CN112117359A - 用于相机的薄的led闪光灯 - Google Patents
用于相机的薄的led闪光灯 Download PDFInfo
- Publication number
- CN112117359A CN112117359A CN202011025952.0A CN202011025952A CN112117359A CN 112117359 A CN112117359 A CN 112117359A CN 202011025952 A CN202011025952 A CN 202011025952A CN 112117359 A CN112117359 A CN 112117359A
- Authority
- CN
- China
- Prior art keywords
- reflector
- led die
- lens
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims 13
- 239000010410 layer Substances 0.000 description 29
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/10—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
- G02B7/105—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens with movable lens means specially adapted for focusing at close distances
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0564—Combinations of cameras with electronic flash units characterised by the type of light source
- G03B2215/0567—Solid-state light source, e.g. LED, laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Stroboscope Apparatuses (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461923925P | 2014-01-06 | 2014-01-06 | |
| US61/923925 | 2014-01-06 | ||
| CN201480072446.3A CN105849922A (zh) | 2014-01-06 | 2014-12-22 | 用于相机的薄的led闪光灯 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480072446.3A Division CN105849922A (zh) | 2014-01-06 | 2014-12-22 | 用于相机的薄的led闪光灯 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112117359A true CN112117359A (zh) | 2020-12-22 |
Family
ID=52434902
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011025952.0A Pending CN112117359A (zh) | 2014-01-06 | 2014-12-22 | 用于相机的薄的led闪光灯 |
| CN201480072446.3A Pending CN105849922A (zh) | 2014-01-06 | 2014-12-22 | 用于相机的薄的led闪光灯 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480072446.3A Pending CN105849922A (zh) | 2014-01-06 | 2014-12-22 | 用于相机的薄的led闪光灯 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US10120266B2 (enExample) |
| EP (1) | EP3092667B1 (enExample) |
| JP (1) | JP2017503352A (enExample) |
| KR (1) | KR102302523B1 (enExample) |
| CN (2) | CN112117359A (enExample) |
| WO (1) | WO2015101899A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015008243A1 (en) * | 2013-07-19 | 2015-01-22 | Koninklijke Philips N.V. | Pc led with optical element and without substrate carrier |
| JP2017503352A (ja) | 2014-01-06 | 2017-01-26 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | カメラのための薄いledフラッシュ |
| CN103872203A (zh) * | 2014-04-08 | 2014-06-18 | 三安光电股份有限公司 | 具有表面微结构的高亮度发光二极管及其制备和筛选方法 |
| DE102015108499A1 (de) | 2015-05-29 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Strahlungsquelle |
| KR101778848B1 (ko) * | 2015-08-21 | 2017-09-14 | 엘지전자 주식회사 | 발광소자 패키지 어셈블리 및 이의 제조 방법 |
| CN106549092A (zh) * | 2015-09-18 | 2017-03-29 | 新世纪光电股份有限公司 | 发光装置及其制造方法 |
| US9746689B2 (en) | 2015-09-24 | 2017-08-29 | Intel Corporation | Magnetic fluid optical image stabilization |
| US9816687B2 (en) * | 2015-09-24 | 2017-11-14 | Intel Corporation | MEMS LED zoom |
| WO2017095712A1 (en) * | 2015-12-02 | 2017-06-08 | Koninklijke Philips N.V. | Led metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields |
| CN116314526A (zh) * | 2015-12-02 | 2023-06-23 | 亮锐控股有限公司 | 用于优化的热阻、焊接可靠性和smt加工良率的led金属焊盘配置 |
| US11373990B2 (en) * | 2016-02-29 | 2022-06-28 | Semtech Corporation | Semiconductor device and method of stacking semiconductor die for system-level ESD protection |
| JP2017157684A (ja) * | 2016-03-02 | 2017-09-07 | ローム株式会社 | 発光装置およびその製造方法 |
