JP2017517158A - プリント回路基板中のビア - Google Patents
プリント回路基板中のビア Download PDFInfo
- Publication number
- JP2017517158A JP2017517158A JP2017514256A JP2017514256A JP2017517158A JP 2017517158 A JP2017517158 A JP 2017517158A JP 2017514256 A JP2017514256 A JP 2017514256A JP 2017514256 A JP2017514256 A JP 2017514256A JP 2017517158 A JP2017517158 A JP 2017517158A
- Authority
- JP
- Japan
- Prior art keywords
- catalytic
- adhesive
- printed circuit
- hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
本願は、2014年5月19日に出願されたプリント基板中のビアと題した米国特許出願第14/281,802号に関連し、その利益及び優先権を主張し、これによってその全体が参照により本願に取り込まれる。
10 誘電性ラミネート材料
11 上部接着剤層
12 底部接着剤層
13 ビア
14 孔
16 銅のパターン化層
17、18 レジストパターン
19 銅のパターン化層
20 銅の領域
25 触媒性接着剤材料
26 孔
Claims (10)
- 孔があけられた誘電性ラミネート材料であって、前記誘電性ラミネート材料は触媒性接着剤で被覆され、触媒性接着剤は前記孔の周りの前記誘電性ラミネート材料の一部も被覆し、前記触媒性接着剤は二酸化ケイ素またはカオリンに被覆された金属からなる触媒性充填材粒子を含む誘電性接着剤である、誘電性ラミネート材料と、
前記誘電性ラミネート材料の両面上の前記触媒性接着剤上のパターン化された金属層であって、前記孔の周りの前記誘電性ラミネート材料の一部を被覆する前記触媒性接着剤の層上の前記パターン化された金属層の一部を含む、パターン化された金属層と、
を備える、プリント回路基板。 - 前記触媒性接着剤が、前記パターン化された金属層によって覆われていない場所から除去されている、請求項1に記載のプリント回路基板。
- 前記触媒性接着剤が、非触媒性及び触媒性充填材粒子を含む誘電性接着剤である、請求項1に記載のプリント回路基板。
- 前記触媒性接着剤が、銅メッキ用の触媒として適している金属からなる触媒性充填材粒子を含む誘電性接着剤である、請求項1に記載のプリント回路基板。
- 前記パターン化された金属層が銅からなる、請求項1に記載のプリント回路基板。
- 前記触媒性接着剤の層が、前記孔の全体を通って延在し、かつ、前記孔の全ての内壁上に延在し、
前記パターン化された金属層が、前記孔の前記内壁上の前記触媒性接着剤によって囲まれた前記孔を通って延在する、請求項1に記載のプリント回路基板。 - 前記パターン化された金属層が、前記孔の前記内壁上の触媒性接着剤層にあけられた第2ドリル孔を通って延在し、前記第2ドリル孔は前記パターン化された金属層が前記誘電材料にあけられた前記孔を通って延在する空間をつくり、前記第2ドリル孔は前記誘電材料にあけられた前記孔よりも小さな直径を有する、請求項6に記載のプリント回路基板。
- 前記パターン化された金属層が前記孔を通って延在する空間を与えるように、前記孔の前記内壁上の前記触媒性接着剤層が十分薄く、前記パターン化された金属層が前記孔の前記内壁上の前記触媒性接着剤層によって囲まれた前記孔を通って延在する、請求項6に記載のプリント回路基板。
- 前記触媒性接着剤層は静電スプレーされた触媒性接着剤である、請求項8に記載のプリント回路基板。
- 前記触媒性充填材粒子は25μよりも小さい、請求項1に記載のプリント回路。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/281,802 US9398703B2 (en) | 2014-05-19 | 2014-05-19 | Via in a printed circuit board |
US14/281,802 | 2014-05-19 | ||
PCT/US2015/014615 WO2015178971A1 (en) | 2014-05-19 | 2015-02-05 | Via in a printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017517158A true JP2017517158A (ja) | 2017-06-22 |
JP6591533B2 JP6591533B2 (ja) | 2019-10-16 |
Family
ID=52629662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017514256A Active JP6591533B2 (ja) | 2014-05-19 | 2015-02-05 | プリント回路基板中のビア |
Country Status (7)
Country | Link |
---|---|
US (2) | US9398703B2 (ja) |
EP (1) | EP3146812B1 (ja) |
JP (1) | JP6591533B2 (ja) |
KR (1) | KR102215572B1 (ja) |
CN (2) | CN106538079B (ja) |
TW (1) | TWI657729B (ja) |
WO (1) | WO2015178971A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017135135A (ja) * | 2016-01-25 | 2017-08-03 | 京セラ株式会社 | 配線基板 |
WO2018035184A1 (en) * | 2016-08-18 | 2018-02-22 | Sierra Circuits, Inc. | Plasma etched catalytic laminate with traces and vias |
US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
US9706650B1 (en) | 2016-08-18 | 2017-07-11 | Sierra Circuits, Inc. | Catalytic laminate apparatus and method |
WO2018089798A1 (en) * | 2016-11-12 | 2018-05-17 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
US9922951B1 (en) | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
JP6941939B2 (ja) | 2016-12-22 | 2021-09-29 | リンテック株式会社 | 検査部材、および検査部材の製造方法 |
US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
US10765012B2 (en) * | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
