JP2017500446A - 有機材料用の蒸発源、有機材料用の蒸発源を有する装置、有機材料用の蒸発源を含む蒸発堆積装置を有するシステム、及び有機材料用の蒸発源を操作するための方法 - Google Patents
有機材料用の蒸発源、有機材料用の蒸発源を有する装置、有機材料用の蒸発源を含む蒸発堆積装置を有するシステム、及び有機材料用の蒸発源を操作するための方法 Download PDFInfo
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- 230000008020 evaporation Effects 0.000 title claims abstract description 231
- 239000011368 organic material Substances 0.000 title claims abstract description 118
- 230000008021 deposition Effects 0.000 title claims description 88
- 238000000034 method Methods 0.000 title claims description 14
- 238000009826 distribution Methods 0.000 claims abstract description 126
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- 239000000758 substrate Substances 0.000 claims description 292
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- 230000001939 inductive effect Effects 0.000 claims description 4
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- 229910052751 metal Inorganic materials 0.000 description 6
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- H10K71/10—Deposition of organic active material
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- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
Description
Claims (15)
- 有機材料用の蒸発源であって、
前記有機材料を蒸発させるように構成された蒸発るつぼと、
前記蒸発るつぼと流体連通しており、蒸発中に軸周囲を回転可能である、一又は複数の排出口を有する分配管と、
第1のドライバと連結可能であり又は前記第1のドライバを含む、前記分配管の支持体であって、前記第1のドライバが前記支持体及び前記分配管の並進運動のために構成される、支持体と
を備える蒸発源。 - 前記分配管が、前記一又は複数の排出口を含む蒸気分配シャワーヘッドであり、特に前記蒸気分配シャワーヘッドが、直線的蒸気分配シャワーヘッドである、請求項1に記載の蒸発源。
- 前記分配管が、本質的に垂直に延びる線源を提供し、及び/又は前記分配管を回転させる前記軸が、本質的に垂直に延びる、請求項1又は2に記載の蒸発源。
- 前記分配管が、少なくとも160度、特に180度又は少なくとも360度回転可能である、請求項1から3の何れか一項に記載の蒸発源。
- 前記分配管が、前記支持体に対して前記分配管を回転させ、更に特に前記支持体に対して前記蒸発るつぼも回転させる第2のドライバによって、前記軸周囲を回転可能である、請求項1から4の何れか一項に記載の蒸発源。
- 前記支持体が、内部で大気圧を維持するように構成された支持体ハウジングを含み、前記支持体が、回転可能な真空フィードスルー、特に磁性流体フィードスルーを介して、前記分配管を支持する、請求項5に記載の蒸発源。
- 前記分配管が、ループ状トラックに沿って進行することによって、前記軸周囲を回転可能である、請求項1から4の何れか一項に記載の蒸発源。
- 内部で大気圧を維持するように構成された蒸発器制御ハウジングであって、前記支持体によって支持され、スイッチ、バルブ、コントローラ、冷却ユニット及び冷却制御ユニットから成るグループから選択された少なくとも1つの要素を収納するように構成されたハウジングを更に備える、請求項1から7の何れか一項に記載の蒸発源。
- 前記有機材料の蒸発を遮蔽するための少なくとも1つのサイドシールド、特に2つのサイドシールドを更に備える、請求項1から8の何れか一項に記載の蒸発源。
- 誘導性電力伝送及び誘導性信号伝送のうちの少なくとも1つのためのコイルを更に備える、請求項1から9の何れか一項に記載の蒸発源。
- 前記支持体によって支持されている少なくとも1つの第2の蒸発るつぼと、
前記少なくとも1つの第2の蒸発るつぼと流体連通している、前記支持体によって支持されている少なくとも1つの第2の分配管と
を更に備える、請求項1から10の何れか一項に記載の蒸発源。 - 真空チャンバの中で有機材料を堆積させるための堆積装置であって、
処理真空チャンバと、
前記処理真空チャンバの中で前記有機材料を蒸発させる、請求項1から11の何れか一項に記載の蒸発源と、
前記真空チャンバの中に配置され、少なくとも2つのトラックを有する基板支持体システムであって、前記基板支持体システムの前記少なくとも2つのトラックが、前記基板又は前記真空チャンバの中で前記基板を運ぶキャリアの本質的に垂直な支持体のために構成される、基板支持体システムと
を備える堆積装置。 - 前記処理真空チャンバと連結した保守真空チャンバと、
前記処理真空チャンバと前記保守真空チャンバとの間の真空密閉を開閉するための真空バルブであって、前記蒸発源を前記処理真空チャンバから前記保守真空チャンバへ及び前記保守真空チャンバから前記処理真空チャンバへ移送することができる、真空バルブと
を更に備える、請求項12に記載の堆積装置。 - 有機材料を蒸発させるための方法であって、
本質的に垂直な第1の処理位置で第1の基板を移動させることと、
蒸発源が前記有機材料を蒸発させる間に、少なくとも並進運動で前記第1の基板に沿って前記蒸発源を移動させることと、
前記第1の処理位置と異なる本質的に垂直な第2の処理位置で第2の基板を移動させることと、
蒸発中に軸周囲で前記蒸発源の分配管を回転させることと、
前記蒸発源が前記有機材料を蒸発させる間に、少なくとも更なる並進運動で前記第2の基板に沿って前記蒸発源を移動させることと
