈衝串x、脈衝串x+1),使得連續脈衝之間的時間t1短於連續脈衝串的第一脈衝p1之間的時間t2,但是長於雷射脈衝寬度△τ。根據本發明,雷射光束脈衝寬度△τ為100皮秒或更小。
脈衝串是在週期t2內分組的整數(n)個雷射脈衝pn。脈衝重複頻率或脈衝串內頻率(即脈衝串內的雷射光束脈衝的頻率)由1/t1給出。脈衝串間頻率(即連續脈衝串(脈衝串x、脈衝串x+1)內的第一雷射光束脈衝p1的出現頻率)由1/t2給出。第一脈衝串x的最後一個脈衝pn與下一脈衝串x+1的第一脈衝p1相隔
時間段t3。應注意的是,如果t3=t1,則脈衝串x和x+1在該圖上沒有區別,並且會出現僅一個不間斷的脈衝串。雖然在圖1中示出了兩個脈衝串x和x+1,但可以使用從單脈衝串至連續應用脈衝串的任何數量的脈衝串來應用本發明。如圖1中所示出的,每個脈衝串中的脈衝的強度和頻率相似,但如下文所闡述的,其他實施例可以具有不同的脈衝或脈衝串輪廓。
根據本發明的具體實施例:
i)脈衝串內的多個雷射光束脈衝的脈衝重複頻率1/t1在100MHz(0.1GHz)至5THz(5000GHz)的範圍內,並且可選地在500MHz(0.5GHz)至50GHz的範圍內,並且脈衝寬度△τ在100ps以下;ii)多個雷射光束脈衝以至少一個脈衝串發射,優選地以至少兩個連續脈衝串發射,每個脈衝串包括多個雷射光束脈衝;iii)每個脈衝串可以包括2至100000個雷射光束脈衝(即n在2至100000的範圍內);可選地,每個脈衝串可以包括2至1000個雷射光束脈衝;iv)脈衝串間頻率1/t2(即連續脈衝串內的第一雷射光束脈衝的頻率)在0.1kHz至1000kHz的範圍內;可選地,脈衝串間頻率1/t2在1kHz至100kHz的範圍內;v)脈衝串的最後一個雷射光束脈衝和隨後脈衝串的第一個雷射光束脈衝間隔時間段t3,時間段t3在10ms至1μs的範圍內。
圖2示意性地示出了適用於執行本發明的方法的鐳射切割裝置10。
將半導體材料(在本發明中為半導體晶片11)支撐
在卡盤13上。在使用中,由驅動器14驅動卡盤13以及晶片11,使得晶片11和照射鐳射之間存在相對移動(見下文)。超短脈衝鐳射源15被適配為根據時序安排(如上述時序安排)輸出偏振雷射光束16的脈衝。鐳射源15操作用於輸出脈衝寬度△τ為100皮秒或更小的雷射光束脈衝,即脈衝雷射光束16。由組件將脈衝雷射光束16引導到晶片11上。更詳細地,反射鏡17將光束16到引導衰減器/光閥18上以控制光束。提供了選擇性致動的光學偏振構件(在本發明中呈電動半波片19的形式),所述光學偏振構件能夠選擇性移動以與脈衝雷射光束16進行交互。優選地,半波片19被安裝成圍繞雷射光束軸線旋轉。因此,通過選擇性地旋轉半波片19,可以以切換的方式控制雷射光束16的偏振狀態。通過控制裝置(未示出)(如電腦、處理器或其它類似裝置)對電動機的控制操作來實現選擇性移動。另一反射鏡20將脈衝雷射光束16引導到光束擴展器21上以產生加寬的光束。衍射光學元件(“DOE”)22將加寬的光束衍射或劃分成在空間上分離的輸出子光束的預定圖案,在空間上分離的輸出子光束由透鏡23准直。其他反射鏡24、25將子光束引導至空間濾波器26,空間濾波器26用於形成期望的預定光束圖案。第二透鏡27將子光束引導至另一反射鏡28上,另一反射鏡28反過來將這些子光束引導至聚焦透鏡29上,從而以預定照射點圖案將鐳射聚焦到支撐卡盤13上的晶片11上。通過相對於照射脈衝雷射光束16移動晶片,雷射光束脈衝照射並且因此沿著切割線(未示出)切割晶片11。
根據待切割的半導體材料以及切割操作的類型(如開槽、分割),改變連續脈衝串之間的雷射光束脈衝特徵可能是有利的。例如,通過適當控制鐳射源15,連續脈衝串可能具有
不同的脈衝重複頻率。可替代地或附加地,在連續脈衝串中傳輸的能量可能是不同的,例如通過控制鐳射源,使得第一脈衝串內的脈衝的脈衝能量不同於第二脈衝串或隨後脈衝串內的脈衝的脈衝能量。
可替代地或附加地,例如可以通過選擇性旋轉半波片19來控制所發射的雷射光束脈衝的偏振,使得不同脈衝串的雷射光束脈衝具有不同的雷射光束偏振狀態。例如,脈衝串x的雷射光束脈衝可能具有線性偏振(例如,平行或垂直於切割線的線性偏振),而脈衝串x+1的雷射光束脈衝可能呈線性偏振,其中偏振方向正交於脈衝串x的雷射光束脈衝的偏振方向。例如還可以通過在雷射光束16的路徑中選擇性應用四分之一波片(未示出)使一個或多個脈衝串的雷射光束脈衝呈圓形或橢圓形偏振。
如以上所指出的,DOE 22可以用於將光束16衍射成輸出子雷射光束的預定圖案,該預定圖案連同空間濾波器26在半導體材料上形成照射點的期望預定圖案。可能有利的是針對不同脈衝串創建不同照射點圖案,換句話說,對連續脈衝串的雷射光束脈衝進行劃分,使得與第一脈衝串相關聯的照射點圖案不同於與下一個脈衝串相關聯的照射點圖案。這種效果可以通過多種方式實現,例如通過針對第二脈衝串選擇不同的DOE或通過調整脈衝串之間的空間濾波器26。在此技術的改進中,在連續脈衝串期間分別產生的照射點可能在空間上是分離的,以照射所述半導體材料中的不同切割線。以此方式,第一脈衝串可以用於產生主切割線,而隨後的脈衝串可以用於創建溝渠線,所述溝渠線平行於主切割線延伸,但與主切割線間隔開。