US11096271B1 (en) | 2020-04-09 | 2021-08-17 | Raytheon Company | Double-sided, high-density network fabrication |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5544476B2 (ja) * | 1975-12-25 | 1980-11-12 | ||
JPS61102796A (ja) * | 1984-10-26 | 1986-05-21 | 日立コンデンサ株式会社 | 印刷配線板の製造方法 |
JPH0570961A (ja) * | 1991-09-17 | 1993-03-23 | Hitachi Chem Co Ltd | 無電解めつき用触媒とその製造法およびその使用方法 |
JPH05160565A (ja) * | 1991-12-06 | 1993-06-25 | Hitachi Chem Co Ltd | 配線板の製造法 |
JPH088513A (ja) * | 1994-06-22 | 1996-01-12 | Sumitomo Metal Mining Co Ltd | プリント配線板の製造方法 |
Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3014818A (en) | 1957-12-09 | 1961-12-26 | Du Pont | Electrically conducting articles and process of making same |
US3259559A (en) | 1962-08-22 | 1966-07-05 | Day Company | Method for electroless copper plating |
US3226256A (en) | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
US3269861A (en) | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
US3322881A (en) | 1964-08-19 | 1967-05-30 | Jr Frederick W Schneble | Multilayer printed circuit assemblies |
US3370974A (en) | 1965-10-20 | 1968-02-27 | Ivan C. Hepfer | Electroless plating on non-conductive materials |
US3799802A (en) | 1966-06-28 | 1974-03-26 | F Schneble | Plated through hole printed circuit boards |
DE1690224B1 (de) | 1967-08-29 | 1971-03-25 | Standard Elek K Lorenz Ag | Bad fuer die stromlose verkupferung von kunststoffplatten |
US4001466A (en) | 1973-11-27 | 1977-01-04 | Formica International Limited | Process for preparing printed circuits |
US3925138A (en) | 1973-11-27 | 1975-12-09 | Formica Int | Process for preparing an insulating substrate for use in printed circuits |
US4287253A (en) | 1975-04-08 | 1981-09-01 | Photocircuits Division Of Kollmorgen Corp. | Catalytic filler for electroless metallization of hole walls |
JPS5288772A (en) * | 1976-01-20 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5335163A (en) * | 1976-09-14 | 1978-04-01 | Hitachi Chemical Co Ltd | Method of producing printed circuit board substrate having through hole from metallic material |
US4167601A (en) | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
US4145460A (en) * | 1977-06-27 | 1979-03-20 | Western Electric Company, Inc. | Method of fabricating a printed circuit board with etched through holes |
JPS5830760B2 (ja) | 1980-10-09 | 1983-07-01 | 株式会社日立製作所 | プリント回路板の製法 |
DE3121015C2 (de) | 1981-05-27 | 1986-12-04 | Friedr. Blasberg GmbH und Co KG, 5650 Solingen | Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben |
US4354895A (en) | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
DE3408630A1 (de) * | 1984-03-09 | 1985-09-12 | Hoechst Ag, 6230 Frankfurt | Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten |
US4581301A (en) | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
US4585502A (en) * | 1984-04-27 | 1986-04-29 | Hitachi Condenser Co., Ltd. | Process for producing printed circuit board |
US4908242A (en) | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
US4954185A (en) | 1987-01-14 | 1990-09-04 | Kollmorgen Corporation | Method of applying adherent coating on copper |
US4774279A (en) * | 1987-01-14 | 1988-09-27 | Kollmorgen Corporation | Adherent coating for copper |
US5309632A (en) | 1988-03-28 | 1994-05-10 | Hitachi Chemical Co., Ltd. | Process for producing printed wiring board |
US5153987A (en) * | 1988-07-15 | 1992-10-13 | Hitachi Chemical Company, Ltd. | Process for producing printed wiring boards |