| DE102016109054A1 (de) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung |
| DE102016117523A1 (de) * | 2016-09-16 | 2018-03-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Betreiben eines optoelektronischen Bauelements |
| JP6955135B2 (ja) * | 2016-10-19 | 2021-10-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| US10741644B2 (en) * | 2016-11-22 | 2020-08-11 | Delta Electronics, Inc. | Semiconductor devices with via structure and package structures comprising the same |
| DE102016122770B4 (de) | 2016-11-25 | 2022-01-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauteil mit einem optoelektronischen Bauelement |
| CN106784258B (zh) * | 2017-03-15 | 2018-11-09 | 厦门大学 | 晶圆级封装led |
| WO2018190449A1 (ko) * | 2017-04-13 | 2018-10-18 | (주)라이타이저코리아 | 라운드 칩 스케일 패키지 및 그의 제조 방법 |
| WO2019054934A1 (en) * | 2017-09-18 | 2019-03-21 | Profoto Aktiebolag | FLASH HOUSING AND METHOD OF TRANSMITTING A BEAM LOBE WITH A SUBSTANTIALLY CIRCULAR CROSS SECTION |
| KR102103514B1 (ko) * | 2017-09-27 | 2020-05-29 | 주식회사 시티컴 | 엘이디 광 중화캡 및 그 제조방법 |
| US10522722B2 (en) * | 2018-04-19 | 2019-12-31 | Cree, Inc. | Light-emitting diode package with light-altering material |
| KR102624113B1 (ko) * | 2018-06-08 | 2024-01-12 | 서울바이오시스 주식회사 | 발광 소자 패키지 및 이의 제조 방법 |
| KR102721974B1 (ko) | 2019-08-07 | 2024-10-28 | 삼성전자주식회사 | 광 센서 일체형 플래시 led 패키지 |
| US11435044B2 (en) * | 2019-09-09 | 2022-09-06 | Apple Inc. | Integrated strobe module |
| US11552229B2 (en) | 2020-09-14 | 2023-01-10 | Creeled, Inc. | Spacer layer arrangements for light-emitting diodes |
| KR102876049B1 (ko) * | 2020-10-27 | 2025-10-24 | 엘지이노텍 주식회사 | 거리 측정 카메라 장치 |
| EP4250002A4 (en) | 2021-01-07 | 2024-04-24 | Samsung Electronics Co., Ltd. | Flash lens of electronic device |
| TWI769064B (zh) * | 2021-08-24 | 2022-06-21 | 隆達電子股份有限公司 | 發光裝置 |
| CN115201990A (zh) * | 2022-09-08 | 2022-10-18 | 成都中科卓尔智能科技集团有限公司 | 一种半导体光学材料内部缺陷检测片光源镜头 |
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2014
- 2014-12-22 JP JP2016544435A patent/JP2017503352A/ja active Pending
- 2014-12-22 CN CN202011025952.0A patent/CN112117359A/zh active Pending
- 2014-12-22 CN CN201480072446.3A patent/CN105849922A/zh active Pending
- 2014-12-22 EP EP14833271.1A patent/EP3092667B1/en active Active
- 2014-12-22 KR KR1020167021508A patent/KR102302523B1/ko active Active
- 2014-12-22 WO PCT/IB2014/067204 patent/WO2015101899A1/en not_active Ceased
- 2014-12-22 US US15/104,220 patent/US10120266B2/en active Active
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2018
- 2018-10-31 US US16/176,184 patent/US10324359B2/en active Active
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2019
- 2019-04-08 US US16/377,886 patent/US10564520B2/en active Active
- 2019-12-17 US US16/717,781 patent/US11036114B2/en active Active
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| EP3092667B1 (en) | 2019-04-24 |
| US20190250486A1 (en) | 2019-08-15 |
| US10324359B2 (en) | 2019-06-18 |
| US11036114B2 (en) | 2021-06-15 |
| US20160320689A1 (en) | 2016-11-03 |
| US10120266B2 (en) | 2018-11-06 |
| CN105849922A (zh) | 2016-08-10 |
| EP3092667A1 (en) | 2016-11-16 |
| US20190064635A1 (en) | 2019-02-28 |
| WO2015101899A1 (en) | 2015-07-09 |
| US10564520B2 (en) | 2020-02-18 |
| JP2017503352A (ja) | 2017-01-26 |
| KR20160107238A (ko) | 2016-09-13 |
| KR102302523B1 (ko) | 2021-09-15 |
| US20200124941A1 (en) | 2020-04-23 |
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