JP2017501578A5 - - Google Patents
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- Publication number
- JP2017501578A5 JP2017501578A5 JP2016540036A JP2016540036A JP2017501578A5 JP 2017501578 A5 JP2017501578 A5 JP 2017501578A5 JP 2016540036 A JP2016540036 A JP 2016540036A JP 2016540036 A JP2016540036 A JP 2016540036A JP 2017501578 A5 JP2017501578 A5 JP 2017501578A5
- Authority
- JP
- Japan
- Prior art keywords
- mask layer
- led die
- layer
- led
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 15
- 229910000679 solder Inorganic materials 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 238000006243 chemical reaction Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000002096 quantum dot Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361917421P | 2013-12-18 | 2013-12-18 | |
| US61/917,421 | 2013-12-18 | ||
| PCT/IB2014/066349 WO2015092579A1 (en) | 2013-12-18 | 2014-11-26 | Reflective solder mask layer for led phosphor package |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017501578A JP2017501578A (ja) | 2017-01-12 |
| JP2017501578A5 true JP2017501578A5 (enExample) | 2018-01-11 |
| JP6542227B2 JP6542227B2 (ja) | 2019-07-10 |
Family
ID=52345473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016540036A Active JP6542227B2 (ja) | 2013-12-18 | 2014-11-26 | Led蛍光体パッケージ用の反射性はんだマスク層 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10204887B2 (enExample) |
| EP (1) | EP3084849B1 (enExample) |
| JP (1) | JP6542227B2 (enExample) |
| KR (1) | KR102305948B1 (enExample) |
| CN (1) | CN105814704A (enExample) |
| WO (1) | WO2015092579A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015092579A1 (en) | 2013-12-18 | 2015-06-25 | Koninklijke Philips N.V. | Reflective solder mask layer for led phosphor package |
| WO2017095712A1 (en) * | 2015-12-02 | 2017-06-08 | Koninklijke Philips N.V. | Led metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields |
| JP2019033160A (ja) * | 2017-08-07 | 2019-02-28 | 株式会社小糸製作所 | 基板および車両用灯具 |
| KR20190019745A (ko) * | 2017-08-18 | 2019-02-27 | 주식회사 루멘스 | 발광소자 및 그 제조방법 |
| US11153976B2 (en) | 2018-05-24 | 2021-10-19 | International Business Machines Corporation | Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper |
| EP3598510B1 (en) * | 2018-07-18 | 2022-02-23 | Lumileds LLC | Light emitting diode device and producing methods thereof |
| CN110737137B (zh) * | 2019-10-31 | 2022-09-13 | 厦门天马微电子有限公司 | Led基板及制作方法、背光模组及显示装置 |
| US20220293824A1 (en) * | 2020-04-17 | 2022-09-15 | Ningbo Sunpu Led Co., Ltd. | Ultraviolet led device |
| CN111490142A (zh) * | 2020-04-17 | 2020-08-04 | 宁波升谱光电股份有限公司 | 一种紫外led器件 |
| CN111640847A (zh) * | 2020-06-01 | 2020-09-08 | 江西兆驰光元科技股份有限公司 | Led显示器件及其制备方法、显示设备 |
| EP4208671A1 (en) | 2020-09-03 | 2023-07-12 | Signify Holding B.V. | A lighting board and luminaire using the lighting board |
| TWI815639B (zh) * | 2022-09-02 | 2023-09-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| TWI871829B (zh) * | 2023-11-13 | 2025-02-01 | 隆達電子股份有限公司 | 光源模組 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6120883A (en) * | 1996-08-19 | 2000-09-19 | Furon Company | Computer printable top coating |
| JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| US6841623B2 (en) * | 2001-06-29 | 2005-01-11 | Bayer Inc. | Low molecular weight nitrile rubber |
| JP2003185813A (ja) | 2001-12-21 | 2003-07-03 | Mitsui Chemicals Inc | 反射体およびその用途 |
| US7368817B2 (en) | 2003-11-10 | 2008-05-06 | Chippac, Inc. | Bump-on-lead flip chip interconnection |
| US8574959B2 (en) | 2003-11-10 | 2013-11-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming bump-on-lead interconnection |
| US20050270755A1 (en) * | 2004-06-04 | 2005-12-08 | Inventec Corporation | Method for preventing pins of semiconductor package from short circuit during soldering |
| JP4996463B2 (ja) * | 2004-06-30 | 2012-08-08 | クリー インコーポレイテッド | 発光デバイスをパッケージするためのチップスケール方法およびチップスケールにパッケージされた発光デバイス |
| JP2008091459A (ja) | 2006-09-29 | 2008-04-17 | Rohm Co Ltd | Led照明装置及びその製造方法 |
| KR20110028307A (ko) * | 2008-05-29 | 2011-03-17 | 크리 인코포레이티드 | 근거리장 영역 혼합을 갖는 광원 |
| WO2009145109A1 (ja) * | 2008-05-29 | 2009-12-03 | 電気化学工業株式会社 | 金属ベース回路基板 |