を含む方法。 - 前記第2の基板は、前記蒸発源が前記第1の基板に沿って移動される間に、前記本質的に垂直な第2の処理位置で移動される、請求項14に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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PCT/EP2013/076120 WO2015086049A1 (en) | 2013-12-10 | 2013-12-10 | Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material |
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JP2017002003A Division JP6343036B2 (ja) | 2017-01-10 | 2017-01-10 | 有機材料用の蒸発源、有機材料用の蒸発源を有する真空チャンバにおいて有機材料を堆積するための堆積装置、及び有機材料を蒸発させるための方法 |
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JP2017500446A true JP2017500446A (ja) | 2017-01-05 |
JP2017500446A5 JP2017500446A5 (ja) | 2017-02-09 |
JP6328766B2 JP6328766B2 (ja) | 2018-05-23 |
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JP2016537025A Active JP6568853B2 (ja) | 2013-12-10 | 2014-08-19 | デバイスを処理するための処理装置、及び処理真空チャンバから保守真空チャンバへ又は保守真空チャンバから処理真空チャンバへ蒸発源を移送するための方法 |
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EP (2) | EP3187618A1 (ja) |
JP (2) | JP6328766B2 (ja) |
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Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101932943B1 (ko) * | 2014-12-05 | 2018-12-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 재료 증착 시스템 및 재료 증착 시스템에서 재료를 증착하기 위한 방법 |
JP6488400B2 (ja) * | 2015-07-13 | 2019-03-20 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 蒸発源 |
CN109477204B (zh) * | 2016-05-10 | 2020-10-23 | 应用材料公司 | 操作沉积设备的方法和沉积设备 |
US20190292653A1 (en) * | 2016-05-18 | 2019-09-26 | Stefan Bangert | Apparatus and method for transportation of a deposition source |
US10249525B2 (en) * | 2016-10-03 | 2019-04-02 | Applied Materials, Inc. | Dynamic leveling process heater lift |
KR102030683B1 (ko) * | 2017-01-31 | 2019-10-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 재료 증착 어레인지먼트, 진공 증착 시스템 및 이를 위한 방법 |
WO2018144107A1 (en) * | 2017-02-03 | 2018-08-09 | Applied Materials, Inc. | Apparatus and method for continuous evaporation having substrates side by side |
CN109563608A (zh) * | 2017-02-24 | 2019-04-02 | 应用材料公司 | 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法 |
US11004704B2 (en) | 2017-03-17 | 2021-05-11 | Applied Materials, Inc. | Finned rotor cover |
KR102069665B1 (ko) * | 2017-03-17 | 2020-01-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판의 진공 프로세싱을 위한 장치, 유기 재료들을 갖는 디바이스들의 제조를 위한 시스템, 및 프로세싱 진공 챔버와 유지보수 진공 챔버를 서로 밀봉하기 위한 방법 |
US20200243768A1 (en) * | 2017-03-17 | 2020-07-30 | Applied Materials, Inc. | Methods of operating a vacuum processing system |
JP6549314B2 (ja) * | 2017-03-17 | 2019-07-24 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 堆積システム、堆積装置、及び堆積システムを操作する方法 |
US20200016557A1 (en) * | 2017-04-07 | 2020-01-16 | Andre Brüning | Supply line guide for a vacuum processing system, use of a supply line guide and processing system |
EP3642633A4 (en) | 2017-06-21 | 2021-05-12 | Abbott Molecular Inc. | METHODS FOR AUTOMATED LOADING AND PROCESSING OF SAMPLES AND ASSOCIATED DEVICES AND SYSTEMS |
JP2019526700A (ja) * | 2017-07-24 | 2019-09-19 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空チャンバ内の基板を処理するための装置及びシステム、並びにマスクキャリアに対して基板キャリアを位置合わせする方法 |
KR102069679B1 (ko) * | 2017-07-24 | 2020-01-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 진공 챔버에서 기판을 프로세싱하기 위한 장치 및 시스템, 및 진공 챔버에서 캐리어를 운송하는 방법 |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
