JP2015507825A5 - - Google Patents
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- Publication number
- JP2015507825A5 JP2015507825A5 JP2014549599A JP2014549599A JP2015507825A5 JP 2015507825 A5 JP2015507825 A5 JP 2015507825A5 JP 2014549599 A JP2014549599 A JP 2014549599A JP 2014549599 A JP2014549599 A JP 2014549599A JP 2015507825 A5 JP2015507825 A5 JP 2015507825A5
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lighting assembly
- assembly
- primary thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005286 illumination Methods 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 229910010413 TiO 2 Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261582560P | 2012-01-03 | 2012-01-03 | |
| US61/582,560 | 2012-01-03 | ||
| PCT/IB2012/057596 WO2013102823A1 (en) | 2012-01-03 | 2012-12-21 | A lighting assembly, a light source and a luminaire |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015507825A JP2015507825A (ja) | 2015-03-12 |
| JP2015507825A5 true JP2015507825A5 (enExample) | 2016-02-12 |
| JP6038175B2 JP6038175B2 (ja) | 2016-12-07 |
Family
ID=47747695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014549599A Expired - Fee Related JP6038175B2 (ja) | 2012-01-03 | 2012-12-21 | 照明アセンブリ、光源、及び照明器具 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9874316B2 (enExample) |
| EP (1) | EP2800925B1 (enExample) |
| JP (1) | JP6038175B2 (enExample) |
| CN (1) | CN104024722B (enExample) |
| WO (1) | WO2013102823A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010026344A1 (de) * | 2010-07-07 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Leuchtdiode |
| EP2752101A1 (en) * | 2011-08-29 | 2014-07-09 | Koninklijke Philips N.V. | A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer |
| US9326338B2 (en) | 2013-06-21 | 2016-04-26 | Micron Technology, Inc. | Multi-junction solid state transducer devices for direct AC power and associated systems and methods |
| CN105706537B (zh) | 2013-11-05 | 2019-11-01 | 飞利浦照明控股有限公司 | 组件和制造组件的方法 |
| US10024530B2 (en) * | 2014-07-03 | 2018-07-17 | Sansi Led Lighting Inc. | Lighting device and LED luminaire |
| CN104302102A (zh) * | 2014-09-26 | 2015-01-21 | 中国科学院长春光学精密机械与物理研究所 | 一种红外焦平面传感器无封装应用方法 |
| DE102015106444A1 (de) * | 2015-04-27 | 2016-10-27 | Osram Opto Semiconductors Gmbh | Optoelektronische Bauelementanordnung und Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementanordnungen |
| US10941926B2 (en) | 2015-12-18 | 2021-03-09 | Applied Electronic Materials, LLC | Modular lighting system including light modules with integrated LED units |
| US20190120444A1 (en) * | 2015-12-18 | 2019-04-25 | Applied Electronic Materials, LLC | Modular lighting system including light modules with integrated led units |
| EP3685643B1 (en) * | 2017-09-21 | 2025-07-23 | KYOCERA AVX Components Corporation | Electrically insulating thermal connector having a low thermal resistivity |
| RU2689301C1 (ru) * | 2018-03-13 | 2019-05-27 | Анатолий Павлович Бежко | Светодиодный модуль для формирования светильника |
| KR102694329B1 (ko) | 2018-12-10 | 2024-08-13 | 삼성전자주식회사 | 디스플레이 모듈, 이를 포함하는 디스플레이 장치 및 디스플레이 모듈 제조 방법 |
| CN110690181A (zh) * | 2019-10-15 | 2020-01-14 | 福建省信达光电科技有限公司 | 一种热电分离的led基板及其制造方法 |