上述實施例僅是示例性的,並且在本發明範圍內的其他可能性和替代方案對本領域的技術人員而言是顯而易見的。
例如,雖然在上述具體實施例中,在保持鐳射光學器件靜止的同時移動半導體材料,使半導體材料與照射雷射光束脈衝之間發生相對移動。而在替代性實施例中,可以通過使半導體材料保持靜止並且移動鐳射和/或鐳射光學器件來提供相對移動,或可替代地可以同時移動半導體材料和鐳射和/或鐳射光學器件。
在上述具體實施例中,通過使用USP鐳射創建單獨雷射光束脈衝。然而,從理論上講,可以使用外部斬束機構來創建單獨脈衝,例如,使用具有依次放置在雷射光束路徑中的多個阻擋元件的快速旋轉輪來創建單獨脈衝。
Claims (12)
- 一種通過使用鐳射能量照射半導體材料來切割所述半導體材料的方法,包括以下步驟:i)提供鐳射源,所述鐳射源被適配為發射連續雷射光束脈衝;ii)從所述鐳射源發射雷射光束脈衝;iii)引導所發射的雷射光束脈衝照射待切割的半導體材料;以及iv)相對於照射雷射光束脈衝移動所述半導體材料,以便沿切割線切割所述半導體材料;其中,所述鐳射源被適配為發射脈衝寬度為100皮秒或更小的雷射光束脈衝,並且在步驟iii)中,由脈衝重複頻率在0.5GHz至50GHz的範圍內的多個雷射光束脈衝照射所述半導體材料;其中所述多個雷射光束脈衝以至少兩個連續脈衝串發射,每個脈衝串包括多個雷射光束脈衝;其中脈衝串間頻率在0.1kHz至1000kHz的範圍內,所述脈衝串間頻率為連續脈衝串內的第一雷射光束脈衝的頻率。
- 如申請專利範圍第1項所述之方法,其中所述多個雷射光束脈衝中的每個雷射光束脈衝具有相應脈衝能量,並且所述方法包括以下步驟:控制所述鐳射源,使得所述多個雷射光束脈衝中的第一雷射光束脈衝的脈衝能量不同於所述多個雷射光束脈衝中的第二雷射光束脈衝的脈衝能量。
- 如申請專利範圍第1項所述之方法,其中每個脈衝串包括2至100000個雷射光束脈衝。
- 如申請專利範圍第3項所述之方法,其中每個脈衝串包括2至1000個雷射光束脈衝。
- 如申請專利範圍第1項所述之方法,其中所述脈衝串間頻 率在1kHz至100kHz的範圍內。
- 如申請專利範圍第1項所述之方法,包括以下步驟:控制所述鐳射源,使得連續脈衝串中傳輸的能量不同。
- 如申請專利範圍第6項所述之方法,其中所述多個雷射光束脈衝中的每個雷射光束脈衝具有相應的脈衝能量,並且所述方法包括以下步驟:控制所述鐳射源,使得第一脈衝串內的脈衝的脈衝能量不同於第二脈衝串內的脈衝的脈衝能量。
- 如申請專利範圍第1項所述之方法,包括以下步驟:控制所述鐳射源,使得連續脈衝串具有不同的脈衝重複頻率。
- 如申請專利範圍第1項所述之方法,包括以下步驟:控制所發射的雷射光束脈衝的偏振,使得不同脈衝串的所述雷射光束脈衝的雷射光束偏振狀態不同。
- 如申請專利範圍第1項所述之方法,其中步驟iii)包括將所述雷射光束脈衝劃分成多個空間上分離的子光束,以在所述半導體材料上產生照射點圖案,並且其中,對連續脈衝串的所述雷射光束脈衝進行劃分,使得與第一脈衝串相關聯的所述照射點圖案不同於與下一個脈衝串相關聯的所述照射點圖案。
- 如申請專利範圍第10項所述之方法,其中在連續脈衝串期間產生的所述照射點分別在空間上分離開,以照射所述半導體材料中的不同切割線。
- 一種用於切割半導體材料的鐳射切割裝置,包括:鐳射源,所述鐳射源被適配為發射連續雷射光束脈衝,每個雷射光束脈衝的脈衝寬度為100皮秒或更小,所述雷射光束脈衝的脈衝重複頻率在0.5GHz至50GHz的範圍內,所述多個雷射光束脈衝以至少兩個連續脈衝串發射,每個脈衝串包括多個雷射光束脈衝;其中脈衝串間頻率在0.1kHz至1000kHz的範圍內,所述脈衝串間頻率 為連續脈衝串內的第一雷射光束脈衝的頻率;雷射光束引導元件,所述雷射光束引導元件用於引導來自所述鐳射源的所述雷射光束脈衝照射待切割的半導體材料;以及驅動元件,所述驅動元件用於相對移動所述半導體材料和照射雷射光束脈衝。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/163,767 | 2018-10-18 | ||
US16/163,767 US10615044B1 (en) | 2018-10-18 | 2018-10-18 | Material cutting using laser pulses |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202015849A TW202015849A (zh) | 2020-05-01 |
TWI720639B true TWI720639B (zh) | 2021-03-01 |
Family
ID=68109245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108136049A TWI720639B (zh) | 2018-10-18 | 2019-10-04 | 切割半導體材料的方法及鐳射切割裝置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US10615044B1 (zh) |
