JP2014072520A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2014072520A JP2014072520A JP2013183677A JP2013183677A JP2014072520A JP 2014072520 A JP2014072520 A JP 2014072520A JP 2013183677 A JP2013183677 A JP 2013183677A JP 2013183677 A JP2013183677 A JP 2013183677A JP 2014072520 A JP2014072520 A JP 2014072520A
- Authority
- JP
- Japan
- Prior art keywords
- emitting device
- light emitting
- electrode
- led chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
【解決手段】本発明の実施形態による発光装置は、第1電極及び第2電極を含む基板と、前記第1電極上に配置されるLEDチップと、前記基板上に配置されたダムとを含み、前記ダムは、前記LEDチップから離隔されて配置され、前記基板は、第1銅層、第2銅層及び基板本体を含むDCB基板であり、前記第1電極及び第2電極は、それぞれ表面のボイドを埋める金属被膜を含む。
【選択図】 図2
Description
さらに、前記発光装置は、基板の金属層として金(Au)を使用することができて、発光の変色を抑制することができる。これにより、前記発光装置は光速低下を抑制することができる。すなわち、前記発光装置は、LEDチップ14上に配置された蛍光部16と前記蛍光部16と離隔配置された反射防止用ガラス19を含むことにより、第1及び第2電極パターン12,13にほとんど光が当たらず、反射率が低い金(Au)を基板の金属層にも使用することができる。
2 第1銅層
3 第2銅層
11 DCB基板
12 第1電極パターン
13 第2電極パターン
14 LEDチップ
15 電極パッド
16 蛍光部
17 ボンディングワイヤー
18 隔壁
19 反射防止用ガラス
33 金属ペースト
35 金属被膜
S エンキャップ(Encap)層
Claims (15)
- 第1電極及び第2電極を含む基板と、
前記第1電極上に配置されるLEDチップと、
前記基板上に配置されたダムと、を含み、
前記ダムは、前記LEDチップから離隔されて配置され、
前記基板は、第1銅層、第2銅層及び基板本体を含むDCB基板であり、
前記第1電極及び第2電極は、それぞれ表面のボイドを埋める金属被膜を含む、発光装置。 - 前記金属被膜は、
前記ボイドが存在する表面に所定の金属ペーストを塗布し、前記金属ペーストを乾燥、焼成及び平坦化して形成された、請求項1に記載の発光装置。 - 前記金属被膜は、
Au又はAgのうち少なくとも一つ以上を含む、請求項2に記載の発光装置。 - 前記LEDチップは、前記第1電極の金属被膜上に配置され、
前記LEDチップと前記第1電極の金属被膜は、接着剤により接着される、請求項1ないし3のいずれか一項に記載の発光装置。 - 前記接着剤は、
AuSnを含む、請求項4に記載の発光装置。 - 前記LEDチップと前記第2電極の金属被膜を連結するボンディングワイヤーをさらに含む、請求項1ないし5のいずれか一項に記載の発光装置。
- 前記LEDチップから放出された光を励起させる蛍光部をさらに含み、
前記蛍光部は、前記LEDチップ上に配置される、請求項1ないし6のいずれか一項に記載の発光装置。 - 前記蛍光部は、
シリケート系列、サルファイド系列、YAG系列、TAG系列、Nitride系列のうち少なくとも一つ以上を含む、請求項7に記載の発光装置。 - 前記ダムは、
絶縁物質である、請求項1ないし8のいずれか一項に記載の発光装置。 - 前記ダムの高さは、
前記LEDチップの高さより高い、請求項1ないし9のいずれか一項に記載の発光装置。 - 前記第1電極及び前記第2電極の上側に配置されるエンキャップをさらに含む、請求項1ないし10のいずれか一項に記載の発光装置。
- 前記エンキャップ層は、
光透過性保護樹脂である、請求項11に記載の発光装置。 - 前記第1電極及び前記第2電極上に配置され、前記基板と水平な反射防止用ガラスをさらに含む、請求項1ないし12のいずれか一項に記載の発光装置。
- 第1銅層の表面に配置される腐食防止層をさらに含む、請求項1ないし13のいずれか一項に記載の発光装置。
- 前記ダムは、
半球形、半楕円形、半円形、四角形、上部の隅が面取りされた四角形のいずれか一つの形状を有する、請求項1ないし14のいずれか一項に記載の発光装置。
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JP6426332B2 (ja) | 2018-11-21 |
EP2713411B1 (en) | 2018-10-31 |
KR20140042187A (ko) | 2014-04-07 |
CN103715190A (zh) | 2014-04-09 |
US20140091345A1 (en) | 2014-04-03 |
KR101901890B1 (ko) | 2018-09-28 |
US9093281B2 (en) | 2015-07-28 |
EP2713411A2 (en) | 2014-04-02 |
CN103715190B (zh) | 2018-03-09 |
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