JPH0294592A (ja) * | 1988-09-30 | 1990-04-05 | Sony Corp | 配線基板の製造方法 |
JPH0366194A (ja) * | 1989-08-04 | 1991-03-20 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2825558B2 (ja) * | 1989-10-25 | 1998-11-18 | 株式会社日立製作所 | 組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法 |
JP2881963B2 (ja) * | 1990-05-25 | 1999-04-12 | ソニー株式会社 | 配線基板及びその製造方法 |
US5200720A (en) * | 1990-11-27 | 1993-04-06 | Sam Hwa Capacitor Co., Ltd. | Emi bead core filter, process and apparatus thereof |
US5162144A (en) | 1991-08-01 | 1992-11-10 | Motorola, Inc. | Process for metallizing substrates using starved-reaction metal-oxide reduction |
JPH06232558A (ja) * | 1993-02-04 | 1994-08-19 | Toshiba Corp | 多層プリント配線板の製造方法 |
EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
DE19731346C2 (de) | 1997-06-06 | 2003-09-25 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und ein Verfahren zu deren Herstellung |
KR100633678B1 (ko) * | 1998-02-26 | 2006-10-11 | 이비덴 가부시키가이샤 | 필드 바이어 구조를 갖는 다층프린트 배선판 |
JP3100131B1 (ja) * | 1998-09-07 | 2000-10-16 | キヤノン株式会社 | 画像形成装置 |
MY144574A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
DE60045566D1 (de) * | 1999-08-06 | 2011-03-03 | Ibiden Co Ltd | Mehrschicht-Leiterplatte |
EP2053908B1 (en) * | 1999-08-12 | 2011-12-21 | Ibiden Co., Ltd. | Multilayer printed wiring board with a solder resist composition |
US6630743B2 (en) | 2001-02-27 | 2003-10-07 | International Business Machines Corporation | Copper plated PTH barrels and methods for fabricating |
US7334326B1 (en) | 2001-06-19 | 2008-02-26 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded passive components |
JP2003105061A (ja) * | 2001-09-27 | 2003-04-09 | Sanei Kagaku Kk | 光・熱硬化性樹脂組成物、並びに穴詰プリント配線(基)板の製造方法及び穴詰プリント配線(基)板 |
KR100632579B1 (ko) * | 2004-04-07 | 2006-10-09 | 삼성전기주식회사 | 인쇄회로기판의 비아홀 형성방법 |
JP4146826B2 (ja) | 2004-09-14 | 2008-09-10 | カシオマイクロニクス株式会社 | 配線基板及び半導体装置 |
TW200618705A (en) | 2004-09-16 | 2006-06-01 | Tdk Corp | Multilayer substrate and manufacturing method thereof |
US20060068173A1 (en) | 2004-09-30 | 2006-03-30 | Ebara Corporation | Methods for forming and patterning of metallic films |
TWI291382B (en) * | 2004-12-08 | 2007-12-21 | Ind Tech Res Inst | Method of forming a metal thin film with micro holes by ink-jet printing |
JP2007134364A (ja) * | 2005-11-08 | 2007-05-31 | Hitachi Cable Ltd | 多層配線基板の製造方法及び多層配線基板並びにそれを用いた電子装置 |
JP2008218714A (ja) | 2007-03-05 | 2008-09-18 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法 |
EP2162237A4 (en) | 2007-07-02 | 2011-01-12 | 3M Innovative Properties Co | METHOD FOR STRUCTURING A SUBSTRATE |
KR100936078B1 (ko) | 2007-11-12 | 2010-01-12 | 삼성전기주식회사 | 전기부재 및 이를 이용한 인쇄회로기판의 제조방법 |
US8698003B2 (en) * | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
TWI388122B (zh) | 2009-04-20 | 2013-03-01 | Unimicron Technology Corp | 形成複合材料電路板結構的方法 |
TWI392425B (zh) | 2009-08-25 | 2013-04-01 | Unimicron Technology Corp | 內埋式線路板及其製造方法 |
TWI423750B (zh) | 2010-09-24 | 2014-01-11 | Kuang Hong Prec Co Ltd | 非導電性載體形成電路結構之製造方法 |
GB2489042A (en) | 2011-03-18 | 2012-09-19 | Conductive Inkjet Technology Ltd | Photo-patternable structure |
US8784952B2 (en) | 2011-08-19 | 2014-07-22 | Earthone Circuit Technologies Corporation | Method of forming a conductive image on a non-conductive surface |
DE102012216101B4 (de) | 2012-09-12 | 2016-03-24 | Festo Ag & Co. Kg | Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät |
