MY195599A - Material Cutting using Laser Pulses - Google Patents
Material Cutting using Laser PulsesInfo
- Publication number
- MY195599A MY195599A MYPI2019006079A MYPI2019006079A MY195599A MY 195599 A MY195599 A MY 195599A MY PI2019006079 A MYPI2019006079 A MY PI2019006079A MY PI2019006079 A MYPI2019006079 A MY PI2019006079A MY 195599 A MY195599 A MY 195599A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor material
- laser beam
- laser
- beam pulses
- pulses
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 abstract 6
- 230000001678 irradiating effect Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0007—Applications not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
A method of cutting a semiconductor material by irradiating the semiconductor material with laser energy, includes providing a laser source (15) adapted to emit successive pulses of laser beams (16), each laser beam pulse having a pulse width of 100 picoseconds or less, emitting laser beam pulses from the laser source (15), guiding the emitted laser beam pulses to irradiate semiconductor material to be cut, and moving the semiconductor material relative to the irradiating laser beam pulses to cut the semiconductor material along a cutting line. The semiconductor material is irradiated by a plurality of laser beam pulses with a pulse repetition frequency in the range from 0.1 GHz to 5000 GHz. (Fig. 2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/163,767 US10615044B1 (en) | 2018-10-18 | 2018-10-18 | Material cutting using laser pulses |
Publications (1)
Publication Number | Publication Date |
---|---|
MY195599A true MY195599A (en) | 2023-02-02 |
Family
ID=68109245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019006079A MY195599A (en) | 2018-10-18 | 2019-10-14 | Material Cutting using Laser Pulses |
Country Status (10)
Country | Link |
---|---|
US (1) | US10615044B1 (en) |
EP (1) | EP3639966B1 (en) |
JP (1) | JP6935475B2 (en) |
KR (1) | KR102356121B1 (en) |
CN (1) | CN111085786B (en) |
MY (1) | MY195599A (en) |
PH (1) | PH12019000406A1 (en) |
PT (1) | PT3639966T (en) |
SG (1) | SG10201909358UA (en) |
TW (1) | TWI720639B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12064830B2 (en) * | 2020-03-12 | 2024-08-20 | Rohr, Inc. | Substrate perforation system and method using beamlets |
CN111906455A (en) * | 2020-08-12 | 2020-11-10 | 英诺激光科技股份有限公司 | Equipment for cutting material by ultrahigh-frequency fiber laser and working method thereof |
CN113732486A (en) * | 2021-09-18 | 2021-12-03 | 苏州大学 | Laser irradiation strengthening method and system based on continuous-repetition frequency pulse laser |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11503880A (en) | 1996-02-09 | 1999-03-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Laser splitting method for semiconductor device formed on semiconductor material wafer |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
GB2429843B (en) * | 2004-06-18 | 2009-07-08 | Electro Scient Ind Inc | Semiconductor structure processing using multiple laser beam spots |
US20090011614A1 (en) * | 2004-06-18 | 2009-01-08 | Electro Scientific Industries, Inc. | Reconfigurable semiconductor structure processing using multiple laser beam spots |
DE102005039833A1 (en) * | 2005-08-22 | 2007-03-01 | Rowiak Gmbh | Device and method for material separation with laser pulses |
WO2007145702A2 (en) * | 2006-04-10 | 2007-12-21 | Board Of Trustees Of Michigan State University | Laser material processing systems and methods with, in particular, use of a hollow waveguide for broadening the bandwidth of the pulse above 20 nm |
CN105583526B (en) * | 2008-03-21 | 2018-08-17 | Imra美国公司 | Material processing method based on laser and system |
US10307862B2 (en) * | 2009-03-27 | 2019-06-04 | Electro Scientific Industries, Inc | Laser micromachining with tailored bursts of short laser pulses |
JP5724173B2 (en) * | 2009-11-16 | 2015-05-27 | オムロン株式会社 | Laser processing apparatus and laser processing method |
CN102939184A (en) * | 2010-05-04 | 2013-02-20 | Esi-派罗弗特尼克斯雷射股份有限公司 | Method and apparatus for drilling using a series of laser pulses |
US8211731B2 (en) * | 2010-06-07 | 2012-07-03 | Sunpower Corporation | Ablation of film stacks in solar cell fabrication processes |
US20120160814A1 (en) * | 2010-12-28 | 2012-06-28 | Electro Scientific Industries, Inc. | Methods and systems for link processing using laser pulses with optimized temporal power profiles and polarizations |
US9129904B2 (en) * | 2011-06-15 | 2015-09-08 | Applied Materials, Inc. | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch |
US8513045B1 (en) * | 2012-01-31 | 2013-08-20 | Sunpower Corporation | Laser system with multiple laser pulses for fabrication of solar cells |
JP2013197108A (en) * | 2012-03-15 | 2013-09-30 | Disco Abrasive Syst Ltd | Laser processing method for wafer |
CN103506757B (en) * | 2012-06-19 | 2016-12-21 | 先进科技新加坡有限公司 | For by laser alignment in the laser aid of surface of the work and method |
US9517929B2 (en) * | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
US9687936B2 (en) * | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
US20160197015A1 (en) * | 2015-01-05 | 2016-07-07 | Wei-Sheng Lei | Hybrid wafer dicing approach using a polygon scanning-based laser scribing process and plasma etch process |
TWI628027B (en) * | 2015-04-21 | 2018-07-01 | 先進科技新加坡有限公司 | Method and device for cutting wafers |
JP6664686B2 (en) | 2015-10-05 | 2020-03-13 | 国立大学法人埼玉大学 | Substrate processing method and peeled substrate manufacturing method |
CN106425112B (en) * | 2016-11-02 | 2018-11-06 | 国神光电科技(上海)有限公司 | A kind of method and system of laser scribing |
JP6682146B2 (en) * | 2016-12-12 | 2020-04-15 | 住友重機械工業株式会社 | Laser pulse cutting device and laser processing method |
-
2018
- 2018-10-18 US US16/163,767 patent/US10615044B1/en active Active
-
2019
- 2019-10-01 PT PT192008712T patent/PT3639966T/en unknown
- 2019-10-01 EP EP19200871.2A patent/EP3639966B1/en active Active
- 2019-10-04 TW TW108136049A patent/TWI720639B/en active
- 2019-10-07 SG SG10201909358UA patent/SG10201909358UA/en unknown
- 2019-10-14 MY MYPI2019006079A patent/MY195599A/en unknown
- 2019-10-15 CN CN201910977576.6A patent/CN111085786B/en active Active
- 2019-10-17 JP JP2019190262A patent/JP6935475B2/en active Active
- 2019-10-17 KR KR1020190129119A patent/KR102356121B1/en active IP Right Grant
- 2019-10-18 PH PH12019000406A patent/PH12019000406A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20200126800A1 (en) | 2020-04-23 |
CN111085786A (en) | 2020-05-01 |
TW202015849A (en) | 2020-05-01 |
CN111085786B (en) | 2022-04-08 |
PH12019000406A1 (en) | 2021-04-12 |
JP6935475B2 (en) | 2021-09-15 |
SG10201909358UA (en) | 2020-05-28 |
KR102356121B1 (en) | 2022-01-28 |
PT3639966T (en) | 2024-04-29 |
KR20200043917A (en) | 2020-04-28 |
US10615044B1 (en) | 2020-04-07 |
EP3639966B1 (en) | 2024-03-27 |
TWI720639B (en) | 2021-03-01 |
JP2020065054A (en) | 2020-04-23 |
EP3639966A1 (en) | 2020-04-22 |
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