JP2017510997A5 - - Google Patents
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- Publication number
- JP2017510997A5 JP2017510997A5 JP2016561774A JP2016561774A JP2017510997A5 JP 2017510997 A5 JP2017510997 A5 JP 2017510997A5 JP 2016561774 A JP2016561774 A JP 2016561774A JP 2016561774 A JP2016561774 A JP 2016561774A JP 2017510997 A5 JP2017510997 A5 JP 2017510997A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- lighting device
- encapsulant material
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 50
- 239000008393 encapsulating agent Substances 0.000 claims 31
- 238000000034 method Methods 0.000 claims 30
- 239000002775 capsule Substances 0.000 claims 12
- 230000004888 barrier function Effects 0.000 claims 8
- 230000035515 penetration Effects 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 claims 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000005350 fused silica glass Substances 0.000 claims 2
- 239000002654 heat shrinkable material Substances 0.000 claims 2
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920002530 polyetherether ketone Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- -1 polytetrafluoroethylene Polymers 0.000 claims 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 claims 2
- 239000010980 sapphire Substances 0.000 claims 2
- 238000005286 illumination Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461976064P | 2014-04-07 | 2014-04-07 | |
| US61/976,064 | 2014-04-07 | ||
| PCT/US2015/024526 WO2015157178A1 (en) | 2014-04-07 | 2015-04-06 | Ultraviolet light-emitting devices and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017510997A JP2017510997A (ja) | 2017-04-13 |
| JP2017510997A5 true JP2017510997A5 (enExample) | 2018-05-10 |
Family
ID=54210491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016561774A Pending JP2017510997A (ja) | 2014-04-07 | 2015-04-06 | 紫外線発光デバイスおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9293670B2 (enExample) |
| EP (1) | EP3130011A4 (enExample) |
| JP (1) | JP2017510997A (enExample) |
| CN (1) | CN106104821A (enExample) |
| WO (1) | WO2015157178A1 (enExample) |
Families Citing this family (42)
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|---|---|---|---|---|
| WO2014078324A1 (en) | 2012-11-13 | 2014-05-22 | Violet Defense Technology, Inc. | Device for ultraviolet light emission |
| US9412911B2 (en) | 2013-07-09 | 2016-08-09 | The Silanna Group Pty Ltd | Optical tuning of light emitting semiconductor junctions |
| US9293670B2 (en) | 2014-04-07 | 2016-03-22 | Crystal Is, Inc. | Ultraviolet light-emitting devices and methods |
| JP6817072B2 (ja) | 2014-05-27 | 2021-01-20 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd | 光電子デバイス |
| CN106415854B (zh) | 2014-05-27 | 2019-10-01 | 斯兰纳Uv科技有限公司 | 包括n型和p型超晶格的电子装置 |
| WO2015181657A1 (en) | 2014-05-27 | 2015-12-03 | The Silanna Group Pty Limited | Advanced electronic device structures using semiconductor structures and superlattices |
| US11322643B2 (en) | 2014-05-27 | 2022-05-03 | Silanna UV Technologies Pte Ltd | Optoelectronic device |
| JPWO2016190207A1 (ja) | 2015-05-28 | 2018-03-15 | 住友化学株式会社 | Ledデバイス、ledモジュール及び紫外線発光装置 |
| US9540252B1 (en) | 2015-06-08 | 2017-01-10 | Rayvio Corporation | Ultraviolet disinfection system |
| US10246348B2 (en) | 2015-06-08 | 2019-04-02 | Rayvio Corporation | Ultraviolet disinfection system |
| US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
| CN108352434A (zh) * | 2015-11-10 | 2018-07-31 | 亿光电子工业股份有限公司 | 发光二极管装置与其制作方法 |
| US10381523B2 (en) * | 2015-12-30 | 2019-08-13 | Rayvio Corporation | Package for ultraviolet emitting devices |
| US10418517B2 (en) | 2016-02-23 | 2019-09-17 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| WO2017145026A1 (en) | 2016-02-23 | 2017-08-31 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| JP2017157593A (ja) * | 2016-02-29 | 2017-09-07 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法 |