JP2014072324A (ja) * | 2012-09-28 | 2014-04-21 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
-
2014
- 2014-05-19 US US14/281,802 patent/US9398703B2/en active Active
-
2015
- 2015-02-05 WO PCT/US2015/014615 patent/WO2015178971A1/en active Application Filing
- 2015-02-05 JP JP2017514256A patent/JP6591533B2/ja active Active
- 2015-02-05 CN CN201580026648.9A patent/CN106538079B/zh active Active
- 2015-02-05 EP EP15708363.5A patent/EP3146812B1/en active Active
- 2015-02-05 KR KR1020167034800A patent/KR102215572B1/ko active IP Right Grant
- 2015-02-05 CN CN201911338361.6A patent/CN110933874A/zh active Pending
- 2015-05-19 TW TW104115823A patent/TWI657729B/zh active
-
2016
- 2016-06-16 US US15/184,426 patent/US9674967B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5544476B2 (ja) * | 1975-12-25 | 1980-11-12 | ||
JPS61102796A (ja) * | 1984-10-26 | 1986-05-21 | 日立コンデンサ株式会社 | 印刷配線板の製造方法 |
JPH0570961A (ja) * | 1991-09-17 | 1993-03-23 | Hitachi Chem Co Ltd | 無電解めつき用触媒とその製造法およびその使用方法 |
JPH05160565A (ja) * | 1991-12-06 | 1993-06-25 | Hitachi Chem Co Ltd | 配線板の製造法 |
JPH088513A (ja) * | 1994-06-22 | 1996-01-12 | Sumitomo Metal Mining Co Ltd | プリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3146812B1 (en) | 2022-04-06 |
CN106538079A (zh) | 2017-03-22 |
WO2015178971A1 (en) | 2015-11-26 |
KR20170005097A (ko) | 2017-01-11 |
JP6591533B2 (ja) | 2019-10-16 |
TWI657729B (zh) | 2019-04-21 |
KR102215572B1 (ko) | 2021-02-10 |
EP3146812A1 (en) | 2017-03-29 |
CN106538079B (zh) | 2020-01-17 |
US9674967B2 (en) | 2017-06-06 |
TW201607397A (zh) | 2016-02-16 |
CN110933874A (zh) | 2020-03-27 |
US20150334836A1 (en) | 2015-11-19 |
US9398703B2 (en) | 2016-07-19 |
US20160295708A1 (en) | 2016-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6591533B2 (ja) | プリント回路基板中のビア | |
US9706667B2 (en) | Via in a printed circuit board | |
TWI569699B (zh) | 印刷電路板及其製造方法 | |
KR20100070161A (ko) | 인쇄회로기판 및 그 제조방법 | |
KR20120053921A (ko) | 인쇄 회로 기판 및 그 제조 방법 | |
JP2009283739A (ja) | 配線基板および配線基板の製造方法 | |
TWI733655B (zh) | 具有輪廓化導電層的印刷電路板及其製造方法 | |
JP2013168691A (ja) | 印刷回路基板及びそのビアホールの充填方法 | |
JP2008078343A (ja) | プリント配線板及びその製造方法 | |
KR20100002672A (ko) | 인쇄회로기판 제조방법 | |
US11406024B2 (en) | Multi-layer circuit board with traces thicker than a circuit board | |
CN108353510B (zh) | 多层印刷配线基板及其制造方法 | |
KR102361851B1 (ko) | 인쇄 배선판 및 그 제조 방법 | |
KR101987378B1 (ko) | 인쇄회로기판의 제조 방법 | |
JP2007095910A (ja) | 配線基板の製造方法 | |
JP2007067189A (ja) | 配線基板及びその製造方法 | |
JPH036880A (ja) | ブリント配線板及びその製造方法 | |
JP2014072311A (ja) | 多層配線基板及びその製造方法 | |
KR101009118B1 (ko) | 랜드리스 인쇄회로기판의 제조방법 | |
KR101144573B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
JP2005150554A (ja) | 配線基板の製造方法 | |
KR101619068B1 (ko) | 전극 배선 형성 방법 | |
JP2004063641A (ja) | コア基板及びそれを用いたビルドアップ高密度プリント配線板 | |
JP2005277288A (ja) | 回路基板の製造方法および回路基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180118 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190121 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190128 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190426 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190605 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190819 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190918 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6591533 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |