JP2017508833A5 - - Google Patents
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- Publication number
- JP2017508833A5 JP2017508833A5 JP2016549507A JP2016549507A JP2017508833A5 JP 2017508833 A5 JP2017508833 A5 JP 2017508833A5 JP 2016549507 A JP2016549507 A JP 2016549507A JP 2016549507 A JP2016549507 A JP 2016549507A JP 2017508833 A5 JP2017508833 A5 JP 2017508833A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- cmp composition
- poly
- particles
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 17
- 239000002245 particle Substances 0.000 claims 5
- 239000010954 inorganic particle Substances 0.000 claims 4
- 229920001577 copolymer Polymers 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000005498 polishing Methods 0.000 claims 3
- 229920001308 poly(aminoacid) Polymers 0.000 claims 3
- 150000003839 salts Chemical class 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 235000000346 sugar Nutrition 0.000 claims 3
- 229920000805 Polyaspartic acid Polymers 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims 1
- 239000004472 Lysine Substances 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 239000004376 Sucralose Substances 0.000 claims 1
- 229930006000 Sucrose Natural products 0.000 claims 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 claims 1
- 239000012736 aqueous medium Substances 0.000 claims 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 1
- 235000013681 dietary sucrose Nutrition 0.000 claims 1
- 238000002296 dynamic light scattering Methods 0.000 claims 1
- 229930182830 galactose Natural products 0.000 claims 1
- 239000008103 glucose Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920002643 polyglutamic acid Polymers 0.000 claims 1
- 229920000656 polylysine Polymers 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- BAQAVOSOZGMPRM-QBMZZYIRSA-N sucralose Chemical compound O[C@@H]1[C@@H](O)[C@@H](Cl)[C@@H](CO)O[C@@H]1O[C@@]1(CCl)[C@@H](O)[C@H](O)[C@@H](CCl)O1 BAQAVOSOZGMPRM-QBMZZYIRSA-N 0.000 claims 1
- 235000019408 sucralose Nutrition 0.000 claims 1
- 229960004793 sucrose Drugs 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14153454 | 2014-01-31 | ||
| EP14153454.5 | 2014-01-31 | ||
| PCT/IB2015/050454 WO2015114489A1 (en) | 2014-01-31 | 2015-01-21 | A chemical mechanical polishing (cmp) composition comprising a poly(aminoacid) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017508833A JP2017508833A (ja) | 2017-03-30 |
| JP2017508833A5 true JP2017508833A5 (OSRAM) | 2018-03-01 |
Family
ID=50030116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016549507A Pending JP2017508833A (ja) | 2014-01-31 | 2015-01-21 | ポリ（アミノ酸）を含む化学機械研磨（ｃｍｐ）組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20170166778A1 (OSRAM) |
| EP (1) | EP3099756A4 (OSRAM) |
| JP (1) | JP2017508833A (OSRAM) |
| KR (1) | KR20160114709A (OSRAM) |
| CN (1) | CN105934487B (OSRAM) |
| IL (1) | IL246916A0 (OSRAM) |
| SG (1) | SG11201606157VA (OSRAM) |
| TW (1) | TW201538700A (OSRAM) |
| WO (1) | WO2015114489A1 (OSRAM) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6627283B2 (ja) * | 2015-06-30 | 2020-01-08 | 日立化成株式会社 | 研磨液及び研磨方法 |
| WO2017162462A1 (en) * | 2016-03-22 | 2017-09-28 | Basf Se | Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or cobalt alloy comprising substrates |
| JP6957265B2 (ja) * | 2016-09-29 | 2021-11-02 | 花王株式会社 | 研磨液組成物 |
| US12473457B2 (en) | 2017-09-15 | 2025-11-18 | Cmc Materials Llc | Composition for tungsten CMP |
| US10711158B2 (en) * | 2017-09-28 | 2020-07-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them |
