JP2017503352A5 - - Google Patents
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- Publication number
- JP2017503352A5 JP2017503352A5 JP2016544435A JP2016544435A JP2017503352A5 JP 2017503352 A5 JP2017503352 A5 JP 2017503352A5 JP 2016544435 A JP2016544435 A JP 2016544435A JP 2016544435 A JP2016544435 A JP 2016544435A JP 2017503352 A5 JP2017503352 A5 JP 2017503352A5
- Authority
- JP
- Japan
- Prior art keywords
- led die
- reflector
- led
- light
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461923925P | 2014-01-06 | 2014-01-06 | |
| US61/923,925 | 2014-01-06 | ||
| PCT/IB2014/067204 WO2015101899A1 (en) | 2014-01-06 | 2014-12-22 | Thin led flash for camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017503352A JP2017503352A (ja) | 2017-01-26 |
| JP2017503352A5 true JP2017503352A5 (enExample) | 2018-02-08 |
Family
ID=52434902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016544435A Pending JP2017503352A (ja) | 2014-01-06 | 2014-12-22 | カメラのための薄いledフラッシュ |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US10120266B2 (enExample) |
| EP (1) | EP3092667B1 (enExample) |
| JP (1) | JP2017503352A (enExample) |
| KR (1) | KR102302523B1 (enExample) |
| CN (2) | CN112117359A (enExample) |
| WO (1) | WO2015101899A1 (enExample) |
Families Citing this family (30)
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| EP3022779B1 (en) * | 2013-07-19 | 2020-03-18 | Lumileds Holding B.V. | Pc led with optical element and without substrate carrier |
| US10120266B2 (en) | 2014-01-06 | 2018-11-06 | Lumileds Llc | Thin LED flash for camera |
| CN103872203A (zh) * | 2014-04-08 | 2014-06-18 | 三安光电股份有限公司 | 具有表面微结构的高亮度发光二极管及其制备和筛选方法 |
| DE102015108499A1 (de) | 2015-05-29 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Strahlungsquelle |
| KR101778848B1 (ko) * | 2015-08-21 | 2017-09-14 | 엘지전자 주식회사 | 발광소자 패키지 어셈블리 및 이의 제조 방법 |
| CN111223975A (zh) * | 2015-09-18 | 2020-06-02 | 新世纪光电股份有限公司 | 发光装置及其制造方法 |
| US9746689B2 (en) | 2015-09-24 | 2017-08-29 | Intel Corporation | Magnetic fluid optical image stabilization |
| US9816687B2 (en) * | 2015-09-24 | 2017-11-14 | Intel Corporation | MEMS LED zoom |
| JP7179613B2 (ja) * | 2015-12-02 | 2022-11-29 | ルミレッズ ホールディング ベーフェー | デバイス |
| KR102698831B1 (ko) * | 2015-12-02 | 2024-08-27 | 루미리즈 홀딩 비.브이. | 최적화된 열저항, 땜납 신뢰성, 및 smt 처리 수율들을 위한 led 금속 패드 구성 |
| US11373990B2 (en) | 2016-02-29 | 2022-06-28 | Semtech Corporation | Semiconductor device and method of stacking semiconductor die for system-level ESD protection |
| JP2017157684A (ja) * | 2016-03-02 | 2017-09-07 | ローム株式会社 | 発光装置およびその製造方法 |
| DE102016109054A1 (de) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung |
| DE102016117523A1 (de) * | 2016-09-16 | 2018-03-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Betreiben eines optoelektronischen Bauelements |
| JP6955135B2 (ja) * | 2016-10-19 | 2021-10-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| US10741644B2 (en) * | 2016-11-22 | 2020-08-11 | Delta Electronics, Inc. | Semiconductor devices with via structure and package structures comprising the same |
| DE102016122770B4 (de) * | 2016-11-25 | 2022-01-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauteil mit einem optoelektronischen Bauelement |
| CN106784258B (zh) * | 2017-03-15 | 2018-11-09 | 厦门大学 | 晶圆级封装led |
| US10950762B2 (en) * | 2017-04-13 | 2021-03-16 | Lightizer Co., Ltd | Round chip scale package and manufacturing method therefor |
| WO2019054934A1 (en) * | 2017-09-18 | 2019-03-21 | Profoto Aktiebolag | FLASH HOUSING AND METHOD OF TRANSMITTING A BEAM LOBE WITH A SUBSTANTIALLY CIRCULAR CROSS SECTION |
| KR102103514B1 (ko) * | 2017-09-27 | 2020-05-29 | 주식회사 시티컴 | 엘이디 광 중화캡 및 그 제조방법 |
| US10522722B2 (en) | 2018-04-19 | 2019-12-31 | Cree, Inc. | Light-emitting diode package with light-altering material |
| KR102624113B1 (ko) * | 2018-06-08 | 2024-01-12 | 서울바이오시스 주식회사 | 발광 소자 패키지 및 이의 제조 방법 |
| KR102721974B1 (ko) | 2019-08-07 | 2024-10-28 | 삼성전자주식회사 | 광 센서 일체형 플래시 led 패키지 |
| US11435044B2 (en) | 2019-09-09 | 2022-09-06 | Apple Inc. | Integrated strobe module |
| US11552229B2 (en) | 2020-09-14 | 2023-01-10 | Creeled, Inc. | Spacer layer arrangements for light-emitting diodes |
| KR102876049B1 (ko) * | 2020-10-27 | 2025-10-24 | 엘지이노텍 주식회사 | 거리 측정 카메라 장치 |
| EP4250002A4 (en) | 2021-01-07 | 2024-04-24 | Samsung Electronics Co., Ltd. | Flash lens of electronic device |
| TWI769064B (zh) * | 2021-08-24 | 2022-06-21 | 隆達電子股份有限公司 | 發光裝置 |
| CN115201990A (zh) * | 2022-09-08 | 2022-10-18 | 成都中科卓尔智能科技集团有限公司 | 一种半导体光学材料内部缺陷检测片光源镜头 |
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| US8198109B2 (en) * | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
| KR101109581B1 (ko) * | 2010-12-01 | 2012-01-31 | 노명재 | 엘이디 광확산용 확장형 아이시클타입 광 조정렌즈 |
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| JP5698808B2 (ja) * | 2013-07-26 | 2015-04-08 | スタンレー電気株式会社 | 半導体発光装置 |
| US9803833B2 (en) * | 2013-12-03 | 2017-10-31 | X Development Llc | Multi-aperture illumination layer for tileable display |
| US10120266B2 (en) | 2014-01-06 | 2018-11-06 | Lumileds Llc | Thin LED flash for camera |
| US10355183B2 (en) * | 2015-09-18 | 2019-07-16 | Rohm Co., Ltd. | LED package |
-
2014
- 2014-12-22 US US15/104,220 patent/US10120266B2/en active Active
- 2014-12-22 CN CN202011025952.0A patent/CN112117359A/zh active Pending
- 2014-12-22 CN CN201480072446.3A patent/CN105849922A/zh active Pending
- 2014-12-22 KR KR1020167021508A patent/KR102302523B1/ko active Active
- 2014-12-22 WO PCT/IB2014/067204 patent/WO2015101899A1/en not_active Ceased
- 2014-12-22 EP EP14833271.1A patent/EP3092667B1/en active Active
- 2014-12-22 JP JP2016544435A patent/JP2017503352A/ja active Pending
-
2018
- 2018-10-31 US US16/176,184 patent/US10324359B2/en active Active
-
2019
- 2019-04-08 US US16/377,886 patent/US10564520B2/en active Active
- 2019-12-17 US US16/717,781 patent/US11036114B2/en active Active
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