CN109715847A (zh) * | 2017-08-25 | 2019-05-03 | 应用材料公司 | 用于在真空腔室中蒸发材料的设备和用于在真空腔室中蒸发材料的方法 |
US11028480B2 (en) | 2018-03-19 | 2021-06-08 | Applied Materials, Inc. | Methods of protecting metallic components against corrosion using chromium-containing thin films |
WO2019209401A1 (en) | 2018-04-27 | 2019-10-31 | Applied Materials, Inc. | Protection of components from corrosion |
CN214361638U (zh) * | 2018-05-30 | 2021-10-08 | 应用材料公司 | 沉积设备 |
WO2020030252A1 (en) * | 2018-08-07 | 2020-02-13 | Applied Materials, Inc. | Material deposition apparatus, vacuum deposition system and method of processing a large area substrate |
US11009339B2 (en) | 2018-08-23 | 2021-05-18 | Applied Materials, Inc. | Measurement of thickness of thermal barrier coatings using 3D imaging and surface subtraction methods for objects with complex geometries |
KR20200046463A (ko) * | 2018-10-24 | 2020-05-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 도가니 교체를 위한 증발 증착 시스템 |
US11512389B2 (en) | 2019-03-20 | 2022-11-29 | Samsung Electronincs Co., Ltd. | Apparatus for and method of manufacturing semiconductor device |
CN113795908A (zh) | 2019-04-08 | 2021-12-14 | 应用材料公司 | 用于修改光刻胶轮廓和调整临界尺寸的方法 |
CN113677825B (zh) | 2019-04-16 | 2023-10-24 | 应用材料公司 | 沟槽中薄膜沉积的方法 |
US11629402B2 (en) | 2019-04-16 | 2023-04-18 | Applied Materials, Inc. | Atomic layer deposition on optical structures |
EP3959356A4 (en) | 2019-04-26 | 2023-01-18 | Applied Materials, Inc. | METHODS FOR PROTECTING AEROSPACE ELEMENTS AGAINST CORROSION AND OXIDATION |
US11794382B2 (en) | 2019-05-16 | 2023-10-24 | Applied Materials, Inc. | Methods for depositing anti-coking protective coatings on aerospace components |
US11628478B2 (en) | 2019-05-29 | 2023-04-18 | Applied Materials, Inc. | Steam cleaning of CMP components |
US11633833B2 (en) | 2019-05-29 | 2023-04-25 | Applied Materials, Inc. | Use of steam for pre-heating of CMP components |
TW202110575A (zh) | 2019-05-29 | 2021-03-16 | 美商應用材料股份有限公司 | 用於化學機械研磨系統的蒸氣處置站 |
US11697879B2 (en) | 2019-06-14 | 2023-07-11 | Applied Materials, Inc. | Methods for depositing sacrificial coatings on aerospace components |
TWI753460B (zh) * | 2019-06-27 | 2022-01-21 | 美商應用材料股份有限公司 | 用於化學機械研磨的蒸汽產生 |
US11466364B2 (en) | 2019-09-06 | 2022-10-11 | Applied Materials, Inc. | Methods for forming protective coatings containing crystallized aluminum oxide |
EP4094307A4 (en) * | 2020-01-22 | 2024-02-28 | Applied Materials, Inc. | ONLINE MONITORING OF OLED LAYER THICKNESS AND DOPANT CONCENTRATION |
CN115088092A (zh) | 2020-01-22 | 2022-09-20 | 应用材料公司 | Oled层厚度和掺杂剂浓度的产线内监测 |
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US11519066B2 (en) | 2020-05-21 | 2022-12-06 | Applied Materials, Inc. | Nitride protective coatings on aerospace components and methods for making the same |
WO2021245154A1 (en) * | 2020-06-03 | 2021-12-09 | Applied Materials, Inc. | Deposition apparatus, processing system, and method of manufacturing a layer of an optoelectronic device |
KR20220116324A (ko) | 2020-06-29 | 2022-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기계적 연마를 위한 스팀 생성의 제어 |