| US11293627B1 (en) * | 2021-02-02 | 2022-04-05 | Gary Lagasse | Miniature LED lightbulb mounting device |
| WO2025183596A1 (ru) * | 2024-02-26 | 2025-09-04 | Сергей Вячеславович ОТРУБЯННИКОВ | Модуль светодиодный для формирования светильника |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4646357B2 (ja) * | 2000-06-08 | 2011-03-09 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| WO2004011848A2 (en) * | 2002-07-25 | 2004-02-05 | Dahm Jonathan S | Method and apparatus for using light emitting diodes for curing |
| EP1590994B1 (en) * | 2003-02-07 | 2016-05-18 | Panasonic Intellectual Property Management Co., Ltd. | Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus |
| US10376711B2 (en) * | 2003-03-14 | 2019-08-13 | Light Sciences Oncology Inc. | Light generating guide wire for intravascular use |
| TWI224661B (en) | 2003-06-13 | 2004-12-01 | Yuan Lin | Multi-channel light source based longitudinal lighting device |
| JP4192742B2 (ja) * | 2003-09-30 | 2008-12-10 | 豊田合成株式会社 | 発光装置 |
| JP2006019319A (ja) * | 2004-06-30 | 2006-01-19 | C I Kasei Co Ltd | 発光ダイオード組立体および発光ダイオード組立体の製造方法 |
| US7303315B2 (en) * | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
| WO2006103596A2 (en) | 2005-03-30 | 2006-10-05 | Koninklijke Philips Electronics N.V. | Flexible led array |
| US20060289887A1 (en) | 2005-06-24 | 2006-12-28 | Jabil Circuit, Inc. | Surface mount light emitting diode (LED) assembly with improved power dissipation |
| KR101241650B1 (ko) | 2005-10-19 | 2013-03-08 | 엘지이노텍 주식회사 | 엘이디 패키지 |
| US7710045B2 (en) | 2006-03-17 | 2010-05-04 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
| KR101412473B1 (ko) | 2006-04-25 | 2014-06-30 | 코닌클리케 필립스 엔.브이. | Led 어레이 그리드, led 어레이 그리드의 제조를 위한 방법 및 장치 및 led 어레이 그리드에서 사용하기 위한 led 구성부품 |
| CN101517755A (zh) * | 2006-09-21 | 2009-08-26 | 3M创新有限公司 | 导热led组件 |
| US8581393B2 (en) | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
| TWM331086U (en) * | 2007-10-17 | 2008-04-21 | Tai Sol Electronics Co Ltd | Combination of LED and heat conduction device |
| KR100917712B1 (ko) | 2007-12-13 | 2009-09-21 | 유트로닉스주식회사 | 알루미늄 금속 기판을 이용한 led 어레이 모듈 |
| US8067782B2 (en) * | 2008-04-08 | 2011-11-29 | Advanced Optoelectric Technology, Inc. | LED package and light source device using same |
| KR100982986B1 (ko) * | 2008-04-17 | 2010-09-17 | 삼성엘이디 주식회사 | 서브마운트, 발광다이오드 패키지 및 그 제조방법 |
| JP5146356B2 (ja) * | 2009-02-24 | 2013-02-20 | 豊田合成株式会社 | 発光装置及びその製造方法 |
| CN101894901B (zh) * | 2009-04-08 | 2013-11-20 | 硅谷光擎 | 用于多个发光二极管的封装 |
| US8348460B2 (en) * | 2009-05-01 | 2013-01-08 | Abl Ip Holding Llc | Lighting apparatus with several light units arranged in a heatsink |
| CN101929624A (zh) * | 2009-06-25 | 2010-12-29 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
| CN201502903U (zh) | 2009-09-29 | 2010-06-09 | 深圳市庄正电子技术有限公司 | 一种用于投影设备的led光源结构 |
-
2012
- 2012-12-21 JP JP2014549599A patent/JP6038175B2/ja not_active Expired - Fee Related
- 2012-12-21 CN CN201280065600.5A patent/CN104024722B/zh not_active Expired - Fee Related
- 2012-12-21 US US14/370,345 patent/US9874316B2/en not_active Expired - Fee Related
- 2012-12-21 EP EP12826553.5A patent/EP2800925B1/en not_active Not-in-force
- 2012-12-21 WO PCT/IB2012/057596 patent/WO2013102823A1/en not_active Ceased
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