| KR101039957B1 (ko) * | 2008-11-18 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 디스플레이 장치 |
| KR101064026B1 (ko) | 2009-02-17 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 디바이스 패키지 및 그 제조방법 |
| EP2228841A1 (en) | 2009-03-09 | 2010-09-15 | Ledon Lighting Jennersdorf GmbH | LED module with improved light output |
| US8184230B2 (en) | 2009-05-08 | 2012-05-22 | Honeywell International Inc. | High efficiency backlight assembly for flat panel display assembly and method for the manufacture thereof |
| US20110049545A1 (en) | 2009-09-02 | 2011-03-03 | Koninklijke Philips Electronics N.V. | Led package with phosphor plate and reflective substrate |
| DE112011100376B4 (de) * | 2010-01-29 | 2024-06-27 | Citizen Electronics Co., Ltd. | Verfahren zur herstellung einer licht aussendenden vorrichtung |
| US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| DE102010029368A1 (de) | 2010-05-27 | 2011-12-01 | Osram Opto Semiconductors Gmbh | Elektronische Anordnung und Verfahren zum Herstellen einer elektronischen Anordnung |
| CN102315185A (zh) * | 2010-06-29 | 2012-01-11 | 昆山旭扬电子材料有限公司 | 电子组件模块 |
| WO2012016226A1 (en) * | 2010-07-30 | 2012-02-02 | Bytemobile, Inc. | Systems and methods for video cache indexing |
| JP2012089357A (ja) | 2010-10-20 | 2012-05-10 | Sumitomo Light Metal Ind Ltd | Led照明基板用積層体及びそれを用いたled照明 |
| TWI441361B (zh) * | 2010-12-31 | 2014-06-11 | 英特明光能股份有限公司 | 發光二極體封裝結構及其製造方法 |
| US9461023B2 (en) * | 2011-10-28 | 2016-10-04 | Bridgelux, Inc. | Jetting a highly reflective layer onto an LED assembly |
| JP5673190B2 (ja) | 2011-02-18 | 2015-02-18 | 日亜化学工業株式会社 | 発光装置 |
| EP2500623A1 (en) * | 2011-03-18 | 2012-09-19 | Koninklijke Philips Electronics N.V. | Method for providing a reflective coating to a substrate for a light-emitting device |
| JP5670250B2 (ja) | 2011-04-18 | 2015-02-18 | イビデン株式会社 | Led基板、発光モジュール、発光モジュールを有する機器、led基板の製造方法、発光モジュールの製造方法、及び発光モジュールを有する機器の製造方法 |
| JP2012243846A (ja) * | 2011-05-17 | 2012-12-10 | Sumitomo Chemical Co Ltd | 金属ベース回路基板および発光素子 |
| WO2013001686A1 (ja) * | 2011-06-29 | 2013-01-03 | パナソニック株式会社 | 発光装置 |
| KR101850431B1 (ko) * | 2011-07-07 | 2018-05-31 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 포함하는 조명 시스템 |
| KR101246087B1 (ko) * | 2011-07-08 | 2013-03-21 | 한전원자력연료 주식회사 | 솔레노이드 밸브 박스를 내장한 핵연료 집합체의 성능 검사 테이블 |
| JP2013033843A (ja) * | 2011-08-02 | 2013-02-14 | Sony Corp | 回路基板、回路基板の製造方法、表示装置および電子機器 |
| US20130032211A1 (en) * | 2011-08-03 | 2013-02-07 | National Tsing Hua University | Air Compression System Having Characteristic of Storing Unstable Energy and Method for Controlling the Same |
| KR101142434B1 (ko) * | 2011-09-08 | 2012-05-08 | (주)오비메드 | 조기양막파수 산모에서 비침습적인 양수 내 염증 및 감염의 예측 또는 진단 방법 |
| US8597982B2 (en) * | 2011-10-31 | 2013-12-03 | Nordson Corporation | Methods of fabricating electronics assemblies |
| JP2013135084A (ja) | 2011-12-26 | 2013-07-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法 |
| US8541802B2 (en) * | 2012-01-31 | 2013-09-24 | Bridgelux, Inc. | Phosphor placement in white light emitting diode assemblies |
| US20130264970A1 (en) * | 2012-04-06 | 2013-10-10 | Yew Cheong Kuan | Light emitting diode (led) components and methods for improved light extraction |
| US9383496B2 (en) * | 2012-06-05 | 2016-07-05 | Rambus Delaware Llc | Edge lit lighting assembly with spectrum adjuster |
| US9590155B2 (en) * | 2012-06-06 | 2017-03-07 | Cree, Inc. | Light emitting devices and substrates with improved plating |
| WO2015092579A1 (en) | 2013-12-18 | 2015-06-25 | Koninklijke Philips N.V. | Reflective solder mask layer for led phosphor package |
-
2014
- 2014-11-26 WO PCT/IB2014/066349 patent/WO2015092579A1/en not_active Ceased
- 2014-11-26 EP EP14825437.8A patent/EP3084849B1/en active Active
- 2014-11-26 US US15/103,474 patent/US10204887B2/en active Active
- 2014-11-26 CN CN201480069463.1A patent/CN105814704A/zh active Pending
- 2014-11-26 JP JP2016540036A patent/JP6542227B2/ja active Active
- 2014-11-26 KR KR1020167019152A patent/KR102305948B1/ko active Active
-
2019
- 2019-02-05 US US16/268,097 patent/US11189601B2/en active Active
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