EP (1) | EP3639966B1 (zh) |
JP (1) | JP6935475B2 (zh) |
KR (1) | KR102356121B1 (zh) |
CN (1) | CN111085786B (zh) |
MY (1) | MY195599A (zh) |
PH (1) | PH12019000406A1 (zh) |
PT (1) | PT3639966T (zh) |
SG (1) | SG10201909358UA (zh) |
TW (1) | TWI720639B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210283719A1 (en) * | 2020-03-12 | 2021-09-16 | Rohr, Inc. | Substrate perforation system & method using beamlets |
CN111906455A (zh) * | 2020-08-12 | 2020-11-10 | 英诺激光科技股份有限公司 | 超高频光纤激光器切割材料的设备及其工作方法 |
CN113732486A (zh) * | 2021-09-18 | 2021-12-03 | 苏州大学 | 基于连续-重频脉冲激光的激光辐照加强方法及系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090188901A1 (en) * | 2006-04-10 | 2009-07-30 | Board Of Trustees Of Michigan State University | Laser Material Processing System |
US20100246611A1 (en) * | 2009-03-27 | 2010-09-30 | Electro Scientific Industries, Inc. | Laser micromachining with tailored bursts of short laser pulses |
TW201524651A (zh) * | 2013-12-17 | 2015-07-01 | Corning Inc | 使用超快雷射與光束光學元件的透明材料切割 |
US9129904B2 (en) * | 2011-06-15 | 2015-09-08 | Applied Materials, Inc. | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch |
US20160197015A1 (en) * | 2015-01-05 | 2016-07-07 | Wei-Sheng Lei | Hybrid wafer dicing approach using a polygon scanning-based laser scribing process and plasma etch process |
TWI570880B (zh) * | 2013-11-19 | 2017-02-11 | 柔芬新拿科技公司 | 機/電微晶片及利用叢發超快雷射脈衝製造之方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0820640B1 (en) | 1996-02-09 | 2011-07-13 | Advanced Laser Separation International (ALSI) B.V. | Laser separation of semiconductor elements formed in a wafer of semiconductor material |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
WO2006009818A2 (en) * | 2004-06-18 | 2006-01-26 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US20090011614A1 (en) * | 2004-06-18 | 2009-01-08 | Electro Scientific Industries, Inc. | Reconfigurable semiconductor structure processing using multiple laser beam spots |
DE102005039833A1 (de) * | 2005-08-22 | 2007-03-01 | Rowiak Gmbh | Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen |
