JP2017208382A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Abstract
Description
実施の形態の説明に先立って、本発明の前提技術について説明する。図1は、本発明の前提技術となるIPM70の構成を示す分解図であり、コアブロック30および制御基板32の構成を模式的に示す断面図である。なお、コアブロックとは、パワーデバイスなどを含む半導体装置と、当該半導体装置を収容するケース等で構成されるモジュールの総称である。
図8は、本発明に係る実施の形態1のコアブロック100の構成を示す断面図である。なお、図8においては、図2を用いて説明したIPM70と同一の構成については同一の符号を付し、重複する説明は省略する。
図12は、本発明に係る実施の形態2のコアブロック100Aの構成を示す断面図である。なお、図12においては、図2を用いて説明したIPM70と同一の構成については同一の符号を付し、重複する説明は省略する。
以上説明した実施の形態1および実施の形態2においては、IGBTモジュールまたはMOSトランジスタモジュールは、外部接続用端子を用いて駆動電力および信号の入出力を行う構成を示したが、中継用端子を用いて駆動電力および信号の入出力を行う構成とすることもできる。
図19は、コアブロック100Aを使用してIGBTモジュールまたはMOSトランジスタモジュールを構成する場合において、ケース36内に樹脂材を充填して、絶縁基板42および絶縁基板42に搭載されたパワーデバイス46等を樹脂RSで封止した構成を開示している。
図21は、コアブロック100Aを使用してIGBTモジュールまたはMOSトランジスタモジュールを構成する場合において、ケース36内に樹脂材を充填すると共に、ケース36の開口部を蓋CV1で覆った構成を開示している。
Claims (11)
- パワーデバイスと、
前記パワーデバイスの物理状態を測定し、前記物理状態に応じた信号を発信するセンサと、
前記パワーデバイスの主電流が流れる主電極端子と、
前記センサに接続され前記センサからの信号を受けるセンサ用信号端子と、
前記パワーデバイスを駆動する駆動電力を受ける駆動用端子と、
前記パワーデバイス、前記センサ、前記主電極端子、前記センサ用信号端子および前記駆動用端子を収容する有底無蓋のケースと、を備え、
前記センサ用信号端子および前記駆動用端子は、
前記ケースの内側壁面から離れて設けられた第1の端子および第2の端子を有し、前記第1および第2の端子は、電気的に導通して2重構造をなす半導体装置。 - 前記第1の端子は、
先端部が前記ケースの上面から外部に突出する長さを有し、外部との間で前記信号および前記駆動電力の入出力を行い、
前記第2の端子は、
先端部が前記ケースの上面から外部に突出しない長さを有する、請求項1記載の半導体装置。 - 前記半導体装置は、
前記ケース内の前記パワーデバイスの上方に配置され、前記パワーデバイスの駆動を制御する制御基板をさらに備え、
前記第1および第2の端子は、
先端部が前記ケースの上面から外部に突出しない長さを有し、
前記第2の端子は、先端部が前記制御基板に接続される長さを有し、前記制御基板との間で前記信号および前記駆動電力の入出力を行う、請求項1記載の半導体装置。 - パワーデバイスと、
前記パワーデバイスの物理状態を測定し、前記物理状態に応じた信号を発信するセンサと、
前記パワーデバイスの主電流が流れる主電極端子と、
前記センサに接続されるセンサ用信号端子と、
前記パワーデバイスを駆動するための駆動電力を受ける駆動用端子と、
前記パワーデバイス、前記センサ、前記主電極端子、前記センサ用信号端子および前記駆動用端子を収容する有底無蓋のケースと、を備え、
前記センサ用信号端子および前記駆動用端子は、
前記ケースの内側壁面から離れて設けられ、先端部が前記ケースの上面から外部に突出する長さの第1の端子または、先端部が前記ケースの上面から外部に突出しない長さの第2の端子を有し、
前記第1および第2の端子は、前記ケース内に設けられた端子係合部に取り付けられる半導体装置。 - 前記第1の端子が前記端子係合部に取り付けられ、
外部との間で前記信号および前記駆動電力の入出力を行う、請求項4記載の半導体装置。 - 前記半導体装置は、
前記ケース内の前記パワーデバイスの上方に配置され、前記パワーデバイスの駆動を制御する制御基板をさらに備え、
前記第2の端子が前記端子係合部に取り付けられ、
前記第2の端子は、先端部が前記制御基板に接続される長さを有し、前記制御基板との間で前記信号および前記駆動電力の入出力を行う、請求項4記載の半導体装置。 - 前記半導体装置は、
前記ケース内の前記パワーデバイスの上方に配置され、先端部が前記ケースの上面から外部に突出する長さの外部入出力用端子と、前記外部入出力用端子に続続された配線パターンとを有した内部配線基板をさらに備え、
前記第2の端子が前記端子係合部に取り付けられ、
前記第2の端子は、先端部が前記内部配線基板に接続される長さを有し、前記配線パターンおよび前記外部入出力用端子を介して、外部との間で前記信号および前記駆動電力の入出力を行う、請求項4記載の半導体装置。 - 前記ケース内は、樹脂で充填される、請求項1または請求項4記載の半導体装置。
- 前記ケース内は、樹脂で充填され、
前記ケースの上面を覆うように設けられた蓋をさらに備え、
前記第1の端子は、前記蓋を貫通して前記蓋の上面から外部に突出する、請求項2または請求項5記載の半導体装置。 - 前記制御基板は、
先端部が前記ケースの上面から外部に突出する長さの外部入出力用端子を有し、
前記ケース内は、樹脂で充填され、
前記ケースの上面を覆うように設けられた蓋をさらに備え、
前記外部入出力用端子は、前記蓋を貫通して前記蓋の上面から外部に突出する、請求項3または請求項6記載の半導体装置。 - 前記ケース内は、樹脂で充填され、
前記ケースの上面を覆うように設けられた蓋をさらに備え、
前記主電極端子は、先端部が前記ケースの上面から外部に突出する長さを有し、
前記蓋は、制御端子および電極端子を内蔵し、
前記制御端子の一方端に前記第1の端子を接続し、前記制御端子の他方端は前記蓋の上面から外部に突出し、
前記電極端子の一方端に前記主電極端子を接続し、前記電極端子の他方端は前記蓋の上面から外部に突出し、
前記主電極端子および前記第1の端子は、プレスフィット端子を含む、請求項2または請求項5記載の半導体装置。
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