| US10403792B2 (en) | 2016-03-07 | 2019-09-03 | Rayvio Corporation | Package for ultraviolet emitting devices |
| CN111973085B (zh) * | 2016-04-14 | 2022-09-30 | 北京小米移动软件有限公司 | 自主清洁设备 |
| US20180006203A1 (en) * | 2016-07-01 | 2018-01-04 | Rayvio Corporation | Ultraviolet emitting device |
| TWI613254B (zh) | 2016-12-13 | 2018-02-01 | Nanya Plastics Corp | 一種熱固性樹脂組成物 |
| JP2018097351A (ja) * | 2016-12-15 | 2018-06-21 | パナソニックIpマネジメント株式会社 | 発光素子及び発光素子の製造方法 |
| US11942569B2 (en) * | 2017-01-31 | 2024-03-26 | Crystal Is, Inc. | Methods and packages for enhancing reliability of ultraviolet light-emitting devices |
| EP3396725B1 (en) | 2017-04-25 | 2021-01-13 | Nichia Corporation | Light emitting device and method of manufacturing same |
| US12274102B2 (en) * | 2017-06-14 | 2025-04-08 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Package structure |
| CN109087982B (zh) * | 2017-06-14 | 2021-04-30 | 光宝光电(常州)有限公司 | 紫外线发光二极管封装结构及其制造方法 |
| DE102017120385B4 (de) * | 2017-09-05 | 2024-02-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements |
| US10954608B2 (en) | 2017-11-10 | 2021-03-23 | Crystal Is, Inc. | UV-transparent aluminum nitride single crystal having a diameter of 35 mm to 150 mm and a predefined UV transparency metric at a wavelength of 265 nm |
| US11555256B2 (en) | 2018-06-19 | 2023-01-17 | Crystal Is, Inc. | Aluminum nitride crystals having low urbach energy and high transparency to deep-ultraviolet wavelengths |
| JP6899412B2 (ja) * | 2018-07-27 | 2021-07-07 | 住友化学株式会社 | Ledデバイスの製造方法 |
| EP3633716A1 (en) * | 2018-10-05 | 2020-04-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Package with embedded electronic component being encapsulated in a pressureless way |
| US10622514B1 (en) | 2018-10-15 | 2020-04-14 | Silanna UV Technologies Pte Ltd | Resonant optical cavity light emitting device |
| US11462449B2 (en) | 2018-12-26 | 2022-10-04 | Nissan Motor Co., Ltd. | Semiconductor device |
| CN110459663A (zh) * | 2019-06-28 | 2019-11-15 | 广东晶科电子股份有限公司 | 一种led器件及其制作方法 |
| DE112020003863T5 (de) | 2019-08-15 | 2022-05-19 | Crystal Is, Inc. | Durchmessererweiterung von aluminiumnitridkristallen |
| CN110690336B (zh) * | 2019-10-15 | 2020-12-25 | 德润规划设计院(深圳)有限公司 | 一种节能型led照明装置及其制造方法 |
| US20220395597A1 (en) * | 2019-10-22 | 2022-12-15 | Uv Partners, Inc. | Optical properties and methods for uv treatment |
| JP7397687B2 (ja) * | 2020-01-22 | 2023-12-13 | スタンレー電気株式会社 | 深紫外光を発する発光装置及びそれを用いた水殺菌装置 |
| US20210338860A1 (en) | 2020-05-01 | 2021-11-04 | Uv Innovators, Llc | Ultraviolet (uv) light emission device employing visible light for operation guidance, and related methods of use, particularly suited for decontamination |
| US20220077353A1 (en) * | 2020-09-08 | 2022-03-10 | Tek Beng Low | Light emitting diode package having a small light emitting surface |
| US20230129699A1 (en) * | 2021-10-22 | 2023-04-27 | Texas Instruments Incorporated | Ic package with interface region |
| JP7445854B2 (ja) * | 2021-10-27 | 2024-03-08 | 日亜化学工業株式会社 | 発光モジュール |
| JP7779762B2 (ja) * | 2022-02-21 | 2025-12-03 | スタンレー電気株式会社 | 半導体発光装置 |
Family Cites Families (43)
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| US7638346B2 (en) | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
| US6924514B2 (en) * | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
| DE10308866A1 (de) * | 2003-02-28 | 2004-09-09 | Osram Opto Semiconductors Gmbh | Beleuchtungsmodul und Verfahren zu dessen Herstellung |
| JP2005317881A (ja) * | 2004-04-30 | 2005-11-10 | Citizen Electronics Co Ltd | 発光ダイオード |
| US20060138443A1 (en) * | 2004-12-23 | 2006-06-29 | Iii-N Technology, Inc. | Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes |
| US20060171152A1 (en) * | 2005-01-20 | 2006-08-03 | Toyoda Gosei Co., Ltd. | Light emitting device and method of making the same |
| CN101371367B (zh) * | 2005-12-22 | 2010-12-08 | 壳牌可再生能源有限公司 | 光伏器件和封装的方法 |
| US7928462B2 (en) | 2006-02-16 | 2011-04-19 | Lg Electronics Inc. | Light emitting device having vertical structure, package thereof and method for manufacturing the same |