WO2022005696A1 (en) | 2020-07-03 | 2022-01-06 | Applied Materials, Inc. | Methods for refurbishing aerospace components |
CN112342516B (zh) * | 2020-11-09 | 2022-10-18 | 湘潭宏大真空技术股份有限公司 | 磁控溅射镀膜装置 |
DE102021117574A1 (de) | 2021-07-07 | 2023-01-12 | Thyssenkrupp Steel Europe Ag | Beschichtungsanlage zur Beschichtung eines flächigen Gegenstands sowie ein Verfahren zum Beschichten eines flächigen Gegenstands |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002367781A (ja) * | 2001-06-12 | 2002-12-20 | Sony Corp | 成膜装置および成膜方法 |
JP2004100002A (ja) * | 2002-09-11 | 2004-04-02 | Ulvac Japan Ltd | 蒸発源及びこれを用いた薄膜形成装置 |
JP2005015869A (ja) * | 2003-06-27 | 2005-01-20 | Semiconductor Energy Lab Co Ltd | 製造装置 |
JP2006002226A (ja) * | 2004-06-18 | 2006-01-05 | Kyocera Corp | 蒸着装置 |
JP2009299176A (ja) * | 2008-06-16 | 2009-12-24 | Samsung Mobile Display Co Ltd | 移送装置及びこれを備える有機物蒸着装置 |
US20100279021A1 (en) * | 2009-05-04 | 2010-11-04 | Samsung Mobile Display Co., Ltd. | Apparatus for depositing organic material and depositing method thereof |
US20110027462A1 (en) * | 2009-08-03 | 2011-02-03 | Chang Hun Hwang | Fast deposition system and method for mass production of large-area thin-film cigs solar cells |
JP2011068980A (ja) * | 2009-05-04 | 2011-04-07 | Samsung Mobile Display Co Ltd | 有機物蒸着装置及び蒸着方法 |
US20120064728A1 (en) * | 2010-09-15 | 2012-03-15 | Jeong-Ho Yi | Substrate depositing system and depositing method using the same |
WO2012081476A1 (ja) * | 2010-12-14 | 2012-06-21 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
WO2012086568A1 (ja) * | 2010-12-24 | 2012-06-28 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
JP2012233242A (ja) * | 2011-05-09 | 2012-11-29 | Hitachi High-Technologies Corp | 有機elデバイス製造装置及び有機elデバイス製造方法 |
JP2013053374A (ja) * | 2008-02-28 | 2013-03-21 | Samsung Display Co Ltd | 蒸着装置及び薄膜製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001003168A (ja) * | 1999-06-18 | 2001-01-09 | Sony Corp | 真空成膜装置 |
US20040035360A1 (en) * | 2002-05-17 | 2004-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing apparatus |
JP4286496B2 (ja) * | 2002-07-04 | 2009-07-01 | 株式会社半導体エネルギー研究所 | 蒸着装置及び薄膜作製方法 |
KR101006938B1 (ko) * | 2002-09-20 | 2011-01-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 제조 시스템 및 발광장치 제작방법 |
KR100926437B1 (ko) * | 2008-11-17 | 2009-11-13 | 에스엔유 프리시젼 주식회사 | 증착 물질 공급 장치 및 이를 구비한 기판 처리 장치 |
KR101097737B1 (ko) * | 2009-03-31 | 2011-12-22 | 에스엔유 프리시젼 주식회사 | 박막 증착 장치와 박막 증착 방법 및 박막 증착 시스템 |
KR101662606B1 (ko) * | 2010-05-11 | 2016-10-05 | 엘지디스플레이 주식회사 | 유기박막 증착장치 및 이를 이용한 유기전계발광소자의 제조방법 |
JP2013167001A (ja) * | 2012-02-16 | 2013-08-29 | Hitachi High-Technologies Corp | 真空蒸着システム及び真空蒸着方法 |
-
2013
- 2013-12-10 EP EP17150278.4A patent/EP3187618A1/en not_active Withdrawn
- 2013-12-10 CN CN201710018205.6A patent/CN106995911B/zh active Active
- 2013-12-10 US US15/100,282 patent/US20170005297A1/en not_active Abandoned
- 2013-12-10 KR KR1020177000782A patent/KR101927925B1/ko active IP Right Grant
- 2013-12-10 WO PCT/EP2013/076120 patent/WO2015086049A1/en active Application Filing
- 2013-12-10 KR KR1020167018445A patent/KR101920333B1/ko active IP Right Grant