| JP7045171B2 (ja) * | 2017-11-28 | 2022-03-31 | 花王株式会社 | 研磨液組成物 |
| CN109971357B (zh) * | 2017-12-27 | 2021-12-07 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN108913038A (zh) * | 2018-06-27 | 2018-11-30 | 东莞市金林自动化机械科技有限公司 | 一种用于金的抛光液及其制备方法 |
| WO2021081153A1 (en) * | 2019-10-22 | 2021-04-29 | Cmc Materials, Inc. | Composition and method for dielectric cmp |
| WO2021081162A1 (en) * | 2019-10-22 | 2021-04-29 | Cmc Materials, Inc. | Composition and method for silicon oxide and carbon doped silicon oxide cmp |
| KR102859110B1 (ko) * | 2020-01-07 | 2025-09-12 | 씨엠씨 머티리얼즈 엘엘씨 | 유도체화된 폴리아미노산 |
| KR102866377B1 (ko) * | 2022-01-28 | 2025-09-29 | 삼성에스디아이 주식회사 | 구리 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4744656B2 (ja) * | 1998-10-08 | 2011-08-10 | 日立化成工業株式会社 | Ｃｍｐ研磨剤及び基板の研磨方法 |
| JP2000109810A (ja) * | 1998-10-08 | 2000-04-18 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| US6319096B1 (en) * | 1999-11-15 | 2001-11-20 | Cabot Corporation | Composition and method for planarizing surfaces |
| JP2002110596A (ja) * | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法 |
| US7279119B2 (en) * | 2001-06-14 | 2007-10-09 | Ppg Industries Ohio, Inc. | Silica and silica-based slurry |
| US20030211747A1 (en) * | 2001-09-13 | 2003-11-13 | Nyacol Nano Technologies, Inc | Shallow trench isolation polishing using mixed abrasive slurries |
| KR100511943B1 (ko) * | 2003-05-22 | 2005-09-01 | 한화석유화학 주식회사 | 화학·기계 연마용 산화세륨 초미립자 농축액 및 이의제조방법 |
| KR100637772B1 (ko) * | 2004-06-25 | 2006-10-23 | 제일모직주식회사 | 반도체 ｓｔｉ 공정용 고선택비 ｃｍｐ 슬러리 조성물 |
| KR100548132B1 (ko) * | 2004-07-02 | 2006-02-02 | 삼성전자주식회사 | 멀티밴드-호핑 통신시스템에서 수신기의 ｄｃ 오프셋보정장치 및 방법 |
| CN102965025B (zh) * | 2005-11-11 | 2014-10-29 | 日立化成株式会社 | 氧化硅用研磨剂、其用途以及研磨方法 |
| US20090156006A1 (en) * | 2006-05-02 | 2009-06-18 | Sriram Anjur | Compositions and methods for cmp of semiconductor materials |
| JP2008277723A (ja) * | 2007-03-30 | 2008-11-13 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| CN101463227B (zh) * | 2007-12-21 | 2013-06-12 | 安集微电子（上海）有限公司 | 一种用于阻挡层抛光的化学机械抛光液 |
| WO2009119485A1 (ja) * | 2008-03-28 | 2009-10-01 | 日立化成工業株式会社 | 金属用研磨液及びこの研磨液を用いた研磨方法 |
| CN103396765A (zh) * | 2008-04-23 | 2013-11-20 | 日立化成工业株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
| CN101821058A (zh) * | 2008-06-11 | 2010-09-01 | 信越化学工业株式会社 | 合成石英玻璃基板用抛光剂 |
| CN102268224B (zh) * | 2010-06-01 | 2013-12-04 | 中国科学院上海微系统与信息技术研究所 | 可控氧化硅去除速率的化学机械抛光液 |
| WO2012032461A1 (en) * | 2010-09-08 | 2012-03-15 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices |
| KR101886464B1 (ko) * | 2010-12-24 | 2018-08-07 | 히타치가세이가부시끼가이샤 | 연마액 및 이 연마액을 이용한 기판의 연마 방법 |
| JP6125507B2 (ja) * | 2011-09-07 | 2017-05-10 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | グリコシドを含む化学機械研磨（ｃｍｐ）組成物 |
-
2015
- 2015-01-21 WO PCT/IB2015/050454 patent/WO2015114489A1/en not_active Ceased
- 2015-01-21 US US15/115,747 patent/US20170166778A1/en not_active Abandoned
- 2015-01-21 SG SG11201606157VA patent/SG11201606157VA/en unknown
- 2015-01-21 KR KR1020167023956A patent/KR20160114709A/ko not_active Withdrawn
- 2015-01-21 CN CN201580005687.0A patent/CN105934487B/zh not_active Expired - Fee Related
- 2015-01-21 EP EP15743237.8A patent/EP3099756A4/en not_active Withdrawn
- 2015-01-21 JP JP2016549507A patent/JP2017508833A/ja active Pending
- 2015-01-29 TW TW104102942A patent/TW201538700A/zh unknown
-
2016
- 2016-07-24 IL IL246916A patent/IL246916A0/en unknown
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