| JP3863174B2 (ja) * | 2006-05-08 | 2006-12-27 | 東芝電子エンジニアリング株式会社 | 発光装置 |
| JP2007311707A (ja) * | 2006-05-22 | 2007-11-29 | Ushio Inc | 紫外線発光素子パッケージ |
| US7804147B2 (en) * | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
| US8080833B2 (en) | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
| JP4915869B2 (ja) * | 2007-10-17 | 2012-04-11 | 日東電工株式会社 | 光半導体装置の製造方法 |
| CA2717676C (en) * | 2008-03-20 | 2017-12-12 | Hoeganaes Ab (Publ) | Ferromagnetic powder composition and method for its production |
| WO2010035206A1 (en) * | 2008-09-25 | 2010-04-01 | Koninklijke Philips Electronics N.V. | Coated light emitting device and method for coating thereof |
| TWI608760B (zh) * | 2008-11-13 | 2017-12-11 | 行家光電有限公司 | 形成螢光粉轉換發光元件之方法 |
| US20100123356A1 (en) * | 2008-11-14 | 2010-05-20 | General Electric Company | Resonance mitigation system and method |
| JP5521325B2 (ja) * | 2008-12-27 | 2014-06-11 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP5278023B2 (ja) * | 2009-02-18 | 2013-09-04 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| DE102009025266B4 (de) * | 2009-06-17 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
| US20110062469A1 (en) * | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Molded lens incorporating a window element |
| US8217406B2 (en) | 2009-12-02 | 2012-07-10 | Abl Ip Holding Llc | Solid state light emitter with pumped nanophosphors for producing high CRI white light |
| DE102009058421A1 (de) * | 2009-12-16 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
| US8299545B2 (en) | 2010-01-28 | 2012-10-30 | International Business Machines Corporation | Method and structure to improve body effect and junction capacitance |
| DE102010011428A1 (de) * | 2010-03-15 | 2011-09-15 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| JP2011204376A (ja) * | 2010-03-24 | 2011-10-13 | Stanley Electric Co Ltd | 半導体発光装置 |
| JP5622494B2 (ja) * | 2010-09-09 | 2014-11-12 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| JP2012138435A (ja) * | 2010-12-27 | 2012-07-19 | Panasonic Corp | 発光素子用パッケージ |
| CN102683543B (zh) * | 2011-03-15 | 2015-08-12 | 展晶科技(深圳)有限公司 | Led封装结构 |
| KR20120108437A (ko) * | 2011-03-24 | 2012-10-05 | 삼성전자주식회사 | 발광소자 패키지 |
| US8962359B2 (en) * | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| EP2587560A1 (en) * | 2011-10-26 | 2013-05-01 | Forschungsverbund Berlin e.V. | Light emitting diode |
| JP5956167B2 (ja) * | 2012-01-23 | 2016-07-27 | スタンレー電気株式会社 | 発光装置、車両用灯具及び発光装置の製造方法 |
| US8896010B2 (en) * | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
| WO2013112435A1 (en) * | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
| JP5883662B2 (ja) * | 2012-01-26 | 2016-03-15 | スタンレー電気株式会社 | 発光装置 |
| US9240524B2 (en) * | 2012-03-05 | 2016-01-19 | Seoul Viosys Co., Ltd. | Light-emitting device and method of manufacturing the same |
| KR20130104628A (ko) * | 2012-03-14 | 2013-09-25 | 서울반도체 주식회사 | Led 조명 모듈 |
| CN103843163A (zh) * | 2012-03-30 | 2014-06-04 | 三菱化学株式会社 | 半导体发光装置和照明装置 |
| JP5874532B2 (ja) * | 2012-05-21 | 2016-03-02 | Nok株式会社 | 殺菌装置 |
| US20140105784A1 (en) * | 2012-10-15 | 2014-04-17 | Sharp Kabushiki Kaisha | Ultraviolet treatment device |
| CN105144345B (zh) | 2013-03-15 | 2018-05-08 | 晶体公司 | 与赝配电子和光电器件的平面接触 |
| US9293670B2 (en) * | 2014-04-07 | 2016-03-22 | Crystal Is, Inc. | Ultraviolet light-emitting devices and methods |
-
2015
- 2015-04-06 US US14/679,655 patent/US9293670B2/en active Active
- 2015-04-06 EP EP15776164.4A patent/EP3130011A4/en not_active Withdrawn
- 2015-04-06 JP JP2016561774A patent/JP2017510997A/ja active Pending
- 2015-04-06 WO PCT/US2015/024526 patent/WO2015157178A1/en not_active Ceased
- 2015-04-06 CN CN201580012926.5A patent/CN106104821A/zh active Pending
-
2016
- 2016-02-16 US US15/044,577 patent/US9548431B2/en not_active Expired - Fee Related
- 2016-12-08 US US15/373,175 patent/US10383963B2/en active Active
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