- 2013-12-10 EP EP13802641.4A patent/EP3080327A1/en not_active Withdrawn
- 2013-12-10 CN CN201380081500.6A patent/CN105814231B/zh active Active
- 2013-12-10 JP JP2016537004A patent/JP6328766B2/ja active Active
-
2014
- 2014-08-19 WO PCT/EP2014/067673 patent/WO2015086168A1/en active Application Filing
- 2014-08-19 JP JP2016537025A patent/JP6568853B2/ja active Active
- 2014-08-19 US US15/039,397 patent/US20190032194A2/en not_active Abandoned
- 2014-08-19 CN CN201480066877.9A patent/CN106068334B/zh active Active
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- 2014-12-01 TW TW106132201A patent/TWI611497B/zh not_active IP Right Cessation
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002367781A (ja) * | 2001-06-12 | 2002-12-20 | Sony Corp | 成膜装置および成膜方法 |
JP2004100002A (ja) * | 2002-09-11 | 2004-04-02 | Ulvac Japan Ltd | 蒸発源及びこれを用いた薄膜形成装置 |
JP2005015869A (ja) * | 2003-06-27 | 2005-01-20 | Semiconductor Energy Lab Co Ltd | 製造装置 |
JP2006002226A (ja) * | 2004-06-18 | 2006-01-05 | Kyocera Corp | 蒸着装置 |
JP2013053374A (ja) * | 2008-02-28 | 2013-03-21 | Samsung Display Co Ltd | 蒸着装置及び薄膜製造方法 |
JP2009299176A (ja) * | 2008-06-16 | 2009-12-24 | Samsung Mobile Display Co Ltd | 移送装置及びこれを備える有機物蒸着装置 |
US20100279021A1 (en) * | 2009-05-04 | 2010-11-04 | Samsung Mobile Display Co., Ltd. | Apparatus for depositing organic material and depositing method thereof |
JP2011068980A (ja) * | 2009-05-04 | 2011-04-07 | Samsung Mobile Display Co Ltd | 有機物蒸着装置及び蒸着方法 |
US20110027462A1 (en) * | 2009-08-03 | 2011-02-03 | Chang Hun Hwang | Fast deposition system and method for mass production of large-area thin-film cigs solar cells |
US20120064728A1 (en) * | 2010-09-15 | 2012-03-15 | Jeong-Ho Yi | Substrate depositing system and depositing method using the same |
WO2012081476A1 (ja) * | 2010-12-14 | 2012-06-21 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
WO2012086568A1 (ja) * | 2010-12-24 | 2012-06-28 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
JP2012233242A (ja) * | 2011-05-09 | 2012-11-29 | Hitachi High-Technologies Corp | 有機elデバイス製造装置及び有機elデバイス製造方法 |
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EP3187618A1 (en) | 2017-07-05 |
KR20160098333A (ko) | 2016-08-18 |
CN106068334B (zh) | 2018-11-13 |
CN106068334A (zh) | 2016-11-02 |
KR20160098342A (ko) | 2016-08-18 |
US20170005297A1 (en) | 2017-01-05 |
CN106995911A (zh) | 2017-08-01 |
CN106995911B (zh) | 2020-07-31 |
CN105814231B (zh) | 2020-03-06 |
TW201802994A (zh) | 2018-01-16 |
KR101920333B1 (ko) | 2018-11-20 |
JP2017500447A (ja) | 2017-01-05 |
KR20170007545A (ko) | 2017-01-18 |
WO2015086168A1 (en) | 2015-06-18 |
US20170022601A1 (en) | 2017-01-26 |
TW201528411A (zh) | 2015-07-16 |
CN105814231A (zh) | 2016-07-27 |
WO2015086049A1 (en) | 2015-06-18 |
TWI611497B (zh) | 2018-01-11 |
KR101927925B1 (ko) | 2018-12-11 |
JP6328766B2 (ja) | 2018-05-23 |
KR101903139B1 (ko) | 2018-10-01 |
TWI604553B (zh) | 2017-11-01 |
WO2015086168A8 (en) | 2016-06-09 |
US20190032194A2 (en) | 2019-01-31 |
JP6568853B2 (ja) | 2019-08-28 |
EP3080327A1 (en) | 2016-10-19 |
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