CN102006964B (zh) * | 2008-03-21 | 2016-05-25 | Imra美国公司 | 基于激光的材料加工方法和系统 |
JP5724173B2 (ja) * | 2009-11-16 | 2015-05-27 | オムロン株式会社 | レーザ加工装置およびレーザ加工方法 |
WO2011140229A1 (en) * | 2010-05-04 | 2011-11-10 | Esi-Pyrophotonics Lasers Inc. | Method and apparatus for drilling using a series of laser pulses |
US8211731B2 (en) * | 2010-06-07 | 2012-07-03 | Sunpower Corporation | Ablation of film stacks in solar cell fabrication processes |
US20120160814A1 (en) * | 2010-12-28 | 2012-06-28 | Electro Scientific Industries, Inc. | Methods and systems for link processing using laser pulses with optimized temporal power profiles and polarizations |
US8513045B1 (en) * | 2012-01-31 | 2013-08-20 | Sunpower Corporation | Laser system with multiple laser pulses for fabrication of solar cells |
JP2013197108A (ja) * | 2012-03-15 | 2013-09-30 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
CN103506757B (zh) * | 2012-06-19 | 2016-12-21 | 先进科技新加坡有限公司 | 用于将激光对准于工件表面的激光装置和方法 |
US10144088B2 (en) * | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
US9786562B2 (en) * | 2015-04-21 | 2017-10-10 | Asm Technology Singapore Pte Ltd | Method and device for cutting wafers |
JP6664686B2 (ja) * | 2015-10-05 | 2020-03-13 | 国立大学法人埼玉大学 | 基板加工方法及び剥離基板製造方法 |
CN106425112B (zh) * | 2016-11-02 | 2018-11-06 | 国神光电科技(上海)有限公司 | 一种激光划片的方法及系统 |
JP6682146B2 (ja) * | 2016-12-12 | 2020-04-15 | 住友重機械工業株式会社 | レーザパルス切出装置及びレーザ加工方法 |
-
2018
- 2018-10-18 US US16/163,767 patent/US10615044B1/en active Active
-
2019
- 2019-10-01 PT PT192008712T patent/PT3639966T/pt unknown
- 2019-10-01 EP EP19200871.2A patent/EP3639966B1/en active Active
- 2019-10-04 TW TW108136049A patent/TWI720639B/zh active
- 2019-10-07 SG SG10201909358UA patent/SG10201909358UA/en unknown
- 2019-10-14 MY MYPI2019006079A patent/MY195599A/en unknown
- 2019-10-15 CN CN201910977576.6A patent/CN111085786B/zh active Active
- 2019-10-17 KR KR1020190129119A patent/KR102356121B1/ko active IP Right Grant
- 2019-10-17 JP JP2019190262A patent/JP6935475B2/ja active Active
- 2019-10-18 PH PH12019000406A patent/PH12019000406A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090188901A1 (en) * | 2006-04-10 | 2009-07-30 | Board Of Trustees Of Michigan State University | Laser Material Processing System |
