JP2014072520A5 - - Google Patents

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Publication number
JP2014072520A5
JP2014072520A5 JP2013183677A JP2013183677A JP2014072520A5 JP 2014072520 A5 JP2014072520 A5 JP 2014072520A5 JP 2013183677 A JP2013183677 A JP 2013183677A JP 2013183677 A JP2013183677 A JP 2013183677A JP 2014072520 A5 JP2014072520 A5 JP 2014072520A5
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JP
Japan
Prior art keywords
emitting device
light emitting
electrode
led chip
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013183677A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014072520A (ja
JP6426332B2 (ja
Filing date
Publication date
Priority claimed from KR1020120108580A external-priority patent/KR101901890B1/ko
Application filed filed Critical
Publication of JP2014072520A publication Critical patent/JP2014072520A/ja
Publication of JP2014072520A5 publication Critical patent/JP2014072520A5/ja
Application granted granted Critical
Publication of JP6426332B2 publication Critical patent/JP6426332B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013183677A 2012-09-28 2013-09-05 発光装置 Expired - Fee Related JP6426332B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0108580 2012-09-28
KR1020120108580A KR101901890B1 (ko) 2012-09-28 2012-09-28 발광 장치

Publications (3)

Publication Number Publication Date
JP2014072520A JP2014072520A (ja) 2014-04-21
JP2014072520A5 true JP2014072520A5 (enExample) 2016-10-13
JP6426332B2 JP6426332B2 (ja) 2018-11-21

Family

ID=49231347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013183677A Expired - Fee Related JP6426332B2 (ja) 2012-09-28 2013-09-05 発光装置

Country Status (5)

Country Link
US (1) US9093281B2 (enExample)
EP (1) EP2713411B1 (enExample)
JP (1) JP6426332B2 (enExample)
KR (1) KR101901890B1 (enExample)
CN (1) CN103715190B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140047750A (ko) * 2012-10-09 2014-04-23 엘지이노텍 주식회사 발광 장치
JP2017050445A (ja) * 2015-09-03 2017-03-09 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
US11145795B2 (en) * 2016-05-31 2021-10-12 Citizen Electronics Co., Ltd. Light emitting apparatus and method for manufacturing same
DE202023105049U1 (de) * 2023-09-04 2024-12-09 Tridonic Gmbh & Co Kg Flexibles LED-Band

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JPS5066154U (enExample) * 1973-10-19 1975-06-14
JPS5936980A (ja) * 1983-07-04 1984-02-29 Hitachi Ltd セラミック配線基板とその製造方法
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
US6583444B2 (en) * 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
JP2002313835A (ja) * 2001-04-09 2002-10-25 Oki Electric Ind Co Ltd ボンディングパッド、半導体装置及びワイヤボンディング方法
KR100407051B1 (ko) * 2001-11-16 2003-11-28 삼성전자주식회사 홈네트워크 시스템
KR20040073974A (ko) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 전기도금 조성물
US8125137B2 (en) * 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
JP2008277689A (ja) * 2007-05-07 2008-11-13 C I Kasei Co Ltd 発光装置および発光装置の作製方法
JP2009033088A (ja) * 2007-06-29 2009-02-12 Sharp Corp 半導体発光装置、その製造方法およびそれを用いたｌｅｄ照明装置
JP5171288B2 (ja) * 2008-01-28 2013-03-27 シャープ株式会社 固体撮像装置、固体撮像装置の実装方法、固体撮像装置の製造方法、および電子情報機器
JP4897981B2 (ja) * 2008-12-26 2012-03-14 古河電気工業株式会社 光半導体装置用リードフレーム、その製造方法および光半導体装置
US8138509B2 (en) * 2009-02-27 2012-03-20 Visera Technologies Company, Limited Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate
JP5286122B2 (ja) * 2009-03-23 2013-09-11 スタンレー電気株式会社 半導体発光装置および半導体発光装置の製造方法
JP2011071407A (ja) * 2009-09-28 2011-04-07 Sharp Corp 発光素子および照明装置
JP2011097038A (ja) * 2009-10-02 2011-05-12 Ibiden Co Ltd セラミック配線基板およびその製造方法
JP5375552B2 (ja) * 2009-11-24 2013-12-25 東芝ライテック株式会社 発光装置及びこれを備えた照明器具
CN102074558B (zh) * 2009-10-21 2013-06-19 东芝照明技术株式会社 发光装置以及照明器具
EP2315284A3 (en) * 2009-10-21 2013-03-27 Toshiba Lighting & Technology Corporation Light-Emitting apparatus and luminaire
CN102097425A (zh) * 2009-12-09 2011-06-15 三星Led株式会社 发光二极管、制造磷光体层的方法和发光装置
JP5846408B2 (ja) * 2010-05-26 2016-01-20 東芝ライテック株式会社 発光装置および照明装置
JP4887529B1 (ja) * 2011-04-12 2012-02-29 国立大学法人九州工業大学 Ｌｅｄパッケージの製造方法
US8704262B2 (en) * 2011-08-11 2014-04-22 Goldeneye, Inc. Solid state light sources with common luminescent and heat dissipating surfaces

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