JP2017092411A5 - - Google Patents

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Publication number
JP2017092411A5
JP2017092411A5 JP2015224688A JP2015224688A JP2017092411A5 JP 2017092411 A5 JP2017092411 A5 JP 2017092411A5 JP 2015224688 A JP2015224688 A JP 2015224688A JP 2015224688 A JP2015224688 A JP 2015224688A JP 2017092411 A5 JP2017092411 A5 JP 2017092411A5
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JP
Japan
Prior art keywords
resist
seed layer
dry film
opening pattern
layer
Prior art date
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Application number
JP2015224688A
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English (en)
Japanese (ja)
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JP2017092411A (ja
JP6534602B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2015224688A priority Critical patent/JP6534602B2/ja
Priority claimed from JP2015224688A external-priority patent/JP6534602B2/ja
Priority to US15/298,487 priority patent/US9711461B2/en
Publication of JP2017092411A publication Critical patent/JP2017092411A/ja
Publication of JP2017092411A5 publication Critical patent/JP2017092411A5/ja
Application granted granted Critical
Publication of JP6534602B2 publication Critical patent/JP6534602B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015224688A 2015-11-17 2015-11-17 配線基板、半導体装置及び配線基板の製造方法 Active JP6534602B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015224688A JP6534602B2 (ja) 2015-11-17 2015-11-17 配線基板、半導体装置及び配線基板の製造方法
US15/298,487 US9711461B2 (en) 2015-11-17 2016-10-20 Wiring substrate and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015224688A JP6534602B2 (ja) 2015-11-17 2015-11-17 配線基板、半導体装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2017092411A JP2017092411A (ja) 2017-05-25
JP2017092411A5 true JP2017092411A5 (enExample) 2018-10-18
JP6534602B2 JP6534602B2 (ja) 2019-06-26

Family

ID=58691303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015224688A Active JP6534602B2 (ja) 2015-11-17 2015-11-17 配線基板、半導体装置及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9711461B2 (enExample)
JP (1) JP6534602B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6611756B2 (ja) * 2017-05-08 2019-11-27 株式会社三洋物産 遊技機
JP2019054172A (ja) * 2017-09-15 2019-04-04 東芝メモリ株式会社 半導体装置
JP7396789B2 (ja) 2018-08-10 2023-12-12 日東電工株式会社 配線回路基板、その製造方法および配線回路基板集合体シート
KR102679250B1 (ko) * 2018-09-12 2024-06-28 엘지이노텍 주식회사 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
JP2022096004A (ja) * 2019-04-26 2022-06-29 株式会社アクセス プリント配線基板の製造方法及びプリント配線基板
JP2021068792A (ja) * 2019-10-23 2021-04-30 イビデン株式会社 プリント配線板、及び、プリント配線板の製造方法
KR102818699B1 (ko) * 2020-01-29 2025-06-09 삼성전자주식회사 반도체 패키지 제조용 프레임 지그, 프레임 지그를 포함하는 반도체 패키지 제조 장치, 및 프레임 지그를 이용한 반도체 패키지 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174586A (ja) * 1990-11-07 1992-06-22 Nec Corp 印刷配線板
JP2005252155A (ja) 2004-03-08 2005-09-15 Ibiden Co Ltd 構造体、構造体の製造方法、及び、プリント配線板、プリント配線板の製造方法
TW200850083A (en) * 2007-03-22 2008-12-16 Ngk Spark Plug Co Method of manufacturing multilayer wiring board
JP2009194321A (ja) * 2008-02-18 2009-08-27 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、半導体パッケージ
JP2013080836A (ja) * 2011-10-04 2013-05-02 Ibiden Co Ltd プリント配線板の製造方法
JP2015072983A (ja) * 2013-10-02 2015-04-16 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ

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