US20100246611A1 (en) * | 2009-03-27 | 2010-09-30 | Electro Scientific Industries, Inc. | Laser micromachining with tailored bursts of short laser pulses |
US9129904B2 (en) * | 2011-06-15 | 2015-09-08 | Applied Materials, Inc. | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch |
TWI570880B (zh) * | 2013-11-19 | 2017-02-11 | 柔芬新拿科技公司 | 機/電微晶片及利用叢發超快雷射脈衝製造之方法 |
TW201524651A (zh) * | 2013-12-17 | 2015-07-01 | Corning Inc | 使用超快雷射與光束光學元件的透明材料切割 |
US20160197015A1 (en) * | 2015-01-05 | 2016-07-07 | Wei-Sheng Lei | Hybrid wafer dicing approach using a polygon scanning-based laser scribing process and plasma etch process |
Also Published As
Publication number | Publication date |
---|---|
JP2020065054A (ja) | 2020-04-23 |
EP3639966A1 (en) | 2020-04-22 |
KR102356121B1 (ko) | 2022-01-28 |
EP3639966B1 (en) | 2024-03-27 |
US10615044B1 (en) | 2020-04-07 |
PH12019000406A1 (en) | 2021-04-12 |
PT3639966T (pt) | 2024-04-29 |
TW202015849A (zh) | 2020-05-01 |
KR20200043917A (ko) | 2020-04-28 |
SG10201909358UA (en) | 2020-05-28 |
MY195599A (en) | 2023-02-02 |
CN111085786B (zh) | 2022-04-08 |
US20200126800A1 (en) | 2020-04-23 |
JP6935475B2 (ja) | 2021-09-15 |
CN111085786A (zh) | 2020-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5823490B2 (ja) | 脆性材料のレーザシンギュレーションのための改良された方法及び装置 | |
EP2898982B1 (en) | Method for laser processing of silicon by filamentation of burst ultrafast laser pulses | |
TWI720639B (zh) | 切割半導體材料的方法及鐳射切割裝置 | |
JP2012521889A (ja) | 脆性材料の加工のための改善された方法 | |
JP2004528991A (ja) | レーザーによる部分加工 | |
US9786562B2 (en) | Method and device for cutting wafers | |
JP2004528991A5 (zh) | ||
JP2018523291A (ja) | 半導体加工対象物のスクライブ方法 | |
KR102327249B1 (ko) | 최적화된 레이저 절단 | |
CN107520541B (zh) | 激光切割脆性材料的方法 | |
JP6744624B2 (ja) | 管状脆性部材の分断方法並びに分断装置 | |
KR100648898B1 (ko) | 2개의 레이저를 이용한 웨이퍼의 분할방법 및 장치 | |
KR20180035111A (ko) | 취성 재료 기판의 분단 방법 그리고 분단 장치 | |
JP2020021968A (ja) | 半導体加工対象物のスクライブ方法 | |
JP6787617B2 (ja) | 管状脆性部材の分断方法並びに分断装置 | |
KR20210073374A (ko) | 웨이퍼 가공방법 | |
KR20130142165A (ko) | 발광 소자의 개선된 싱귤레이션 방법 및 장치 |